公开(公告)号：US09969022B2

公开(公告)日：2018-05-15

申请号：US12892219

申请日：2010-09-28

申请人： Vijay D. Parkhe

发明人： Vijay D. Parkhe

IPC分类号： B23K1/00 ,  B23K1/19 ,  B23K101/20 ,  B23K103/18 ,  F16B5/08 ,  B23K103/10 ,  B23K103/12 ,  B23K103/00 ,  B23K103/04

CPC分类号： B23K1/0008 ,  B23K1/19 ,  B23K2101/20 ,  B23K2103/05 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/52 ,  F16B5/08 ,  Y10T403/479

摘要： A vacuum process chamber component comprising two separate pieces with an o-ring between the pieces and solder bonded together is described. The component may be an electrostatic chuck comprising a ceramic electrostatic puck and a metal baseplate with at least one o-ring therebetween and joined by a solder bond is described. Methods of making and using vacuum process chamber component are also described.

公开(公告)号：US20150155193A1

公开(公告)日：2015-06-04

申请号：US14094601

申请日：2013-12-02

申请人： Chih-Hsun Hsu ,  Tza-Jing Gung ,  Benjamin Schwarz ,  Shahid Rauf ,  Ankur Agarwal ,  Vijay D. Parkhe ,  Michael D. Willwerth ,  Zhiqiang Guo

发明人： Chih-Hsun Hsu ,  Tza-Jing Gung ,  Benjamin Schwarz ,  Shahid Rauf ,  Ankur Agarwal ,  Vijay D. Parkhe ,  Michael D. Willwerth ,  Zhiqiang Guo

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6833 ,  H01J37/3266 ,  H01J37/32715

摘要： Electrostatic chucks with variable pixelated magnetic field are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A plurality of electromagnets is disposed in the base, the plurality of electromagnets configured to provide pixelated magnetic field tuning capability for the ESC.

摘要翻译： 描述了具有可变像素化磁场的静电卡盘。 例如，静电卡盘（ESC）包括具有前表面和后表面的陶瓷板，前表面用于支撑晶片或基板。 基座耦合到陶瓷板的背面。 多个电磁铁设置在基座中，多个电磁铁构造成为ESC提供像素化的磁场调谐能力。

公开(公告)号：US08320099B2

公开(公告)日：2012-11-27

申请号：US13297203

申请日：2011-11-15

申请人： Robert T. Hirahara ,  Vijay D. Parkhe

发明人： Robert T. Hirahara ,  Vijay D. Parkhe

IPC分类号： H01L21/683 ,  H01T23/00

CPC分类号： H01L21/6875 ,  H01L21/6831 ,  Y10T29/49002 ,  Y10T279/23

摘要： The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.

摘要翻译： 本发明包括用于修复包含在静电卡盘内的双极电极之间的电连接的方法和装置以及设置在静电卡盘上方的导电掩模，称为平衡电路。 在移除用于翻新的静电卡盘之后，本发明的实施例是特别有用的。

公开(公告)号：US08064185B2

公开(公告)日：2011-11-22

申请号：US12205428

申请日：2008-09-05

申请人： Robert T. Hirahara ,  Vijay D. Parkhe

发明人： Robert T. Hirahara ,  Vijay D. Parkhe

IPC分类号： H01L21/683 ,  H01T23/00

CPC分类号： H01L21/6875 ,  H01L21/6831 ,  Y10T29/49002 ,  Y10T279/23

摘要： The present invention includes methods and apparatus for repairing an electrical connection between bipolar electrodes contained within an electrostatic chuck and a conductive mask disposed atop the electrostatic chuck, known as a balancing circuit. Embodiments of the invention are particularly useful after removal of an electrostatic chuck for refurbishment.

