公开(公告)号：US20140011040A1

公开(公告)日：2014-01-09

申请号：US14019041

申请日：2013-09-05

Applicant: Valspar Sourcing, Inc.

Inventor： Owen H. Decker ,  Thomas E. Reno ,  Robert D. Breitzman ,  Carlos A. Concha ,  Jeffrey D. Rogozinski

IPC: C09D5/03

CPC classification number: C09D5/03 ,  C23C24/10 ,  C23C30/00 ,  Y10T428/31678

Abstract: Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.

Abstract translation: 提供用于涂覆金属基底的方法和系统。 方法和系统包括顺序应用低流量和高流动粉末涂层，随后进行单次加热步骤以提供固化涂层。 方法和系统包括允许在施用期间监测和评估涂层均匀性的标记。 所描述的方法提供具有最佳表面平滑度和边缘覆盖率的涂层。

公开(公告)号：US09751107B2

公开(公告)日：2017-09-05

申请号：US14522143

申请日：2014-10-23

Applicant: Valspar Sourcing, Inc.

Inventor： Owen H. Decker ,  Thomas E. Reno ,  Robert D. Breitzman ,  Carlos A Concha ,  Jeffrey D. Rogozinski ,  Keith M. Kirkwood

IPC: B05D1/38 ,  B05D7/00 ,  B05D1/12 ,  B05D1/36 ,  B05D3/12 ,  B05D3/10 ,  B05D3/00 ,  B05D3/02 ,  B05D7/14 ,  C09D163/00 ,  C08K3/22 ,  C08K5/32 ,  C08K5/3445 ,  C08K5/29 ,  C09D5/03 ,  C23C24/00 ,  C23C26/00 ,  C23C28/00

CPC classification number: B05D7/542 ,  B05D1/06 ,  B05D1/12 ,  B05D1/36 ,  B05D3/002 ,  B05D3/0218 ,  B05D3/0254 ,  B05D3/102 ,  B05D3/12 ,  B05D7/14 ,  B05D2202/10 ,  B05D2451/00 ,  C08K3/22 ,  C08K5/29 ,  C08K5/32 ,  C08K5/3445 ,  C08K2003/2241 ,  C09D5/03 ,  C09D5/035 ,  C09D163/00 ,  C23C24/00 ,  C23C26/00 ,  C23C28/00 ,  Y10T428/31529 ,  B05D2401/32

Abstract: Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.

公开(公告)号：US11098202B2

公开(公告)日：2021-08-24

申请号：US14019041

申请日：2013-09-05

Applicant: Valspar Sourcing, Inc.

Inventor： Owen H. Decker ,  Thomas E. Reno ,  Robert D. Breitzman ,  Carlos A. Concha ,  Jeffrey D. Rogozinski

IPC: B05D1/12 ,  B05D3/02 ,  C09D5/03 ,  C23C24/10 ,  C23C30/00

Abstract: Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.

公开(公告)号：US20170333944A1

公开(公告)日：2017-11-23

申请号：US15664511

申请日：2017-07-31

Applicant: Valspar Sourcing, Inc.

Inventor： Owen H. Decker ,  Thomas E. Reno ,  Robert D. Breitzman ,  Carlos A Concha ,  Jeffrey D. Rogozinski ,  Keith M. Kirkwood

IPC: B05D7/00 ,  C23C26/00 ,  B05D1/12 ,  C23C24/00 ,  C09D163/00 ,  C09D5/03 ,  C08K5/3445 ,  C08K5/32 ,  C08K5/29 ,  C08K3/22 ,  B05D7/14 ,  B05D3/12 ,  B05D3/10 ,  B05D3/02 ,  B05D3/00 ,  B05D1/36 ,  C23C28/00

CPC classification number: B05D7/542 ,  B05D1/06 ,  B05D1/12 ,  B05D1/36 ,  B05D3/002 ,  B05D3/0218 ,  B05D3/0254 ,  B05D3/102 ,  B05D3/12 ,  B05D7/14 ,  B05D2202/10 ,  B05D2451/00 ,  C08K3/22 ,  C08K5/29 ,  C08K5/32 ,  C08K5/3445 ,  C08K2003/2241 ,  C09D5/03 ,  C09D5/035 ,  C09D163/00 ,  C23C24/00 ,  C23C26/00 ,  C23C28/00 ,  Y10T428/31529 ,  B05D2401/32

Abstract: Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.

公开(公告)号：US20150044476A1

公开(公告)日：2015-02-12

申请号：US14522143

申请日：2014-10-23

Applicant: VALSPAR SOURCING, INC.

Inventor： Owen H. Decker ,  Thomas E. Reno ,  Robert D. Breitzman ,  Carlos A Concha ,  Jeffrey D. Rogozinski ,  Keith M. Kirkwood

IPC: B05D7/00 ,  B05D1/36 ,  B05D3/12 ,  B05D3/10 ,  B05D3/00 ,  C09D5/03 ,  B05D7/14 ,  C09D163/00 ,  C08K3/22 ,  C08K5/32 ,  C08K5/3445 ,  C08K5/29 ,  B05D1/12 ,  B05D3/02

CPC classification number: B05D7/542 ,  B05D1/06 ,  B05D1/12 ,  B05D1/36 ,  B05D3/002 ,  B05D3/0218 ,  B05D3/0254 ,  B05D3/102 ,  B05D3/12 ,  B05D7/14 ,  B05D2202/10 ,  B05D2451/00 ,  C08K3/22 ,  C08K5/29 ,  C08K5/32 ,  C08K5/3445 ,  C08K2003/2241 ,  C09D5/03 ,  C09D5/035 ,  C09D163/00 ,  C23C24/00 ,  C23C26/00 ,  C23C28/00 ,  Y10T428/31529 ,  B05D2401/32

Abstract: Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.

Abstract translation: 提供用于涂覆金属基底的方法和系统。 方法和系统包括顺序应用低流量和高流动粉末涂层，随后进行单次加热步骤以提供固化涂层。 方法和系统包括允许在施用期间监测和评估涂层均匀性的标记。 所描述的方法提供具有最佳表面平滑度和边缘覆盖率的涂层。