公开(公告)号：US06567270B2

公开(公告)日：2003-05-20

申请号：US09988094

申请日：2001-11-19

Applicant: Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

Inventor： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

IPC: H05K720

CPC classification number: H01L23/055 ,  H01L23/4093 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/00

Abstract: A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Abstract translation: 具有冷却装置的半导体芯片封装包括适于覆盖至少半导体芯片的散热器，其特征在于，所述散热器具有倒置的U形横截面，从而在其内底部形成适于覆盖至少半导体 芯片和从所述散热器的周向下边缘向下延伸的多个销，每个所述销形成有颈部，扩大的头部和将所述颈部和所述扩大的头部分离成两部分的开口狭槽，由此包装 可以快速地从半导体芯片中去除热量，滤除噪声并降低电感。

公开(公告)号：US06274491B1

公开(公告)日：2001-08-14

申请号：US09636315

申请日：2000-08-11

Applicant: Wan Le Xie ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Ning Huang ,  Chung Ming Chang ,  Hui-Pin Chen ,  Chia-Chieh Hu ,  Feng Chang Tu ,  Hsuan Jui Chang ,  Hua Wen Chiang

Inventor： Wan Le Xie ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Ning Huang ,  Chung Ming Chang ,  Hui-Pin Chen ,  Chia-Chieh Hu ,  Feng Chang Tu ,  Hsuan Jui Chang ,  Hua Wen Chiang

IPC: H01L2144

CPC classification number: H05K3/4092 ,  H01L21/4846 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/062 ,  H05K3/108 ,  H05K3/3473 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/0394 ,  H01L2924/00

Abstract: A process of manufacturing thin ball array substrates includes the steps of: using a layer of polyimide film as a carrier, electroplating a thin copper layer on the polyimide film, electroplating a thick copper layer on the thin copper layer, applying photosensitive coating layers on both sides of the carrier, mounting two masks with optically transmissible circuit tracks on two sides of the carrier and then processing the carrier with exposure treatment, processing the carrier with development treatment so as to remove the photosensitive coating layers aligned with the circuit track thereby forming recessed circuit tracks on the photosensitive coating layers, electroplating a copper layer on a top of the carrier thereby forming an additional copper layer on the thick copper layer, etching a bottom of the carrier to remove the upper recessed circuit track thereon, coating the copper layer on the upper recessed circuit track with soldering metallic material so as to make a top of the soldering metallic material, washing away the photosensitive coating layers with chemical agent, and removing surplus copper layer to remain in circuit lines and the soldering metallic material, whereby a thin ball grid array substrate with thicker circuit lines without remaining electroplating lines can be obtained.

Abstract translation: 制造薄球阵列基板的方法包括以下步骤：使用聚酰亚胺膜作为载体，在聚酰亚胺膜上电镀薄铜层，在薄铜层上电镀厚铜层，在两层上施加感光涂层 在载体的两侧安装具有光学传输电路轨道的两个掩模，然后用曝光处理处理载体，通过显影处理处理载体，以除去与电路轨迹对准的感光涂层，从而形成凹陷 在光敏涂层上的电路轨迹，在载体的顶部上电镀铜层，从而在厚铜层上形成附加的铜层，蚀刻载体的底部以除去其上的凹陷电路轨道，将铜层涂覆在 具有焊接金属材料的上凹形电路轨道，以便形成顶部 用化学试剂洗涤光敏涂层，除去多余的铜层，保留在电路线和焊接金属材料中，从而可以获得具有较厚电路线而不残留电镀线的薄球栅阵列基板。

公开(公告)号：US06706739B2

公开(公告)日：2004-03-16

申请号：US10191941

申请日：2002-07-09

Applicant: Kak-Shan Shia ,  Shin-Ru Shih ,  Chung-Ming Chang ,  Jyh-Haur Chern ,  Wen-Tai Li ,  Shu-Jen Chen ,  Ming-Chu Hsu

Inventor： Kak-Shan Shia ,  Shin-Ru Shih ,  Chung-Ming Chang ,  Jyh-Haur Chern ,  Wen-Tai Li ,  Shu-Jen Chen ,  Ming-Chu Hsu

IPC: A61K3144

CPC classification number: C07D233/32 ,  C07D401/04 ,  C07D401/14 ,  C07D405/12 ,  C07D417/12

Abstract: A compound having the formula: in which R1, R2, R3, T, W, m, x, and y are defined as in the specification. Also disclosed is a method of treating enterovirus infection by using a compound described above.

