公开(公告)号：US08730663B2

公开(公告)日：2014-05-20

申请号：US13352656

申请日：2012-01-18

申请人： Sung Nien Du ,  Ting-Chiang Huang ,  Wei-Yi Lin ,  Li-Ting Wang

发明人： Sung Nien Du ,  Ting-Chiang Huang ,  Wei-Yi Lin ,  Li-Ting Wang

IPC分类号： H05K5/00 ,  H05K7/00 ,  G06F1/20 ,  H05K7/20

CPC分类号： G06F1/203

摘要： An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

摘要翻译： 公开了一种电子设备，其包括：壳体，其配置有多个入口和一个出口; 设置在所述壳体内的多个电子元件; 以及多个门，以一个一个方式布置在与多个入口对应的位置处; 其中，当电子设备能够使多个电子元件的温度升高到其各自的工作温度时，多个电子元件被激活，从而在壳体内部分别形成多个加热区域 到多个入口; 并且通过使得每个门能够配置有能够随着相应的加热区域的温度变化而变形的一个热膨胀元件，每个门能够根据相应热量的变形在第一位置和第二位置之间移动 膨胀元件

公开(公告)号：US20130141869A1

公开(公告)日：2013-06-06

申请号：US13332577

申请日：2011-12-21

申请人： WEI-YI LIN ,  Ting-Chiang Huang ,  Li-Ting Wang ,  Sung Nien Du

发明人： WEI-YI LIN ,  Ting-Chiang Huang ,  Li-Ting Wang ,  Sung Nien Du

IPC分类号： H05K7/20

CPC分类号： H01L23/433 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.

摘要翻译： 一种散热模块，包括：风扇; 和散热片; 导电元件，由导电材料制成，并且由第一导电部件和两个第二导电部件组成，其中第一导电部件设置成与加热元件接合，同时允许两个第二导电部件与热接合 散热片 和墙元素; 其中，来自所述加热元件的热​​量被传导到所述第一导电部件，在所述第一导电部件中，所述第二导电部件被进一步分成两个第二导电部件; 从风扇吹出的空气流被引导到加热元件，然后被壁元件阻挡，用于将空气流朝向散热翅片从进气侧转向出气侧，然后排出 的散热模块。

公开(公告)号：US08929072B2

公开(公告)日：2015-01-06

申请号：US13332577

申请日：2011-12-21

申请人： Wei-Yi Lin ,  Ting-Chiang Huang ,  Li-Ting Wang ,  Sung Nien Du

发明人： Wei-Yi Lin ,  Ting-Chiang Huang ,  Li-Ting Wang ,  Sung Nien Du

IPC分类号： H05K7/20

CPC分类号： H01L23/433 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.

摘要翻译： 一种散热模块，包括：风扇; 和散热片; 导电元件，由导电材料制成，并且由第一导电部件和两个第二导电部件组成，其中第一导电部件设置成与加热元件接合，同时允许两个第二导电部件与热接合 散热片 和墙元素; 其中，来自所述加热元件的热​​量被传导到所述第一导电部件，在所述第一导电部件中，所述第二导电部件被进一步分成两个第二导电部件; 从风扇吹出的空气流被引导到加热元件，然后被壁元件阻挡，用于将空气流朝向散热翅片从进气侧转向出气侧，然后排出 的散热模块。

公开(公告)号：US20130155605A1

公开(公告)日：2013-06-20

申请号：US13352656

申请日：2012-01-18

申请人： Sung Nien Du ,  Ting-Chiang Huang ,  Wei-Yi Lin ,  Li-Ting Wang

发明人： Sung Nien Du ,  Ting-Chiang Huang ,  Wei-Yi Lin ,  Li-Ting Wang

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/203

摘要： An electronic apparatus is disclosed, which comprises: a housing, configured with a plurality of inlets and one outlet; a plurality of electronic elements, disposed inside the housing; and a plurality of gates, arranged at positions corresponding to the plural inlets in an one-by-one manner; wherein, the plural electronic elements are activated while the electronic apparatus is enabled for causing the temperature of the plural electronic elements to be raised to their respective working temperatures, thereby, causing a plurality of heating zones to be formed inside the housing at positions respectively corresponding to the plural inlets; and by enabling each gate to be configured with one thermal expansion element that is enabled to deform with the temperature variation of the corresponding heating zone, each gate is enabled to move between a first position and a second position according to the deformation of the corresponding thermal expansion element.

