公开(公告)号：US3652324A

公开(公告)日：1972-03-28

申请号：US3652324D

申请日：1968-08-15

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： CHU TING L ,  GRUBER GILBERT A ,  SZEDON JOHN R

IPC: C23C16/34 ,  H01L23/29 ,  C23C11/08 ,  C23C11/16

CPC classification number: H01L23/29 ,  C23C16/345 ,  H01L23/291 ,  H01L2924/0002 ,  Y10S438/906 ,  H01L2924/00

Abstract: The present invention relates to dielectric coatings for electronic devices such as rectifiers, transistors and capacitors. More specifically, the invention relates to dielectric coatings comprising silicon nitride films alone or in combination with silicon dioxide films, and to methods for the production of silicon nitride coatings by reacting silane, silicon halides or halosilanes with ammonia.

Abstract translation: 本发明涉及电子器件如整流器，晶体管和电容器的电介质涂层。 更具体地，本发明涉及单独或与二氧化硅膜组合的包含氮化硅膜的电介质涂层，以及通过使硅烷，硅卤化物或卤代硅烷与氨反应生产氮化硅涂层的方法。

公开(公告)号：US3911475A

公开(公告)日：1975-10-07

申请号：US44761774

申请日：1974-03-04

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： SZEDON JOHN R ,  JACKSON JOHN A ,  PHILLIPS DAVID C

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/488 ,  H01L23/495 ,  H01L23/28

CPC classification number: H01L24/01 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/488 ,  H01L23/4952 ,  H01L23/49586 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An encapsulated solid state electronic device, such as a semiconductor, with attached metallic connection leads is made moisture resistant by coating the leads with a smooth, flexible, pinhole-free resinous barrier film, which intimately bonds to the leads and encapsulant, providing a void-free lead-encapsulated interface.

Abstract translation: 具有附接的金属连接引线的封装的固态电子器件（例如半导体）通过用平滑，柔性的无针孔树脂屏障膜涂覆引线而防潮，其紧密地结合到引线和密封剂上，提供空​​隙 无铅引线封装接口。

公开(公告)号：US3916041A

公开(公告)日：1975-10-28

申请号：US44297274

申请日：1974-02-14

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： CHU TING L ,  SZEDON JOHN R ,  JOHNSON JOSEPH E

IPC: C23C16/40 ,  H01B3/00 ,  H01B3/12 ,  H01L21/316 ,  C23C11/08 ,  B44D1/18

CPC classification number: C23C16/405

Abstract: A method is provided for depositing thin adherent films of high purity titanium dioxide on a substrate. A gaseous mixture of a titanium tetrahalide, hydrogen and oxygen containing a molar excess of hydrogen is passed over a heated substrate surface. The substrate is heated to a temperature between 227*C. and 927*C. and preferably below 600*C. to provide a reaction between the gaseous mixture which results in the formation of an adherent titanium dioxide on the surface of the substrate.