摘要翻译： 本发明包括用于修复包含在静电卡盘内的双极电极之间的电连接的方法和装置以及设置在静电卡盘上方的导电掩模，称为平衡电路。 在移除用于翻新的静电卡盘之后，本发明的实施例特别有用。

公开(公告)号：US20100136218A1

公开(公告)日：2010-06-03

申请号：US12698101

申请日：2010-02-01

申请人： Vijay D. Parkhe

发明人： Vijay D. Parkhe

IPC分类号： B05D5/12 ,  B05D3/12 ,  B05D3/02 ,  B08B7/00

CPC分类号： H01L21/67051 ,  B08B1/00 ,  B08B7/0028 ,  Y10T428/24777 ,  Y10T428/252 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31507 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A method of fabricating a cleaning wafer capable of cleaning process residues from a substrate support surface is disclosed. The method comprises providing a cleaning disc, and applying a liquid polymer precursor to the cleaning disc by spraying or spin coating the liquid polymer precursor onto the disc to form a polymer precursor film on the disc. The polymer precursor film is cured to form a polymer layer having a cleaning surface.

摘要翻译： 公开了一种制造能够从衬底支撑表面清洗工艺残留物的清洁晶片的方法。 该方法包括提供清洁盘，以及通过将液体聚合物前体喷涂或旋涂到盘上以在盘上形成聚合物前体膜，将液体聚合物前体施加到清洁盘。 固化聚合物前体膜以形成具有清洁表面的聚合物层。

公开(公告)号：US20100039747A1

公开(公告)日：2010-02-18

申请号：US12539410

申请日：2009-08-11

申请人： Steven V. Sansoni ,  Cheng-Hsiung Tsai ,  Shambhu N. Roy ,  Karl M. Brown ,  Vijay D. Parkhe ,  Hari Ponnekanti

发明人： Steven V. Sansoni ,  Cheng-Hsiung Tsai ,  Shambhu N. Roy ,  Karl M. Brown ,  Vijay D. Parkhe ,  Hari Ponnekanti

IPC分类号： H01L21/683

CPC分类号： H01L21/6833 ,  H01J37/32431 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/68785 ,  H01L2924/0002 ,  H02N13/00 ,  H01L2924/00

摘要： Embodiments of the present invention provide a cost effective electrostatic chuck assembly capable of operating over a wide temperature range in an ultra-high vacuum environment while minimizing thermo-mechanical stresses within the electrostatic chuck assembly. In one embodiment, the electrostatic chuck assembly includes a dielectric body having chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectric body.

摘要翻译： 本发明的实施例提供了一种经济高效的静电卡盘组件，其能够在超高真空环境中在宽的温度范围内运行，同时使静电卡盘组件内的热机械应力最小化。 在一个实施例中，静电卡盘组件包括具有夹持电极的介电体，该夹持电极包括与电介质体的CTE匹配的具有热膨胀系数（CTE）的金属基质复合材料。

公开(公告)号：US5796074A

公开(公告)日：1998-08-18

申请号：US565185

申请日：1995-11-28

申请人： Sergio Edelstein ,  Steven A. Chen ,  Vijay D. Parkhe

发明人： Sergio Edelstein ,  Steven A. Chen ,  Vijay D. Parkhe

IPC分类号： C30B35/00 ,  C23C14/50 ,  C23C16/458 ,  H01L21/02 ,  H01L21/205 ,  H01L21/31 ,  F27B5/14

CPC分类号： C23C14/50 ,  C23C16/4586

摘要： A wafer heater assembly (8) for a deposition/etch chamber (2) includes a base (32) and a wafer support or chuck (36), having a wafer-chucking surface (76), spaced apart from the base by a circumferential barrier support (38). A heater sub-assembly (54) is mounted to the wafer support. Bolts (48) are used to secure the wafer support to the base with the barrier support therebetween to press the barrier support against an elastomeric O-ring, a metal V-seal or other fluid seal (46) positioned between the base and base end (42) of the barrier support. This eliminates the need to discard the entire heater assembly if the dielectric wafer-chucking surface becomes damaged. The temperature of the fluid seal is about 50.degree.-70.degree. C. lower than the temperature of the wafer-chucking surface when the wafer-chucking surface is about 200.degree.-300.degree. C.

