公开(公告)号：US06641254B1

公开(公告)日：2003-11-04

申请号：US10121394

申请日：2002-04-12

申请人： William R Boucher ,  Michael G Groh ,  Todd A. Berdahl

发明人： William R Boucher ,  Michael G Groh ,  Todd A. Berdahl

IPC分类号： B41J216

CPC分类号： H01L23/3185 ,  B41J2/14072 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48764 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic device includes a substrate, a substrate electrical connector disposed on the substrate, and a carrier lead electrically coupled to the substrate electrical connector. In addition, the electronic device further includes a polymer enclosing the substrate electrical connector, and an inorganic film disposed over the substrate electrical connector in contact with the polymer.

摘要翻译： 电子设备包括基板，设置在基板上的基板电连接器以及电耦合到基板电连接器的载体引线。 另外，电子装置还包括封装基板电连接器的聚合物和设置在与聚合物接触的基板电连接器上的无机膜。