Measuring surfactant concentration in plating solutions
    1.
    发明授权
    Measuring surfactant concentration in plating solutions 失效
    测量电镀溶液中的表面活性剂浓度

    公开(公告)号:US4812210A

    公开(公告)日:1989-03-14

    申请号:US109008

    申请日:1987-10-16

    IPC分类号: G01N27/416 G01N27/46

    CPC分类号: G01N27/416

    摘要: An arrangement for measuring the concentration of surfactants in a electrolyte containing metal ions includes applying a DC bias voltage and a modulated voltage to a counter electrode. The phase angle between the modulated voltage and the current response to the modulated voltage at a working electrode is correlated to the surfactant concentration.

    摘要翻译: 用于测量含有金属离子的电解质中的表面活性剂的浓度的装置包括向对电极施加DC偏置电压和调制电压。 调制电压和电流对工作电极的调制电压响应的相位角与表面活性剂浓度有关。

    Method of fabricating a 3-dimensional tool master
    2.
    发明授权
    Method of fabricating a 3-dimensional tool master 有权
    三维工具主体的制作方法

    公开(公告)号:US06350360B1

    公开(公告)日:2002-02-26

    申请号:US09544703

    申请日:2000-04-07

    IPC分类号: C25D100

    摘要: The invention is a method for the fabrication of an imprint tool master. The process begins with a metallic substrate. A layer of photoresist is placed onto the metallic substrate and a image pattern mask is then aligned to the mask. The mask pattern has opaque portions that block exposure light and “open” or transparent portions which transmit exposure light. The photoresist layer is then exposed to light transmitted through the “open” portions of the first image pattern mask and the mask is then removed. A second layer of photoresist then can be placed onto the first photoresist layer and a second image pattern mask may be placed on the second layer of photoresist. The second layer of photoresist is exposed to light, as before, and the second mask removed. The photoresist layers are developed simultaneously to produce a multi-level master mandrel upon which a conductive film is formed. A tool master can now be formed onto the conductive film. An imprint tool is then produced from the tool master. In one embodiment, nickel is electroplated onto the tool master to produce a three-dimensional imprint tool.

    摘要翻译: 本发明是用于制造压印工具母版的方法。 该过程开始于金属基底。 将一层光致抗蚀剂放置在金属基底上,然后将图像图案掩模与掩模对准。 掩模图案具有不透明部分,其阻挡曝光光和“打开”或透射曝光光的透明部分。 然后将光致抗蚀剂层暴露于通过第一图案掩模的“打开”部分透射的光,然后除去掩模。 然后可以将第二层光致抗蚀剂放置在第一光致抗蚀剂层上,并且可以在第二层光致抗蚀剂上放置第二图案掩模。 如前所述,第二层光致抗蚀剂暴露于光,并移除第二掩模。 光致抗蚀剂层被同时显影以产生形成导电膜的多级主心轴。 现在可以在导电膜上形成工具主体。 然后从工具主机生成压印工具。 在一个实施例中,将镍电镀到工具主体上以产生三维压印工具。

    Apparatus and method for electroforming high aspect ratio micro-parts
    3.
    发明授权
    Apparatus and method for electroforming high aspect ratio micro-parts 有权
    用于电铸高纵横比微零件的装置和方法

    公开(公告)号:US07608174B1

    公开(公告)日:2009-10-27

    申请号:US11599766

    申请日:2006-11-14

    IPC分类号: B23H7/26

    摘要: A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.

    摘要翻译: 公开了一种固定装置,以更容易地将工件以适当的取向和间隔与电化学电镀浴中的密封电互连相连接。 工件可以是任何平面的金属或非金属基底,例如通常用于LIGA或微系统制造的硅晶片。 所描述的夹具允许工件深深地浸入电解池中,面向上,并且允许容易地从一个单元转移到另一个单元。 边缘,背面和电气连接被密封并保护电解质。