摘要翻译： 用于沉积/蚀刻室（2）的晶片加热器组件（8）包括基部（32）和具有晶片夹持表面（76）的晶片支撑或卡盘（36），所述晶片夹持表面与基部间隔开圆周 屏障支撑（38）。 加热器子组件（54）安装到晶片支撑件上。 螺栓（48）用于将晶片支撑件固定到底座上，其间具有阻挡支撑件，以将阻挡支撑件压靠在弹性体O形环，金属V形密封件或位于基部和基端之间的其它流体密封件（46） （42）。 这就消除了如果介质晶片夹紧表面损坏，则放弃整个加热器组件的需要。 当晶片夹紧表面约为200-300℃时，流体密封件的温度比晶片夹持表面的温度低约50-70℃。

公开(公告)号：US20170352565A1

公开(公告)日：2017-12-07

申请号：US15364589

申请日：2016-11-30

申请人： Chunlei Zhang ,  Haitao Wang ,  Kartik Ramaswamy ,  Vijay D. Parkhe ,  Jaeyong Cho

发明人： Chunlei Zhang ,  Haitao Wang ,  Kartik Ramaswamy ,  Vijay D. Parkhe ,  Jaeyong Cho

IPC分类号： H01L21/683 ,  C23C16/46 ,  H01J37/32 ,  H01L21/687 ,  C23C16/505 ,  C23C16/455 ,  C23C16/458 ,  H01L21/67

CPC分类号： H01J37/32697 ,  C23C16/45565 ,  C23C16/4586 ,  C23C16/4587 ,  C23C16/466 ,  C23C16/505 ,  C23C16/5096 ,  H01J37/32715 ,  H01J37/32724 ,  H01J2237/2001 ,  H01J2237/2007 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/68742

摘要： A workpiece carrier suitable for high power processes is described. It may include a top plate to support a workpiece, a lift pin to lift a workpiece from a top plate, a lift pin hole through the top plate to contain the lift pin, and a connector to the lift pin hole to connect to a source of gas under pressure to deliver a cooling gas, for example helium, to the back side of the workpiece.

公开(公告)号：US20170213754A1

公开(公告)日：2017-07-27

申请号：US15481183

申请日：2017-04-06

申请人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

发明人： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, JR. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC分类号： H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6833 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  H05K7/20218

摘要： An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, a method for adjusting coolant flow in an electrostatic chuck includes heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer. Heat is detected at a plurality of locations on a top surface of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck. A plurality of valves are adjusted to control coolant flow into the coolant chambers based on the detected heat.

公开(公告)号：US08559159B2

公开(公告)日：2013-10-15

申请号：US13198204

申请日：2011-08-04

申请人： Shambhu N. Roy ,  Martin Lee Riker ,  Keith A. Miller ,  Vijay D. Parkhe ,  Steven V. Sansoni

发明人： Shambhu N. Roy ,  Martin Lee Riker ,  Keith A. Miller ,  Vijay D. Parkhe ,  Steven V. Sansoni

IPC分类号： H01T23/00

CPC分类号： H01L21/67109 ,  H01L21/67103 ,  H01L21/6831

摘要： An electrostatic chuck and method of use thereof is provided herein. In some embodiments, an electrostatic chuck may include a disk having a first side to support a substrate thereon and a second side, opposing the first side, to provide an interface to selectively couple the disk to a thermal control plate, a first electrode disposed within the disk proximate the first side to electrostatically couple the substrate to the disk and a second electrode disposed within the disk proximate the opposing side of the disk to electrostatically couple the disk to the thermal control plate. In some embodiments, the second electrode may also be configured to heat the disk.

摘要翻译： 本文提供了静电卡盘及其使用方法。 在一些实施例中，静电卡盘可以包括具有支撑其上的基板的第一侧的盘和与第一侧相对的第二侧，以提供用于选择性地将盘耦合到热控制板的界面，第一电极设置在 靠近第一侧的盘，以将衬底静电耦合到盘，以及设置在靠近盘的相对侧的盘内的第二电极，以将盘静电耦合到热控制板。 在一些实施例中，第二电极也可以被配置为加热盘。