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    Contaminant reducing substrate transport and support system
    1.
    发明申请
    Contaminant reducing substrate transport and support system 审中-公开
    污染物还原底物运输和支持系统

    公开(公告)号：US20050252454A1

    公开(公告)日：2005-11-17

    申请号：US11065702

    申请日：2005-02-23

    申请人： Vijay Parkhe ,  Matthew Leopold ,  Timothy Ronan ,  Todd Martin ,  Edward Ng ,  Nitin Khurana ,  Song-Moon Suh ,  Richard Fay ,  Christopher Hagerty ,  Michael Rice ,  Darryl Angelo ,  Kurt Ahman ,  Matthew Tsai ,  Steve Sansoni

    发明人： Vijay Parkhe ,  Matthew Leopold ,  Timothy Ronan ,  Todd Martin ,  Edward Ng ,  Nitin Khurana ,  Song-Moon Suh ,  Richard Fay ,  Christopher Hagerty ,  Michael Rice ,  Darryl Angelo ,  Kurt Ahman ,  Matthew Tsai ,  Steve Sansoni

    IPC分类号： H01L21/683 ,  H01L21/687 ,  C23C16/00

    CPC分类号： C23C16/463 ,  H01L21/6831 ,  H01L21/6875 ,  H01L21/68757 ,  Y10T279/23

    摘要： A lifting assembly can lift a substrate from a substrate support and transport the substrate. The lift assembly has a hoop sized to fit about a periphery of the substrate support, and a pair of arcuate fins mounted on the hoop, each arcuate fin comprising a pair of opposing ends having ledges that extend radially inward, each ledge having a raised protrusion to lift a substrate so that the substrate contacts substantially only the raised protrusion, thereby minimizing contact with the ledge, when the pair of fins is used to lift the substrate off the substrate support. The lifting assembly and other process chamber components can have a diamond-like coating having interlinked networks of (i) carbon and hydrogen, and (ii) silicon and oxygen. The diamond-like coating has a contact surface having a coefficient of friction of less than about 0.3, a hardness of at least about 8 GPa, and a metal concentration level of less than about 5×1012 atoms/cm2 of metal. The contact surface reduces contamination of a substrate when directly or indirectly contacting a substrate.

    摘要翻译： 提升组件可以从衬底支撑件提起衬底并输送衬底。 提升组件具有适合围绕基板支撑件的周边的环形尺寸，以及安装在环上的一对弓形翅片，每个弓形翅片包括一对相对的端部，其具有径向向内延伸的凸缘，每个凸缘具有凸起突起 以提升衬底，使得衬底基本上仅接触凸起突起，从而当使用一对翅片将衬底从衬底支撑件提起时，使与凸缘的接触最小化。 提升组件和其它处理室组件可以具有类似金刚石的涂层，其具有（i）碳和氢的互连网络，和（ii）硅和氧。 类金刚石涂层具有摩擦系数小于约0.3，硬度至少约8GPa，金属浓度小于约5×10 12原子/ cm的接触表面 金属的<2> 2。 当直接或间接接触基底时，接触表面减少了基底的污染。

    Method and apparatus for sputter etch conditioning a ceramic body
    2.
    发明授权
    Method and apparatus for sputter etch conditioning a ceramic body 失效
    用于溅射蚀刻调节陶瓷体的方法和装置

    公开(公告)号：US06395157B2

    公开(公告)日：2002-05-28

    申请号：US09159009

    申请日：1998-09-23

    申请人： Nitin Khurana ,  Vince Burkhart ,  Steve Sansoni ,  Vijay Parkhe ,  Eugene Tzou

    发明人： Nitin Khurana ,  Vince Burkhart ,  Steve Sansoni ,  Vijay Parkhe ,  Eugene Tzou

    IPC分类号： C23C1434

    CPC分类号： H01J37/32862 ,  H01J37/32082 ,  H01J37/34

    摘要： A method and apparatus for conditioning a surface of a ceramic body in a process chamber when the process chamber has a vacuum pump, an anode and a cathode. The conditioning method consists of pumping the process chamber down to a vacuum with the vacuum pump, introducing a gas into the chamber, energizing the anode and cathode with RF power to ignite the gas into a plasma, sputter etchinq the surface with ions from the plasma to remove contaminants therefrom. The method is accomplished either within a process chamber to condition, in situ, a ceramic chuck or within a cleaning chamber to condition any form of ceramic body or component.

    摘要翻译： 一种用于在处理室具有真空泵，阳极和阴极时调节处理室中陶瓷体表面的方法和装置。 调节方法包括将真空泵泵送到真空，将气体引入室内，用RF功率激励阳极和阴极，将气体点燃到等离子体中，用等离子体离子溅射刻蚀表面 去除污染物。 该方法可以在处理室内完成，以便现场处理陶瓷卡盘或在清洁室内调节任何形式的陶瓷体或部件。

    Coating for reducing contamination of substrates during processing
    4.
    发明申请
    Coating for reducing contamination of substrates during processing 有权
    用于减少加工过程中底物污染的涂层

    公开(公告)号：US20050183669A1

    公开(公告)日：2005-08-25

    申请号：US10786876

    申请日：2004-02-24

    申请人： Vijay Parkhe ,  Kurt Ahmann ,  Matthew Tsai ,  Steve Sansoni

    发明人： Vijay Parkhe ,  Kurt Ahmann ,  Matthew Tsai ,  Steve Sansoni

    IPC分类号： H01L21/683 ,  H01L21/687 ,  C23C16/00

    CPC分类号： C23C16/463 ,  H01L21/6831 ,  H01L21/6875 ,  H01L21/68757 ,  Y10T279/23

    摘要： A substrate support has a support structure and a coating on the support structure having a carbon-hydrogen network. The coating has a contact surface having a coefficient of friction of less than about 0.3 and a hardness of at least about 8 GPa. The contact surface of the coating is capable of reducing abrasion and contamination of a substrate that contacts the contact surface. In one version, the support structure has a dielectric covering an electrode. A plurality of mesas on the dielectric have a coating with the contact surface thereon.

