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    INTEGRATED HEAT SPREADER AND EXCHANGER
    5.
    发明申请
    INTEGRATED HEAT SPREADER AND EXCHANGER 失效
    集成热交换器和交换机

    公开(公告)号：US20080180914A1

    公开(公告)日：2008-07-31

    申请号：US11668097

    申请日：2007-01-29

    申请人： Vijayeshwar D. Khanna ,  Alok K. Lohia ,  Gerard McVicker ,  Sri M. Sri-Jayantha

    发明人： Vijayeshwar D. Khanna ,  Alok K. Lohia ,  Gerard McVicker ,  Sri M. Sri-Jayantha

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： Disclosed is an integrated active heat spreader and exchanger. The heat spreader cum exchanger includes a housing with a conductive heat spreader therein. A spreader plate of the heat spreader is in thermal contact with a microprocessor chip to be cooled and a plurality of spreader fins extending from the spreader plate. A membrane connects the heat spreader and the housing, sealing an interface between the heat spreader and the housing. A top plate, including a plurality of top plate fins, is disposed in the housing. A pump is located between the top plate fins and the spreader fins and urges fluid across the spreader fins and conducts heat from the spreader fins. The top plate fins conduct heat from the fluid and into a heat sink in thermal contact with the top plate. A heat sink plate conducts heat into heat sink fins where the heat is dissipated.

    摘要翻译： 公开了一种集成的主动散热器和换热器。 散热器暨交换器包括其中具有导电散热器的壳体。 散热器的散布板与要冷却的微处理器芯片热接触，并且从扩散板延伸出多个散热片。 隔膜连接散热器和外壳，密封散热器和外壳之间的接口。 包括多个顶板翅片的顶板设置在壳体内。 泵位于顶板翅片和扩散器翅片之间，并且促使流体跨越扩散器翅片并且从扩散器翅片传导热量。 顶板翅片从流体传导热量并进入与顶板热接触的散热器。 散热片将散热片散热到散热片散热片。

    Structures to enhance cooling of computer memory modules
    7.
    发明申请
    Structures to enhance cooling of computer memory modules 失效
    用于增强计算机内存模块冷却的结构

    公开(公告)号：US20080116571A1

    公开(公告)日：2008-05-22

    申请号：US11604152

    申请日：2006-11-22

    申请人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

    发明人： Hien P. Dang ,  Vinod Kamath ,  Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha ,  Jung H. Yoon

    IPC分类号： H01L23/467

    CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.

    摘要翻译： 用于直列芯片模块的弹簧状冷却结构由具有前侧和后侧的导热材料的连续片材形成，所述片材以基本上以一百八十度的角度折叠，其中长度 的结构基本上与直列芯片模块的长度相关，并且该结构的宽度比直列芯片模块的宽度宽，使得该结构适合于并且基本上围绕在线芯片模块; 在结构的左侧，右侧和底部的开口，用于容易地从线内芯片模块固定和移除结构; 顶部，其包括顶部表面，所述顶部表面设置在所述直列芯片模块的顶部上，当固定到所述在线芯片模块时，并且包括从所述直列芯片模块向外扩张的成角度的表面， 顶面 中心水平部分; 中心水平部分和多个芯片之间的间隙; 和结构的扩口底部区域。

    HEAT TRANSFER DEVICE IN A ROTATING STRUCTURE
    8.
    发明申请
    HEAT TRANSFER DEVICE IN A ROTATING STRUCTURE 有权
    旋转结构中的传热装置

    公开(公告)号：US20110123318A1

    公开(公告)日：2011-05-26

    申请号：US13015767

    申请日：2011-01-28

    申请人： Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha

    发明人： Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha

    IPC分类号： F04D29/58 ,  B23P11/00

    CPC分类号： F04D25/04 ,  F04D29/582 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  Y10T29/49236 ,  H01L2224/0401

    摘要： A cooling system includes a moving rotor system which in turn includes: a rotating disk on which a plurality of heat conducting structures are distributed, the heat conducting structures including an inner arrangement of spiral blades; an air flow generating fan element; and an outer arrangement of heat transfer pins distributed along a perimeter of the rotating disk, the heat transfer pins having a high aspect ratio that maximizes a surface area to footprint area; wherein the spiral blades generate a mass fluid flow of ambient fluid toward the heat transfer pins such that the heat transfer pins are persistently cooled.

    摘要翻译： 一种冷却系统，包括一个移动转子系统，该转动系统又包括：分配有多个导热结构的旋转盘，该导热结构包括螺旋叶片的内部装置; 气流发生风扇元件; 以及沿着旋转盘的周边分布的传热销的外部布置，传热销具有使表面积最大化到占地面积的高纵横比; 其中所述螺旋叶片产生朝向所述传热销的周围流体的质量流体流，使得所述传热销持续冷却。

    Pump structures integral to a fluid filled heat transfer apparatus
    10.
    发明授权
    Pump structures integral to a fluid filled heat transfer apparatus 有权
    与流体填充传热装置成一体的泵结构

    公开(公告)号：US07667969B2

    公开(公告)日：2010-02-23

    申请号：US11686972

    申请日：2007-03-16

    申请人： Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha

    发明人： Vijayeshwar D. Khanna ,  Gerard McVicker ,  Sri M. Sri-Jayantha

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401

    摘要： Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid.

    摘要翻译： 提出了一种散热器装置，其包括在固定和可移动物体之间传递热量的流体介质。 包括被设计成与流体填充的传热装置一体地或与其一体操作的泵结构，并且适于提供最佳和唯一的冷却流动路径，用于实现诸如计算机芯片等的电子设备的冷却，其需要 主动冷却动作。 泵和散热器装置选择性地具有旋转或固定轴，各种类型的叶轮和流体或冷却介质循环结构，其通过循环流体使电子装置或设备的各种部件的对流和导电冷却最大化 。