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    Method and apparatus for optimizing heat transfer with electronic components
    1.
    发明授权
    Method and apparatus for optimizing heat transfer with electronic components 有权
    用于优化电子部件传热的方法和装置

    公开(公告)号：US07382620B2

    公开(公告)日：2008-06-03

    申请号：US11249911

    申请日：2005-10-13

    申请人： Vijayeshwar Das Khanna ,  Joseph Kuczynski ,  Arvind Kumar Sinha ,  Sri M. Sri-Jayantha

    发明人： Vijayeshwar Das Khanna ,  Joseph Kuczynski ,  Arvind Kumar Sinha ,  Sri M. Sri-Jayantha

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.

    摘要翻译： 传热组件包括支撑包括一个或多个半导体芯片的电子部件组件的印刷电路板组件。 散热器组件适于与一个或多个半导体芯片热接合。 包括用于将一个或多个半导体芯片加载以与散热器组件接合的装载组件。 提供了一种封装机构，其包含足够量的导热介质以在半导体芯片和散热器组件中的一个或多个的表面之间传递热量，其中导热介质填充一个或多个半导体芯片之间的任何间隙或空间 半导体芯片和散热器组件。

    Method to Extract and Apply Circuit Features in Organic Substrate for Automation of Warp Modeling
    3.
    发明申请
    Method to Extract and Apply Circuit Features in Organic Substrate for Automation of Warp Modeling 失效
    在有机基板中提取和应用电路特征的方法，用于自动化变形建模

    公开(公告)号：US20090313588A1

    公开(公告)日：2009-12-17

    申请号：US12260957

    申请日：2008-10-29

    申请人： Hien Phu Dang ,  Vijayeshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    发明人： Hien Phu Dang ,  Vijayeshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    IPC分类号： G06F17/50

    CPC分类号： H05K3/0005 ,  H05K1/0271 ,  H05K2201/09136

    摘要： A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.

    摘要翻译： 提供了表征包括多个电路层的有机衬底的方法包括以下步骤：接收有机衬底的图像，该图像包括衬底的电路层的几何描述; 至少部分地基于在衬底的图像中限定的电路结构的几何坐标将衬底分割成多个处理区域; 生成与所述基板的所述选择的一个所述处理区域对应的电路层图像; 识别电路层图像中的一个或多个几何特征; 估计电路层图像的至少一个热机械性质作为所识别的几何特征的函数; 重复接收图像的步骤，生成电路层图像，识别电路层图像中的一个或多个几何特征，以及估计电路层图像的至少一个热机械特性，直到已经处理了基板中的所有电路层; 以及根据所述多个电路层图像中的每一个的所述至少一个热机械特性，生成包括所述多个电路层图像的所述基板的所选择的一个处理区域的3-D表示。

    Method to extract and apply circuit features in organic substrate for automation of warp modeling
    6.
    发明授权
    Method to extract and apply circuit features in organic substrate for automation of warp modeling 失效
    提取和应用电路特征的方法，用于有机衬底自动化的翘曲建模

    公开(公告)号：US08127255B2

    公开(公告)日：2012-02-28

    申请号：US12260957

    申请日：2008-10-29

    申请人： Hien Phu Dang ,  Vijayeshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    发明人： Hien Phu Dang ,  Vijayeshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    IPC分类号： G06F17/50

    CPC分类号： H05K3/0005 ,  H05K1/0271 ,  H05K2201/09136

    摘要： A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.

    摘要翻译： 提供了表征包括多个电路层的有机衬底的方法包括以下步骤：接收有机衬底的图像，该图像包括衬底的电路层的几何描述; 至少部分地基于在衬底的图像中限定的电路结构的几何坐标将衬底分割成多个处理区域; 生成与所述基板的所述选择的一个所述处理区域对应的电路层图像; 识别电路层图像中的一个或多个几何特征; 估计电路层图像的至少一个热机械性质作为所识别的几何特征的函数; 重复接收图像的步骤，生成电路层图像，识别电路层图像中的一个或多个几何特征，以及估计电路层图像的至少一个热机械特性，直到已经处理了基板中的所有电路层; 以及根据所述多个电路层图像中的每一个的所述至少一个热机械特性，生成包括所述多个电路层图像的所述基板的所选择的一个处理区域的3-D表示。

    Deformable ring clamping device for warp-free disk stack assembly in a data storage disk drive
    9.
    发明授权
    Deformable ring clamping device for warp-free disk stack assembly in a data storage disk drive 失效
    可变形的环形夹紧装置，用于数据存储磁盘驱动器中的无翘曲磁盘堆栈组装

    公开(公告)号：US06788494B2

    公开(公告)日：2004-09-07

    申请号：US10154344

    申请日：2002-05-23

    申请人： Vijayeshwar Das Khanna ,  Gordon James Smith ,  Sri M. Sri-Jayantha

    发明人： Vijayeshwar Das Khanna ,  Gordon James Smith ,  Sri M. Sri-Jayantha

    IPC分类号： G11B1708

    CPC分类号： G11B17/038

    摘要： A magnetic disk drive is provided with clamping rings that whenever nested will form an annular chamber to accommodate a toroidal ring which is deformable. As the clamping rings are progressively forcefully engaged by the clamping rings, the chamber is reduced in height and transmits the force of the top clamping ring to the bottom clamping ring in a uniform distribution and prevents the force of the bottom clamping ring from having non-uniformity of distribution. This action prevents magnetically recordable disks of the disk drive from being subjected to point loading and consequential warping. The uniform distribution exerted on glass disks also prevents cracking or shattering of the glass disk and prevents warping of non-glass disks.

    摘要翻译： 磁盘驱动器设置有夹紧环，每当嵌套将形成环形室以容纳可变形的环形环。 当夹紧环逐渐被夹紧环逐渐地接合时，腔室的高度减小并且以均匀的分布将顶部夹紧环的力传递到底部夹紧环，并且防止底部夹紧环的力不受其限制， 分布均匀。 此操作可防止磁盘驱动器的磁性可记录磁盘受到点加载和后果翘曲。 施加在玻璃盘上的均匀分布也可防止玻璃盘的破裂或破裂，并防止非玻璃盘翘曲。