    摘要翻译： 衬底支撑件具有支撑结构，并且在具有碳 - 氢网络的支撑结构上具有涂层。 涂层具有摩擦系数小于约0.3，硬度至少约8GPa的接触表面。 涂层的接触表面能够减少与接触表面接触的基底的磨损和污染。 在一个版本中，支撑结构具有覆盖电极的电介质。 电介质上的多个台面具有其上具有接触表面的涂层。

    Detachable electrostatic chuck for supporting a substrate in a process chamber
    5.
    发明授权
    Detachable electrostatic chuck for supporting a substrate in a process chamber 有权
    用于在处理室中支撑基板的可拆卸静电卡盘

    公开(公告)号：US07480129B2

    公开(公告)日：2009-01-20

    申请号：US11221169

    申请日：2005-09-07

    申请人： Karl Brown ,  Semyon Sherstinsky ,  Wei W. Wang ,  Cheng-Hsiung Tsai ,  Vineet Mehta ,  Allen Lau ,  Steve Sansoni

    发明人： Karl Brown ,  Semyon Sherstinsky ,  Wei W. Wang ,  Cheng-Hsiung Tsai ,  Vineet Mehta ,  Allen Lau ,  Steve Sansoni

    IPC分类号： H01L21/683

    CPC分类号： H01L21/6831 ,  Y10T279/23

    摘要： A detachable electrostatic chuck can be attached to a pedestal in a process chamber. The electrostatic chuck has an electrostatic puck comprising a dielectric covering at least one electrode and a frontside surface to receive a substrate. A backside surface of the chuck has a central protrusion that can be a D-shaped mesa to facilitate alignment with a mating cavity in the pedestal. The protrusion can also have asymmetrically offset apertures, which further assist alignment, and also serve to receive electrode terminal posts and a gas tube. A heat transfer plate having an embedded heat transfer fluid channel is spring loaded on the pedestal to press against the chuck for good heat transfer.

    摘要翻译： 可拆卸的静电卡盘可以附接到处理室中的基座。 静电吸盘具有包括覆盖至少一个电极和前侧表面的电介质的静电压盘，用于接收衬底。 卡盘的背面具有可以是D形台面的中心突起，以便于与基座中的配合腔体对准。 突起还可以具有不对称偏移的孔，其进一步辅助对准，并且还用于接收电极端子柱和气体管。 具有嵌入式传热流体通道的传热板弹簧加载在基座上以压靠卡盘以获得良好的热传递。

    Apparatus for enabling concentricity of plasma dark space
    6.
    发明授权
    Apparatus for enabling concentricity of plasma dark space 有权
    用于实现等离子体暗室的同心度的装置

    公开(公告)号：US08702918B2

    公开(公告)日：2014-04-22

    申请号：US13327689

    申请日：2011-12-15

    申请人： Alan Ritchie ,  Donny Young ,  Keith A. Miller ,  Muhammad Rasheed ,  Steve Sansoni ,  Uday Pai

    发明人： Alan Ritchie ,  Donny Young ,  Keith A. Miller ,  Muhammad Rasheed ,  Steve Sansoni ,  Uday Pai

    IPC分类号： C23C14/56

    CPC分类号： C23C14/34 ,  H01J37/3417 ,  H01J37/3423 ,  H01J37/3435 ,  H01J37/3441

    摘要： In some embodiments, substrate processing apparatus may include a chamber body; a lid disposed atop the chamber body; a target assembly coupled to the lid, the target assembly including a target of material to be deposited on a substrate; an annular dark space shield having an inner wall disposed about an outer edge of the target; a seal ring disposed adjacent to an outer edge of the dark space shield; and a support member coupled to the lid proximate an outer end of the support member and extending radially inward such that the support member supports the seal ring and the annular dark space shield, wherein the support member provides sufficient compression when coupled to the lid such that a seal is formed between the support member and the seal ring and the seal ring and the target assembly.

    摘要翻译： 在一些实施例中，衬底处理装置可以包括腔体; 设置在所述室主体顶部的盖子; 耦合到所述盖的目标组件，所述目标组件包括待沉积在衬底上的材料的靶; 环形暗空间屏蔽，其具有围绕靶的外边缘设置的内壁; 邻近所述暗室屏蔽的外边缘设置的密封环; 以及支撑构件，其紧邻所述支撑构件的外端并且径向向内延伸，使得所述支撑构件支撑所述密封环和所述环形暗空间屏蔽，其中所述支撑构件在联接到所述盖时提供足够的压缩，使得 在支撑构件和密封环以及密封环和目标组件之间形成密封件。