公开(公告)号：US06390356B1

公开(公告)日：2002-05-21

申请号：US09693951

申请日：2000-10-23

申请人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Chia-Chieh Hu ,  Hui-Pin Chen ,  Ning Huang ,  Feng Chang Tu ,  Chung Ming Chang ,  Hua Wen Chiang ,  Hsuan Jui Chang

发明人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Chia-Chieh Hu ,  Hui-Pin Chen ,  Ning Huang ,  Feng Chang Tu ,  Chung Ming Chang ,  Hua Wen Chiang ,  Hsuan Jui Chang

IPC分类号： B23K3512

CPC分类号： H01L21/4853 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of forming cylindrical bumps on a substrate for integrated circuits includes the steps of: forming copper circuits on a board of a substrate by means of electroplating; covering said board with a screening material; forming openings in said screening material to align with copper circuits on said board, filling pure copper or high melting point metal into said openings by electroplating to form cylindrical projections; forming a layer of solder alloy on an upper end of each of said cylindrical projections to be even with an upper surface of said screening material, and removing said screening material to leave the cylindrical bumps, whereby the engagement operation between the die and the substrate can be facilitated and the manufacture of the die can be easier.

摘要翻译： 在用于集成电路的基板上形成圆柱形凸块的方法包括以下步骤：通过电镀在基板的基板上形成铜电路; 用筛选材料覆盖所述板; 在所述屏蔽材料中形成开口以与所述板上的铜电路对准，通过电镀将纯铜或高熔点金属填充到所述开口中以形成圆柱形突起; 在每个所述圆柱形突起的上端上形成一层焊料合金，以使所述屏蔽材料的上表面均匀，并且移除所述筛选材料以留下圆柱形凸块，由此模具和基板之间的接合操作 有利于模具的制造更容易。

公开(公告)号：US06358834B1

公开(公告)日：2002-03-19

申请号：US09688123

申请日：2000-10-16

申请人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Hsuan Jui Chang ,  Hui-Pin Chen ,  Ning Huang ,  Feng-Chang Tu ,  Chung-Ming Chang ,  Hua Wen Chiang ,  Chia-Chieh Hu

发明人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Hsuan Jui Chang ,  Hui-Pin Chen ,  Ning Huang ,  Feng-Chang Tu ,  Chung-Ming Chang ,  Hua Wen Chiang ,  Chia-Chieh Hu

IPC分类号： H01L23488

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/1225 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05099

摘要： A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.

摘要翻译： 在晶片上形成金属凸块的方法包括以下步骤：将耐热和稳定的合成胶带粘附在晶片的顶部上，通过合成胶带穿孔，在合成胶带上形成盲孔， 冶金层（UBM），通过推动器将焊膏填充到盲孔中，熔化然后将焊膏冷却到焊料块中，去除合成胶带以暴露焊料块，并熔化焊料块以形成球形焊料 磕碰。