-
公开(公告)号:USD860146S1
公开(公告)日:2019-09-17
申请号:US29627938
申请日:2017-11-30
-
公开(公告)号:USD854506S1
公开(公告)日:2019-07-23
申请号:US29641933
申请日:2018-03-26
-
公开(公告)号:USD806046S1
公开(公告)日:2017-12-26
申请号:US29587929
申请日:2016-12-16
CPC分类号: H01L21/68771 , C23C16/4584 , H01L21/68721 , H01L21/68764
摘要: A wafer carrier including thirty-five pockets arranged on a top surface, configured to be used with a chemical vapor deposition device, is provided. The wafer carrier comprises: a body having a top surface and a bottom surface arranged opposite one another, and a plurality of pockets defined in the top surface of the wafer carrier, wherein the plurality of pockets consist of a total of thirty-five pockets, each of the pockets is arranged along one of three circles, and the three circles are concentric with one another and with a circular outline formed by a perimeter of the top surface.
-
公开(公告)号:US20170121847A1
公开(公告)日:2017-05-04
申请号:US15403709
申请日:2017-01-11
发明人: Eric Armour , Sandeep Krishnan , Alex Zhang , Bojan Mitrovic , Alexander Gurary
IPC分类号: C30B25/12 , C23C16/46 , C23C16/458 , C30B25/10
CPC分类号: C30B25/12 , C23C16/4584 , C23C16/4586 , C23C16/46 , C30B25/105 , Y10T29/49826
摘要: A wafer carrier assembly for use in a system for growing epitaxial layers on one or more wafers by chemical vapor deposition (CVD), the wafer carrier assembly includes a wafer carrier body formed symmetrically about a central axis, and including a generally planar top surface that is situated perpendicularly to the central axis and a planar bottom surface that is parallel to the top surface. At least one wafer retention pocket is recessed in the wafer carrier body from the top surface. Each of the at least one wafer retention pocket includes a floor surface and a peripheral wall surface that surrounds the floor surface and defines a periphery of that wafer retention pocket. At least one thermal control feature includes an interior cavity or void formed in the wafer carrier body and is defined by interior surfaces of the wafer carrier body.
-
公开(公告)号:US20220068700A1
公开(公告)日:2022-03-03
申请号:US17458768
申请日:2021-08-27
IPC分类号: H01L21/687 , C23C16/458 , C30B25/12
摘要: A substrate reactor with centering pin for epitaxial deposition includes a vacuum chamber and a tube configured to rotate in the vacuum chamber around a tube geometrical center axis. A substrate carrier forming a pocket dimensioned for holding a substrate on a top surface includes an aperture that is centrally located on a bottom surface. The substrate carrier is positioned on and in contact with a top surface of the tube. A centering pin is positioned along a geometrical center axis of rotation of the substrate carrier. The centering pin has a first end positioned in the aperture on the bottom surface of the substrate carrier and a second end fixed inside the reactor so that the substrate carrier rotates around the geometrical center axis of the substrate carrier independent of the geometrical center axis of the tube.
-
公开(公告)号:US20170076972A1
公开(公告)日:2017-03-16
申请号:US15266308
申请日:2016-09-15
发明人: Sandeep Krishnan , Lukas Urban , Alexander Gurary , Keng Moy , Ajit Paranjpe
IPC分类号: H01L21/687
CPC分类号: H01L21/68771 , H01L21/68757 , H01L21/68764 , H01L21/68785 , H01L21/68792
摘要: A wafer carrier for a plurality of wafers, the wafer carrier having a platen with a plurality of openings and a plurality of wafer retention platforms, the platen configured to rotate about a first axis, the plurality of wafer retention platforms configured to rotate about respective second axes, each of the wafer retention platforms rotatably coupled to one of the plurality of openings by friction reducing bearings, the platen and the plurality of wafer retention platforms and the friction reducing bearings all being constructed of the same material.
摘要翻译: 用于多个晶片的晶片载体,所述晶片载体具有带有多个开口的压板和多个晶片保持平台,所述压板被配置为围绕第一轴线旋转,所述多个晶片保持平台被配置为围绕相应的第二 每个晶片保持平台通过摩擦减小轴承可旋转地联接到多个开口中的一个开口,压板和多个晶片保持平台和减摩轴承全部由相同的材料构成。
-
公开(公告)号:USD778247S1
公开(公告)日:2017-02-07
申请号:US29524104
申请日:2015-04-16
CPC分类号: H01L21/68771 , C23C16/4584 , H01L21/68721 , H01L21/68764
摘要: A wafer carrier including thirty-five pockets arranged on a top surface, configured to be used with a chemical vapor deposition device, is provided. The wafer carrier comprises: a body having a top surface and a bottom surface arranged opposite one another, and a plurality of pockets defined in the top surface of the wafer carrier, wherein the plurality of pockets consist of a total of thirty-five pockets, each of the pockets is arranged along one of three circles, and the three circles are concentric with one another and with a circular outline formed by a perimeter of the top surface.
摘要翻译: 提供了一种晶片载体,其包括配置成与化学气相沉积装置一起使用的顶表面上的三十五个凹穴。 晶片载体包括:主体,其具有彼此相对布置的顶表面和底表面,以及限定在晶片载体的顶表面中的多个凹穴,其中多个凹穴由总共三十五个凹穴组成, 每个凹穴沿着三个圆圈中的一个布置,并且三个圆圈彼此同心并具有由顶部表面的周边形成的圆形轮廓。
-
公开(公告)号:US20240175133A1
公开(公告)日:2024-05-30
申请号:US18519548
申请日:2023-11-27
IPC分类号: C23C16/458 , C23C16/455 , C30B25/10 , C30B25/12 , C30B25/14
CPC分类号: C23C16/4584 , C23C16/45502 , C23C16/45565 , C23C16/4586 , C30B25/10 , C30B25/12 , C30B25/14
摘要: A multi-wafer metal organic chemical vapor deposition system in which adjacent wafers positioned within the system rotate about their own axes, including a reaction chamber comprising an exhaust system including a peripheral port, a multi-wafer carrier comprising a wafer carrier body and a plurality of wafer carrier discs supported within the wafer carrier body, wherein adjacent wafer carrier discs of the plurality wafer carrier discs are configured and the wafer carrier body are configured to rotate at different speeds, a multi-zone injection block positioned over the wafer carrier body, a central gas port positioned in the center of the wafer carrier body that can be configured as a gas exhaust or a gas injection port, and a multi-zone heater assembly positioned beneath the multi-wafer carrier.
-
公开(公告)号:USD866491S1
公开(公告)日:2019-11-12
申请号:US29641924
申请日:2018-03-26
-
公开(公告)号:US20190295880A1
公开(公告)日:2019-09-26
申请号:US15936023
申请日:2018-03-26
IPC分类号: H01L21/687 , C23C16/458
摘要: A wafer carrier as described and claimed herein includes a thermal cover and a plurality of platforms with corresponding radially inner and outer pedestals.
-
-
-
-
-
-
-
-
-