Abstract translation: 具有下式的化合物：其中R 1，R 2，R 3，T，W，m，x和y如说明书中所定义。 还公开了使用上述化合物治疗肠道病毒感染的方法。

公开(公告)号：US07367632B2

公开(公告)日：2008-05-06

申请号：US11304952

申请日：2005-12-14

Applicant: Chung Ming Chang

Inventor： Chung Ming Chang

IPC: B62L1/00 ,  B62D27/06

CPC classification number: B60B27/0052 ,  B60B27/023 ,  F16D65/12 ,  F16D2065/1384 ,  F16D2065/1392

Abstract: A hub assembly for a disk brake of a bicycle includes a support shaft, a hub body pivotally mounted on the support shaft and provided with two drum disks, a mounting portion protruding from one of the drum disks, a threaded section protruding from the mounting portion, a brake disk resting on the end face of the mounting portion, and a chainwheel screwed onto the threaded section and pressing the brake disk so that the brake disk is clamped between the mounting portion and the chainwheel closely. Thus, the brake disk is mounted on and detached from the hub body by screwing and unscrewing the chainwheel, so that the hub assembly is assembled and disassembled easily and rapidly, thereby facilitating a user assembling and disassembling the hub assembly.

Abstract translation: 一种用于自行车的盘式制动器的轮毂组件，包括支承轴，枢转地安装在支撑轴上并设置有两个鼓盘的轮毂体，从鼓盘之一突出的安装部分，从安装部分突出的螺纹部分 ，安装在安装部分的端面上的制动盘，以及拧在螺纹部分上并按压制动盘的链轮，使得制动盘紧紧地夹在安装部分和链轮之间。 因此，通过旋拧和旋转链轮将制动盘安装在轮毂体上并从轮毂主体上拆下，从而容易且快速地组装和拆卸轮毂组件，从而便于使用者组装和拆卸轮毂组件。

公开(公告)号：US06390356B1

公开(公告)日：2002-05-21

申请号：US09693951

申请日：2000-10-23

Applicant: Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Chia-Chieh Hu ,  Hui-Pin Chen ,  Ning Huang ,  Feng Chang Tu ,  Chung Ming Chang ,  Hua Wen Chiang ,  Hsuan Jui Chang

Inventor： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Chia-Chieh Hu ,  Hui-Pin Chen ,  Ning Huang ,  Feng Chang Tu ,  Chung Ming Chang ,  Hua Wen Chiang ,  Hsuan Jui Chang

IPC: B23K3512

CPC classification number: H01L21/4853 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of forming cylindrical bumps on a substrate for integrated circuits includes the steps of: forming copper circuits on a board of a substrate by means of electroplating; covering said board with a screening material; forming openings in said screening material to align with copper circuits on said board, filling pure copper or high melting point metal into said openings by electroplating to form cylindrical projections; forming a layer of solder alloy on an upper end of each of said cylindrical projections to be even with an upper surface of said screening material, and removing said screening material to leave the cylindrical bumps, whereby the engagement operation between the die and the substrate can be facilitated and the manufacture of the die can be easier.

Abstract translation: 在用于集成电路的基板上形成圆柱形凸块的方法包括以下步骤：通过电镀在基板的基板上形成铜电路; 用筛选材料覆盖所述板; 在所述屏蔽材料中形成开口以与所述板上的铜电路对准，通过电镀将纯铜或高熔点金属填充到所述开口中以形成圆柱形突起; 在每个所述圆柱形突起的上端上形成一层焊料合金，以使所述屏蔽材料的上表面均匀，并且移除所述筛选材料以留下圆柱形凸块，由此模具和基板之间的接合操作 有利于模具的制造更容易。

公开(公告)号：US06358834B1

公开(公告)日：2002-03-19

申请号：US09688123

申请日：2000-10-16

Applicant: Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Hsuan Jui Chang ,  Hui-Pin Chen ,  Ning Huang ,  Feng-Chang Tu ,  Chung-Ming Chang ,  Hua Wen Chiang ,  Chia-Chieh Hu

Inventor： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Hsuan Jui Chang ,  Hui-Pin Chen ,  Ning Huang ,  Feng-Chang Tu ,  Chung-Ming Chang ,  Hua Wen Chiang ,  Chia-Chieh Hu

IPC: H01L23488

CPC classification number: H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/1225 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05099

Abstract: A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.

