公开(公告)号：US07749038B2

公开(公告)日：2010-07-06

申请号：US11059554

申请日：2005-02-17

申请人： Wei-Yuan Cheng ,  Yu-Chao Wu

发明人： Wei-Yuan Cheng ,  Yu-Chao Wu

IPC分类号： H01J1/63 ,  H01J63/08 ,  C09K11/02 ,  H05B33/14

CPC分类号： H01L33/502 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

摘要： A light emitting device fabrication method. The fabrication method of the light emitting device comprises providing a light emitting semiconductor device; positioning a plurality of luminescent particles at the optical path of the light emitting semiconductor device; and reducing the distance between the luminescent particles to enhance the molecular attraction between the luminescent particles, than the luminescent particles is coagulated to a luminescent powder layer by the molecular attraction.

摘要翻译： 发光器件制造方法。 发光器件的制造方法包括提供发光半导体器件; 在发光半导体器件的光路处定位多个发光粒子; 并且通过分子吸引将发光粒子凝聚成发光粉末层，减少发光粒子之间的距离，以提高发光粒子之间的分子吸引力。

公开(公告)号：US20050184651A1

公开(公告)日：2005-08-25

申请号：US11059554

申请日：2005-02-17

申请人： Wei-Yuan Cheng ,  Yu-Chao Wu

发明人： Wei-Yuan Cheng ,  Yu-Chao Wu

IPC分类号： H01J1/62 ,  H01L23/02 ,  H01L33/50

CPC分类号： H01L33/502 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

摘要： A light emitting device fabrication method. The fabrication method of the light emitting device comprises providing a light emitting semiconductor device; positioning a plurality of luminescent particles at the optical path of the light emitting semiconductor device; and reducing the distance between the luminescent particles to enhance the molecular attraction between the luminescent particles, than the luminescent particles is coagulated to a luminescent powder layer by the molecular attraction.

摘要翻译： 发光器件制造方法。 发光器件的制造方法包括提供发光半导体器件; 在发光半导体器件的光路处定位多个发光粒子; 并且通过分子吸引将发光粒子凝聚成发光粉末层，减少发光粒子之间的距离，以提高发光粒子之间的分子吸引力。

公开(公告)号：US20100270910A1

公开(公告)日：2010-10-28

申请号：US12829273

申请日：2010-07-01

申请人： Wei-Yuan Cheng ,  Yu-Chao Wu

发明人： Wei-Yuan Cheng ,  Yu-Chao Wu

IPC分类号： H01J1/62 ,  B05D5/06 ,  B05C11/00 ,  H01L33/44

CPC分类号： H01L33/502 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/00014

摘要： A light emitting device fabrication method. The fabrication method of the light emitting device comprises providing a light emitting semiconductor device; positioning a plurality of luminescent particles at the optical path of the light emitting semiconductor device; and reducing the distance between the luminescent particles to enhance the molecular attraction between the luminescent particles, than the luminescent particles is coagulated to a luminescent powder layer by the molecular attraction.

摘要翻译： 发光器件制造方法。 发光器件的制造方法包括提供发光半导体器件; 在发光半导体器件的光路处定位多个发光粒子; 并且通过分子吸引将发光粒子凝聚成发光粉末层，减少发光粒子之间的距离，以提高发光粒子之间的分子吸引力。

公开(公告)号：US20120069567A1

公开(公告)日：2012-03-22

申请号：US13322450

申请日：2010-05-27

申请人： Yu-Chao Wu

发明人： Yu-Chao Wu

IPC分类号： F21V7/22 ,  F21V29/00 ,  H01L33/48

CPC分类号： F21K9/20 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： One embodiment of the invention provides an illumination system including a light-source supporting body and a power supporting body. The light-source supporting body has a first groove. At least a light-source module is received in the first groove. The power supporting body has second groove. At least a power module is received in the second groove. The light-source supporting body is detachably fixed on the power supporting body. Each light-source module includes a multichip package structure composed of a plurality of light-emitting chips, and each of the light-source modules and the power module are separated by the light-source supporting body and the power supporting body.