摘要翻译： 公开了一种电子设备，其包括：壳体，其配置有多个入口和一个出口; 设置在所述壳体内的多个电子元件; 以及多个门，以一个一个方式布置在与多个入口对应的位置处; 其中，当电子设备能够使多个电子元件的温度升高到其各自的工作温度时，多个电子元件被激活，从而在壳体内部分别形成多个加热区域 到多个入口; 并且通过使得每个门能够配置有能够随着相应的加热区域的温度变化而变形的一个热膨胀元件，每个门能够根据相应热量的变形在第一位置和第二位置之间移动 膨胀元件

公开(公告)号：US08542486B2

公开(公告)日：2013-09-24

申请号：US13015596

申请日：2011-01-28

申请人： Wei-Yi Lin ,  Li-Ting Wang ,  Kuang-Chung Sun ,  Ting-Chiang Huang ,  Feng-Ku Wang

发明人： Wei-Yi Lin ,  Li-Ting Wang ,  Kuang-Chung Sun ,  Ting-Chiang Huang ,  Feng-Ku Wang

IPC分类号： H05K7/20 ,  H01L23/467 ,  H05K5/00 ,  A47B77/08 ,  G06F1/16 ,  G06F1/20

CPC分类号： H01L23/467 ,  G06F1/1667 ,  G06F1/203 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic apparatus with improved heat dissipation comprises a first body with a first shell and a second shell, a second body, a coupling device and a linkage device. The first shell is pivotally connected to the second shell to form an accommodation space. The first shell can pivot relative to the second shell to enlarge the accommodation space and form an opening between the first shell and the second shell. The coupling device couples the second body and the second shell to pivot the second body relative to the second shell to expose or hide the first shell. The linkage device drives the first shell to pivot relative to the second shell. When the second body pivots relative to the second shell toward a first direction, the linkage device drives the first shell to pivot relative to the second shell toward a second direction opposite to the first direction.

摘要翻译： 具有改善的散热的电子设备包括具有第一壳体和第二壳体的第一主体，第二主体，联接装置和联动装置。 第一壳体枢转地连接到第二壳体以形成容纳空间。 第一壳体可相对于第二壳体枢转以扩大容纳空间并在第一壳体和第二壳体之间形成开口。 联接装置联接第二主体和第二壳，以使第二主体相对于第二壳枢转以露出或隐藏第一壳。 联动装置驱动第一壳体相对于第二壳体枢轴转动。 当第二主体相对于第二壳体朝向第一方向枢转时，联动装置驱动第一壳体相对于第二壳体朝向与第一方向相反的第二方向枢转。

公开(公告)号：US20100124026A1

公开(公告)日：2010-05-20

申请号：US12401098

申请日：2009-03-10

申请人： Shaw-Fuu Wang ,  Ting-Chiang Huang ,  Sheng-Jie Syu ,  Chiun-Peng Chen ,  Chih-Kuang Chung ,  Li-Ting Wang

发明人： Shaw-Fuu Wang ,  Ting-Chiang Huang ,  Sheng-Jie Syu ,  Chiun-Peng Chen ,  Chih-Kuang Chung ,  Li-Ting Wang

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.

摘要翻译： 散热模块包括散热单元，具有位置限制孔的集热板，连接在散热元件和集热板之间的导热构件和固定结构。 固定结构包括两个端部，一个弓形弹性部分，以及一个连接到弓形弹性部分并延伸穿过位置限制孔的位置限制部分。 每个端部可滑动地设置在集热板上。 弓形弹性部分连接在两个端部之间并且适于紧固到集热板和基座，使得电气部件夹在集热板和基座之间。

公开(公告)号：US07835152B2

公开(公告)日：2010-11-16

申请号：US12401098

申请日：2009-03-10

申请人： Shaw-Fuu Wang ,  Ting-Chiang Huang ,  Sheng-Jie Syu ,  Chiun-Peng Chen ,  Chih-Kuang Chung ,  Li-Ting Wang

发明人： Shaw-Fuu Wang ,  Ting-Chiang Huang ,  Sheng-Jie Syu ,  Chiun-Peng Chen ,  Chih-Kuang Chung ,  Li-Ting Wang

IPC分类号： H05K7/20 ,  F28D5/00

CPC分类号： G06F1/203

摘要： A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.