Abstract translation: 在晶片上形成金属凸块的方法包括以下步骤：将耐热和稳定的合成胶带粘附在晶片的顶部上，通过合成胶带穿孔，在合成胶带上形成盲孔， 冶金层（UBM），通过推动器将焊膏填充到盲孔中，熔化然后将焊膏冷却到焊料块中，去除合成胶带以暴露焊料块，并熔化焊料块以形成球形焊料 磕碰。

公开(公告)号：US20130004939A1

公开(公告)日：2013-01-03

申请号：US13135280

申请日：2011-06-30

Applicant: Chung-Ming Chang ,  Chiuan-Chian Chiou

Inventor： Chung-Ming Chang ,  Chiuan-Chian Chiou

IPC: C12Q1/70

CPC classification number: G01N33/54313 ,  G01N33/56983 ,  G01N2333/11

Abstract: Fetuin-beads, a manufacturing method thereof and a method of concentrating and detecting influenza virus by the fetuin-beads are disclosed. The method of concentrating and detecting an influenza virus by the fetuin-beads comprises the steps of preparing fetuin-beads; mixing the fetuin-beads and a solution capable of providing salt ions to obtain a fetuin-bead solution; mixing the fetuin-bead solution and a sample comprising the influenza virus to concentrate the influenza virus onto the fetuin-beads to obtain a plurality of fetuin bead-influenza virus combinations; and collecting the fetuin bead-influenza virus combinations and using a virus testing method to detect the influenza virus on the fetuin bead-influenza virus combinations. Therefore, an easy and fast method to detect the influenza virus with timeliness and high accuracy is provided.

Abstract translation: 公开了胎儿球珠，其制造方法和胎球蛋白珠集中和检测流感病毒的方法。 通过胎球蛋白珠浓缩和检测流感病毒的方法包括制备胎球蛋白珠的步骤; 混合胎球蛋白珠和能够提供盐离子以获得胎球蛋白珠溶液的溶液; 将胎球蛋白珠溶液和包含流感病毒的样品混合以将流感病毒浓缩到胎球蛋白珠上以获得多种胎球蛋白珠流感病毒组合; 并收集胎球蛋白珠流感病毒组合，并使用病毒检测方法检测胎牛血清流感病毒组合中的流感病毒。 因此，提供了一种以及时和高精度检测流感病毒的简便快捷的方法。

公开(公告)号：US20070019405A1

公开(公告)日：2007-01-25

申请号：US11184953

申请日：2005-07-20

Applicant: Chung-Ming Chang ,  Tung-Tsai Chang

Inventor： Chung-Ming Chang ,  Tung-Tsai Chang

IPC: F21V21/00

CPC classification number: F21L13/06 ,  F21Y2115/10

Abstract: A portable long-running lighting device having a manual power generator of the present invention can generate electricity effectively and also can radiate for a long time. The portable long-running lighting device includes a manual power generator module, an electricity storage module, an LED (light-emitting diode) module and a housing. The manual power generator module includes an electricity generator, a transmission mechanism and a base. The electricity storage module is coupled to an electricity generator of the manual power generator module. The LED module includes a plurality of light-emitting diodes and a circuit. The circuit further includes a power saving circuit coupled between the electricity storage module and the light-emitting diodes. With a three-stage discharge mode, a discharge speed of the electricity storage module can be stabilized, so as to achieve an electricity saving effect.

Abstract translation: 具有本发明的手动发电机的便携式长跑照明装置可以有效地发电，并且也可长时间地辐射。 便携式长跑照明装置包括手动发电机模块，蓄电模块，LED（发光二极管）模块和壳体。 手动发电机模块包括发电机，变速机构和基座。 电力存储模块耦合到手动发电机模块的发电机。 LED模块包括多个发光二极管和电路。 电路还包括耦合在蓄电模块和发光二极管之间的节电电路。 通过三级放电模式，能够使蓄电模块的放电速度稳定，从而实现节电效果。

公开(公告)号：US06499648B2

公开(公告)日：2002-12-31

申请号：US09988097

申请日：2001-11-19

Applicant: Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

Inventor： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

IPC: B23K3102

CPC classification number: B23K20/007 ,  B23K3/0623 ,  H01L24/11 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

Abstract translation: 用于制造金属凸块的装置包括：硬锥形管状构件，在其上部具有垂直圆锥形通道，在其下部具有比直立的垂直圆锥形通道更大的钟形腔，位于垂直方向 圆锥形通道，以及直径比钟形室大的圆形凹槽，位于钟形室下面并与钟形腔连通，从而形成具有表面的毛细管。