摘要翻译： 本发明的一个实施例提供了一种包括光源支撑体和动力支撑体的照明系统。 光源支撑体具有第一凹槽。 至少一个光源模块被容纳在第一凹槽中。 动力支撑体具有第二凹槽。 至少一个功率模块被容纳在第二槽中。 光源支撑体可拆卸地固定在动力支撑体上。 每个光源模块包括由多个发光芯片组成的多芯片封装结构，并且每个光源模块和电源模块由光源支撑体和电源支撑体分离。

公开(公告)号：US08752980B2

公开(公告)日：2014-06-17

申请号：US13322450

申请日：2010-05-27

申请人： Yu-Chao Wu

发明人： Yu-Chao Wu

IPC分类号： F21V7/22 ,  F21V29/00 ,  H01L33/48

CPC分类号： F21K9/20 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： One embodiment of the invention provides an illumination system including a light-source supporting body and a power supporting body. The light-source supporting body has a first groove. At least a light-source module is received in the first groove. The power supporting body has second groove. At least a power module is received in the second groove. The light-source supporting body is detachably fixed on the power supporting body. Each light-source module includes a multichip package structure composed of a plurality of light-emitting chips, and each of the light-source modules and the power module are separated by the light-source supporting body and the power supporting body.

摘要翻译： 本发明的一个实施例提供了一种包括光源支撑体和动力支撑体的照明系统。 光源支撑体具有第一凹槽。 至少一个光源模块被容纳在第一凹槽中。 动力支撑体具有第二凹槽。 至少一个功率模块被容纳在第二槽中。 光源支撑体可拆卸地固定在动力支撑体上。 每个光源模块包括由多个发光芯片组成的多芯片封装结构，并且每个光源模块和电源模块由光源支撑体和电源支撑体分离。

公开(公告)号：US20100219430A1

公开(公告)日：2010-09-02

申请号：US12303916

申请日：2006-06-08

申请人： Yu-Chao Wu

发明人： Yu-Chao Wu

IPC分类号： H01L33/48 ,  H01L33/52 ,  H01L33/00

CPC分类号： H01L33/60 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting system, a light emitting apparatus and the forming method thereof, the light emitting system comprising a plurality of light emitting units (100) and a frame for connecting the light emitting units. Each light emitting unit comprises a substrate (102), one or a plurality of chips (104) disposed on the substrate, an annular member (110) disposed on the substrate and surrounding the chips, the annular member used for adjusting the direction of the light emitted from the chips, and a protective layer (108) covering the chips, wherein the height of the protective layer is not more than that of the annular member.

摘要翻译： 发光系统，发光装置及其形成方法，所述发光系统包括多个发光单元（100）和用于连接所述发光单元的框架。 每个发光单元包括衬底（102），设置在衬底上的一个或多个芯片（104），设置在衬底上并围绕芯片的环形构件（110），用于调节衬底 从芯片发射的光和覆盖芯片的保护层（108），其中保护层的高度不大于环形构件的高度。

公开(公告)号：US20100067224A1

公开(公告)日：2010-03-18

申请号：US12312533

申请日：2007-08-24

申请人： Yu-Chao Wu

发明人： Yu-Chao Wu

IPC分类号： F21V1/00

CPC分类号： F21V29/51 ,  F21K9/20 ,  F21K9/68 ,  F21S6/00 ,  F21V3/06 ,  F21V7/0016 ,  F21V29/74 ,  F21V29/763 ,  F21V29/85 ,  F21V29/86 ,  F21W2131/103 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0206 ,  H01L2924/00014

摘要： A light emitting system is provided. An exemplary embodiment of a light emitting system comprising at least a light emitting module comprises a substrate, and light emitting rows supported by the substrate, wherein each light emitting row has unpackaged light emitting chips, surrounded by a reflective structure, and a transparent lens is disposed above the light emitting rows for mixing lights emitted from the light emitting rows to form a light source. An exemplary embodiment of a light emitting module of the invention can improve light emitting efficiency effectively with achieving better heat dissipation efficiency.

摘要翻译： 提供发光系统。 至少包括发光模块的发光系统的示例性实施例包括基板和由基板支撑的发光行，其中每个发光行具有由反射结构包围的未封装的发光芯片，透明透镜 设置在发光行上方，用于混合从发光行发射的光，以形成光源。 本发明的发光模块的示例性实施例可以有效地提高发光效率，同时实现更好的散热效率。