公开(公告)号：US07308008B2

公开(公告)日：2007-12-11

申请号：US10705620

申请日：2003-11-10

申请人： William R. Freeman ,  Hong Jin Jiang ,  Dallas Meyer

发明人： William R. Freeman ,  Hong Jin Jiang ,  Dallas Meyer

IPC分类号： H01S3/04 ,  F25B21/00 ,  F25B21/02

CPC分类号： H01S5/02469 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01S5/02476 ,  H01S5/06804 ,  H01L2924/00

摘要： A system and method for controlling the temperature of a heat-generating component such as a laser. A microelectromechanical system for controlling the temperature of the heat-generating component includes a magnetic heat sink device, a temperature sensor, and control circuitry. The temperature sensor detects the temperature of the heat-generating component through the heat sink and feeds the sensed temperature to the control circuitry. The detected temperature is compared to a predetermined temperature set point. When the detected temperature is higher than the temperature set point, a command is sent to the magnetic heat sink to take more heat out of the heat-generating component. When the detected temperature is lower than the temperature set point, a command is sent to the magnetic heat sink to take less heat out of the heat-generating component. One embodiment of a magnetic heat sink device includes a laser system, an actuator system, and a heat sink material disposed between the laser system and the actuator system.

摘要翻译： 用于控制诸如激光器的发热部件的温度的系统和方法。 用于控制发热部件的温度的微电子机械系统包括磁性散热装置，温度传感器和控制电路。 温度传感器通过散热器检测发热部件的温度，并将检测到的温度馈送到控制电路。 将检测到的温度与预定温度设定点进行比较。 当检测到的温度高于温度设定值时，将一个命令发送到磁性散热器，以将较多的热量从发热部件中取出。 当检测到的温度低于温度设定值时，将一个命令发送到磁性散热器，以将较少的热量从发热部件中取出。 磁散热装置的一个实施例包括激光系统，致动器系统和布置在激光系统和致动器系统之间的散热材料。

公开(公告)号：US07361593B2

公开(公告)日：2008-04-22

申请号：US11027745

申请日：2004-12-30

申请人： William R. Freeman ,  Hong Jin Jiang

发明人： William R. Freeman ,  Hong Jin Jiang

IPC分类号： H01L21/44

CPC分类号： H01L24/83 ,  H01L21/486 ,  H01L23/15 ,  H01L24/26 ,  H01L2224/8385 ,  H01L2224/9202 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/4614 ,  H05K2201/09536 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2201/10992 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

摘要： Exemplary embodiments of the present invention illustrate methods to electrically connect multiple layers of a substrate. A first and second layer each has at least one electrical trace on a surface thereof. The substrate includes an interposer structure attached to the second layer and separating the first and second layers on at least a portion of a perimeter of the first and second layers. The method includes a steps for forming a via in the first layer, placing a first electrically conductive substance in the via, placing a second electrically conductive substance on the second layer adjacent said via, and heating an area around said via and said second electrically conductive substance until said first and second electrically conductive substances at least partially melt to form the electrical connection.

摘要翻译： 本发明的示例性实施例示出了电连接衬底的多个层的方法。 第一层和第二层各自在其表面上具有至少一个电迹线。 衬底包括附接到第二层并且在第一层和第二层的周边的至少一部分上分离第一层和第二层的插入件结构。 该方法包括用于在第一层中形成通孔的步骤，将第一导电物质放置在通孔中，将第二导电物质放置在邻近所述通孔的第二层上，并且加热所述通孔周围的区域和所述第二导电 物质，直到所述第一和第二导电物质至少部分地熔化以形成电连接。

公开(公告)号：US07259466B2

公开(公告)日：2007-08-21

申请号：US10740241

申请日：2003-12-17

申请人： William Freeman ,  Hong Jin Jiang

发明人： William Freeman ,  Hong Jin Jiang

IPC分类号： H01L29/80 ,  H01L31/112

CPC分类号： H01L24/26 ,  H01L21/48 ,  H01L24/83 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0179 ,  H01L2924/00

摘要： Exemplary embodiments of the present invention are drawn to improved systems and process for anodically bonding multiple substrate wafers to each other at low temperatures. At least one circuit wafer having printed circuits thereon is bonded to an interposer wafer by applying an amorphous thin film between the wafers. A low voltage is applied across the wafers to heat the wafers and to cause bonding of the wafers. Multiple circuit and interposer wafers can be used. The bonding temperature is low enough that soldered connections on the circuit wafers will not flow or otherwise distort, thus maintaining electrical integrity.

摘要翻译： 本发明的示例性实施例涉及在低温下将多个衬底晶片彼此阳极结合的改进的系统和工艺。 其上具有印刷电路的至少一个电路晶片通过在晶片之间施加无定形薄膜而与内插器晶片接合。 跨晶片施加低电压以加热晶片并引起晶片的结合。 可以使用多电路和插入晶片。 接合温度足够低，电路晶片上的焊接连接不会流动或以其他方式扭曲，从而保持电气完整性。

公开(公告)号：US06940627B2

公开(公告)日：2005-09-06

申请号：US10697766

申请日：2003-10-30

申请人： William Freeman ,  David Rosseinsky ,  Hong Jin Jiang ,  Andrew Soutar

发明人： William Freeman ,  David Rosseinsky ,  Hong Jin Jiang ,  Andrew Soutar

IPC分类号： G02F1/15 ,  G02F1/163

CPC分类号： G02F1/163 ,  G02F2201/58

摘要： A system and method for controlling an electrochromic device is provided. The system comprises a light source that produces an input light signal, and an electrochromic window configured to attenuate the input light signal by a certain amount and transmit a resulting attenuated light signal. An optical detector is configured to detect an optical property of the attenuated light signal, and a power module is connected to the electrochromic window and the detector. The power module generates a pulse-width modulated power signal and inputs the power signal to the electrochromic window. The power signal is modulated by an amount based on the detected optical property of the attenuated light signal. A control circuit for an electrochromic device is also disclosed.

摘要翻译： 提供了一种用于控制电致变色装置的系统和方法。 该系统包括产生输入光信号的光源和被配置为使输入光信号衰减一定量并传送所得到的衰减光信号的电致变色窗。 光检测器被配置为检测衰减的光信号的光学特性，并且功率模块连接到电致变色窗和检测器。 电源模块产生脉宽调制功率信号，并将电源信号输入到电致变色窗口。 功率信号由基于检测到的衰减光信号的光学特性的量调制。 还公开了一种用于电致变色器件的控制电路。