公开(公告)号：US09437549B2

公开(公告)日：2016-09-06

申请号：US14808656

申请日：2015-07-24

Applicant: VIKING TECH CORPORATION

Inventor： Chien-Hung Ho ,  Chen-Shen Kuo ,  Chun-Chu Wu

IPC: H01L23/538 ,  H01L23/498 ,  H01L31/0203 ,  H01L21/48 ,  B28B11/08 ,  B23K26/38 ,  B24C1/04 ,  B23K26/40 ,  H01L33/64 ,  H01L23/24

CPC classification number: H01L23/5389 ,  B23K26/364 ,  B23K26/38 ,  B23K26/402 ,  B23K2103/52 ,  B24C1/04 ,  B28B11/0863 ,  H01L21/4846 ,  H01L23/24 ,  H01L23/49838 ,  H01L23/49894 ,  H01L31/0203 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate.

Abstract translation: 陶瓷基板的制造方法的特征在于，使用预成形的沟槽，图案化保护层和喷砂工序来制造陶瓷基板中的空腔并控制陶瓷基板的型腔尺寸和形状。 陶瓷基板与基底基板共同构成用于封装半导体芯片的封装基板。 上述制造方法可以降低制造成本并提高陶瓷基板的空腔的尺寸和形状的精度。 上述方法可以降低制造成本并提高陶瓷基板的形状和尺寸的精度。