公开(公告)号：US06499648B2

公开(公告)日：2002-12-31

申请号：US09988097

申请日：2001-11-19

申请人： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

发明人： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

IPC分类号： B23K3102

CPC分类号： B23K20/007 ,  B23K3/0623 ,  H01L24/11 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207

摘要： A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

摘要翻译： 用于制造金属凸块的装置包括：硬锥形管状构件，在其上部具有垂直圆锥形通道，在其下部具有比直立的垂直圆锥形通道更大的钟形腔，位于垂直方向 圆锥形通道，以及直径比钟形室大的圆形凹槽，位于钟形室下面并与钟形腔连通，从而形成具有表面的毛细管。

公开(公告)号：US06390356B1

公开(公告)日：2002-05-21

申请号：US09693951

申请日：2000-10-23

申请人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Chia-Chieh Hu ,  Hui-Pin Chen ,  Ning Huang ,  Feng Chang Tu ,  Chung Ming Chang ,  Hua Wen Chiang ,  Hsuan Jui Chang

发明人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Chia-Chieh Hu ,  Hui-Pin Chen ,  Ning Huang ,  Feng Chang Tu ,  Chung Ming Chang ,  Hua Wen Chiang ,  Hsuan Jui Chang

IPC分类号： B23K3512

CPC分类号： H01L21/4853 ,  H01L21/4846 ,  H01L23/49811 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method of forming cylindrical bumps on a substrate for integrated circuits includes the steps of: forming copper circuits on a board of a substrate by means of electroplating; covering said board with a screening material; forming openings in said screening material to align with copper circuits on said board, filling pure copper or high melting point metal into said openings by electroplating to form cylindrical projections; forming a layer of solder alloy on an upper end of each of said cylindrical projections to be even with an upper surface of said screening material, and removing said screening material to leave the cylindrical bumps, whereby the engagement operation between the die and the substrate can be facilitated and the manufacture of the die can be easier.

摘要翻译： 在用于集成电路的基板上形成圆柱形凸块的方法包括以下步骤：通过电镀在基板的基板上形成铜电路; 用筛选材料覆盖所述板; 在所述屏蔽材料中形成开口以与所述板上的铜电路对准，通过电镀将纯铜或高熔点金属填充到所述开口中以形成圆柱形突起; 在每个所述圆柱形突起的上端上形成一层焊料合金，以使所述屏蔽材料的上表面均匀，并且移除所述筛选材料以留下圆柱形凸块，由此模具和基板之间的接合操作 有利于模具的制造更容易。

公开(公告)号：US06358834B1

公开(公告)日：2002-03-19

申请号：US09688123

申请日：2000-10-16

申请人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Hsuan Jui Chang ,  Hui-Pin Chen ,  Ning Huang ,  Feng-Chang Tu ,  Chung-Ming Chang ,  Hua Wen Chiang ,  Chia-Chieh Hu

发明人： Wen Lo Shieh ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Hsuan Jui Chang ,  Hui-Pin Chen ,  Ning Huang ,  Feng-Chang Tu ,  Chung-Ming Chang ,  Hua Wen Chiang ,  Chia-Chieh Hu

IPC分类号： H01L23488

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/1225 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05099

摘要： A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.

摘要翻译： 在晶片上形成金属凸块的方法包括以下步骤：将耐热和稳定的合成胶带粘附在晶片的顶部上，通过合成胶带穿孔，在合成胶带上形成盲孔， 冶金层（UBM），通过推动器将焊膏填充到盲孔中，熔化然后将焊膏冷却到焊料块中，去除合成胶带以暴露焊料块，并熔化焊料块以形成球形焊料 磕碰。

公开(公告)号：US06567270B2

公开(公告)日：2003-05-20

申请号：US09988094

申请日：2001-11-19

申请人： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

发明人： Wen-Lo Shieh ,  Ning Huang ,  Hui-Pin Chen ,  Hua-Wen Chiang ,  Chung-Ming Chang ,  Feng-Chang Tu ,  Fu-Yu Huang ,  Hsuan-Jui Chang ,  Chia-Chieh Hu ,  Wen-Long Leu

IPC分类号： H05K720

CPC分类号： H01L23/055 ,  H01L23/4093 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/00

摘要： A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

摘要翻译： 具有冷却装置的半导体芯片封装包括适于覆盖至少半导体芯片的散热器，其特征在于，所述散热器具有倒置的U形横截面，从而在其内底部形成适于覆盖至少半导体 芯片和从所述散热器的周向下边缘向下延伸的多个销，每个所述销形成有颈部，扩大的头部和将所述颈部和所述扩大的头部分离成两部分的开口狭槽，由此包装 可以快速地从半导体芯片中去除热量，滤除噪声并降低电感。

公开(公告)号：US06274491B1

公开(公告)日：2001-08-14

申请号：US09636315

申请日：2000-08-11

申请人： Wan Le Xie ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Ning Huang ,  Chung Ming Chang ,  Hui-Pin Chen ,  Chia-Chieh Hu ,  Feng Chang Tu ,  Hsuan Jui Chang ,  Hua Wen Chiang

发明人： Wan Le Xie ,  Fu Yu Huang ,  Yung-Cheng Chuang ,  Ning Huang ,  Chung Ming Chang ,  Hui-Pin Chen ,  Chia-Chieh Hu ,  Feng Chang Tu ,  Hsuan Jui Chang ,  Hua Wen Chiang

IPC分类号： H01L2144

CPC分类号： H05K3/4092 ,  H01L21/4846 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/062 ,  H05K3/108 ,  H05K3/3473 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/0394 ,  H01L2924/00

摘要： A process of manufacturing thin ball array substrates includes the steps of: using a layer of polyimide film as a carrier, electroplating a thin copper layer on the polyimide film, electroplating a thick copper layer on the thin copper layer, applying photosensitive coating layers on both sides of the carrier, mounting two masks with optically transmissible circuit tracks on two sides of the carrier and then processing the carrier with exposure treatment, processing the carrier with development treatment so as to remove the photosensitive coating layers aligned with the circuit track thereby forming recessed circuit tracks on the photosensitive coating layers, electroplating a copper layer on a top of the carrier thereby forming an additional copper layer on the thick copper layer, etching a bottom of the carrier to remove the upper recessed circuit track thereon, coating the copper layer on the upper recessed circuit track with soldering metallic material so as to make a top of the soldering metallic material, washing away the photosensitive coating layers with chemical agent, and removing surplus copper layer to remain in circuit lines and the soldering metallic material, whereby a thin ball grid array substrate with thicker circuit lines without remaining electroplating lines can be obtained.

摘要翻译： 制造薄球阵列基板的方法包括以下步骤：使用聚酰亚胺膜作为载体，在聚酰亚胺膜上电镀薄铜层，在薄铜层上电镀厚铜层，在两层上施加感光涂层 在载体的两侧安装具有光学传输电路轨道的两个掩模，然后用曝光处理处理载体，通过显影处理处理载体，以除去与电路轨迹对准的感光涂层，从而形成凹陷 在光敏涂层上的电路轨迹，在载体的顶部上电镀铜层，从而在厚铜层上形成附加的铜层，蚀刻载体的底部以除去其上的凹陷电路轨道，将铜层涂覆在 具有焊接金属材料的上凹形电路轨道，以便形成顶部 用化学试剂洗涤光敏涂层，除去多余的铜层，保留在电路线和焊接金属材料中，从而可以获得具有较厚电路线而不残留电镀线的薄球栅阵列基板。