摘要翻译： 散热模块包括散热单元，具有位置限制孔的集热板，连接在散热元件和集热板之间的导热构件和固定结构。 固定结构包括两个端部，一个弓形弹性部分，以及一个连接到弓形弹性部分并延伸穿过位置限制孔的位置限制部分。 每个端部可滑动地设置在集热板上。 弓形弹性部分连接在两个端部之间并且适于紧固到集热板和基座，使得电气部件夹在集热板和基座之间。

公开(公告)号：US09612056B2

公开(公告)日：2017-04-04

申请号：US13428749

申请日：2012-03-23

申请人： Yi-Hung Lin ,  Li-Ting Wang ,  Tze-Liang Lee

发明人： Yi-Hung Lin ,  Li-Ting Wang ,  Tze-Liang Lee

IPC分类号： F27D5/00 ,  F27B17/00 ,  H01L21/67 ,  H01L21/687

CPC分类号： H05B1/0233 ,  F27B17/0025 ,  F27D5/0037 ,  H01L21/306 ,  H01L21/477 ,  H01L21/67115 ,  H01L21/67303 ,  H01L21/683 ,  H01L21/68735 ,  H01L21/68757

摘要： An apparatus, a system and a method are disclosed. An exemplary apparatus includes a first portion configured to hold an overlying wafer. The first portion includes a central region and an edge region circumscribing the central region. The first portion further including an upper surface and a lower surface. The apparatus further includes a second portion extending beyond an outer radius of the wafer. The second portion including an upper surface and a lower surface. The lower surface of the first portion in the central region has a first reflective characteristic. The lower surface of the first portion in the edge region and the second portion have a second reflective characteristic.

公开(公告)号：US20100105185A1

公开(公告)日：2010-04-29

申请号：US12259028

申请日：2008-10-27

申请人： Keh-Chiang Ku ,  Cheng-Lung Hung ,  Li-Ting Wang ,  Chien-Hao Chen ,  Chien-Hao Huang ,  Wenli Lin ,  Yu-Chang Lin

发明人： Keh-Chiang Ku ,  Cheng-Lung Hung ,  Li-Ting Wang ,  Chien-Hao Chen ,  Chien-Hao Huang ,  Wenli Lin ,  Yu-Chang Lin

IPC分类号： H01L21/336 ,  H01L21/4763

CPC分类号： H01L21/28052 ,  H01L21/26506 ,  H01L21/26586 ,  H01L21/28506 ,  H01L29/1083 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/7833

摘要： A method for forming a semiconductor structure includes providing a semiconductor substrate; forming a gate dielectric layer over the semiconductor substrate; forming a gate electrode layer over the gate dielectric layer; doping carbon and nitrogen into the gate electrode layer; and, after the step of doping carbon and nitrogen, patterning the gate dielectric layer and the gate electrode layer to form a gate dielectric and a gate electrode, respectively.

摘要翻译： 一种形成半导体结构的方法包括提供半导体衬底; 在所述半导体衬底上形成栅介电层; 在所述栅极电介质层上形成栅电极层; 将碳和氮掺杂到栅电极层中; 并且在掺杂碳和氮的步骤之后，分别构图栅极电介质层和栅极电极层以形成栅极电介质和栅电极。

公开(公告)号：US20080160709A1

公开(公告)日：2008-07-03

申请号：US11648371

申请日：2006-12-29

申请人： Chien-Hao Chen ,  Tze-Liang Lee ,  Shih-Chang Chen ,  Keh-Chiang Ku ,  Chun-Feng Nieh ,  Li-Ting Wang ,  Hsun Chang

发明人： Chien-Hao Chen ,  Tze-Liang Lee ,  Shih-Chang Chen ,  Keh-Chiang Ku ,  Chun-Feng Nieh ,  Li-Ting Wang ,  Hsun Chang

IPC分类号： H01L21/336

CPC分类号： H01L21/268 ,  H01L21/324 ,  H01L29/665 ,  H01L29/6659 ,  H01L29/7833

摘要： A method of forming a semiconductor structure includes providing a semiconductor substrate; forming a gate dielectric over the semiconductor substrate; forming a gate electrode on the gate dielectric; forming a source/drain region adjacent the gate dielectric and the gate electrode; forming an absorption-capping layer over the source/drain region and the gate electrode; performing an activation by applying a high-energy light to the absorption-capping layer; and removing the absorption-capping layer.

摘要翻译： 一种形成半导体结构的方法包括：提供半导体衬底; 在所述半导体衬底上形成栅极电介质; 在栅极电介质上形成栅电极; 形成邻近所述栅极电介质和所述栅电极的源极/漏极区域; 在源极/漏极区域和栅极电极上形成吸收覆盖层; 通过向吸收覆盖层施加高能量光来进行激活; 并去除吸收层。