Air ventilation cooling systems for a portable device
    1.
    发明申请
    Air ventilation cooling systems for a portable device 失效
    便携式设备的空气通风冷却系统

    公开(公告)号:US20050231908A1

    公开(公告)日:2005-10-20

    申请号:US10824883

    申请日:2004-04-14

    CPC classification number: H01M8/04014

    Abstract: Air ventilation cooling systems are described for operation in a portable power device. Each air ventilation system comprises a cord stand in a structure that allows efficient heat dissipation generated from a power module. In a first aspect of the invention, a portable power device with natural convection for heat transfer is disclosed. In a second aspect of the invention, portable power devices with forced convection for heat transfer are disclosed. A portable power device in a natural convection mode comprises an output cord; and a stand, coupled to the output cord, for mounting a power module in a substantially vertical orientation, the stand having a base with a first vertical piece extending from the base to a first fin that is parallel to the base and having a second vertical piece extending from the base to a second fin that is parallel to the base, the power module plugging into the stand for creating a first gap along an edge of the first fin that is adjacent to the a first side of the power module and creating a second gap along an edge of the second fin that is adjacent to the second side of the power module, the stand allowing vertical heat dissipation generated by the power module with air flow vertically through the first and second gaps.

    Abstract translation: 空气通风冷却系统被描述为在便携式电力设备中操作。 每个空气通风系统包括一个能够从功率模块产生的高效散热的结构的电线架。 在本发明的第一方面,公开了一种具有用于传热的自然对流的便携式电力装置。 在本发明的第二方面中,公开了具有用于传热的强制对流的便携式电力装置。 自然对流模式的便携式电源装置包括输出线; 以及与所述输出线耦合的支架,用于将功率模块安装在基本上垂直的方向上,所述支架具有底座,所述基座具有从所述基座延伸到第一鳍片的第一垂直件,所述第一鳍片平行于所述基座并且具有第二垂直 从基座延伸到与基座平行的第二鳍片,功率模块插入支架,用于沿与第一鳍片的边缘相邻的功率模块的第一侧产生第一间隙,并且产生 第二间隙沿着第二鳍片的与功率模块的第二侧相邻的边缘,支架允许由功率模块产生的垂直散热,空气沿着第一和第二间隙垂直流动。

    DEVICE AND METHOD FOR PROVIDING RADIATION OCCLUSION AND AERO-THERMAL PROTECTION
    2.
    发明申请
    DEVICE AND METHOD FOR PROVIDING RADIATION OCCLUSION AND AERO-THERMAL PROTECTION 有权
    用于提供辐射消融和空气保护的装置和方法

    公开(公告)号:US20100270430A1

    公开(公告)日:2010-10-28

    申请号:US11679324

    申请日:2007-02-27

    CPC classification number: B23P11/005 B33Y80/00 Y10T29/49826

    Abstract: An extendable device for providing radiation occlusion and/or aero-thermal protection is disclosed. In various representative aspects, the present invention generally includes an extendable collar and a flexure configured to provide elastic properties (e.g., to facilitate stowage and/or deployment with respect to conformational disposition of the flexure). The flexure is coupled to a collar and is also coupled to the housing of an optical device.

    Abstract translation: 公开了一种用于提供辐射阻挡和/或空气 - 热保护的可延伸装置。 在各种代表性方面,本发明通常包括可延伸的套环和挠曲件,其构造成提供弹性性能(例如,以便于相对于挠曲件的构造布置来进行存放和/或展开)。 挠曲件联接到轴环并且还联接到光学装置的壳体。

    Chemical resistant semiconductor processing chamber bodies
    3.
    发明申请
    Chemical resistant semiconductor processing chamber bodies 审中-公开
    耐化学腐蚀的半导体加工室体

    公开(公告)号:US20080038448A1

    公开(公告)日:2008-02-14

    申请号:US11731075

    申请日:2007-03-30

    CPC classification number: H01L21/67051 H01L21/6719

    Abstract: In one embodiment a chamber body enabling semiconductor processing equipment to be at least partially housed in the chamber body, the semiconductor processing equipment being configured to process a substrate using fluids is disclosed. The chamber body being comprised of a base material implemented to form the chamber body, the chamber body defined by at least a bottom surface and wall surfaces that are integrally connected to the bottom surface to enable capture of overflows of fluids during the processing of the substrate over the chamber body. Additionally, the base material is metallic. The chamber body also has a primer coat material disposed over and on the base material. The primer coat material has metallic constituents to define an integrated bond with the base material along with non-metallic constituents. The chamber body further includes a main coat material disposed over and on the primer coat material. The main coat material being defined from non-metallic constituents, the non-metallic constituents of the main coat material defining an integrated bond with the primer coat material. The main coat material defined to completely overlie all the metallic constituents of the primer coat.

    Abstract translation: 在一个实施例中,公开了使半导体处理设备能够至少部分地容纳在室主体中的室主体,半导体处理设备被配置为使用流体处理衬底。 腔室主体包括被实施成形成腔室主体的基底材料,至少由底部表面限定的腔体主体和与底部表面一体连接的壁表面,以在衬底的处理期间捕获流体溢出物 在房间的身体。 另外,基材是金属的。 腔室主体还具有设置在基底材料上方的底漆涂层材料。 底涂层材料具有金属成分,以与非金属组分一起界定与基材的整体结合。 室主体还包括设置在底漆涂层材料上和之上的主涂层材料。 主涂层材料由非金属组分定义,主涂层材料的非金属组分限定与底漆涂层材料的整体结合。 主涂层材料被定义为完全覆盖底漆涂层的所有金属成分。

    Power supply with reliable voltage feedback control
    5.
    发明申请
    Power supply with reliable voltage feedback control 失效
    电源具有可靠的电压反馈控制

    公开(公告)号:US20060290204A1

    公开(公告)日:2006-12-28

    申请号:US11152847

    申请日:2005-06-14

    Applicant: Wing Cheng

    Inventor: Wing Cheng

    CPC classification number: H02J1/10 Y10T307/50

    Abstract: A power supply having a control circuit for controlling an output of the power supply, and a voltage monitor circuit for detecting a voltage at a first location and providing the detected voltage to a second location in the control circuit independent of any difference in ground voltage between the first location and the second location. The control circuit is configured to control the output of the power supply in response to the detected voltage provided by the voltage monitor circuit.

    Abstract translation: 一种具有用于控制电源输出的控制电路的电源和用于检测第一位置处的电压并将检测到的电压提供给控制电路中的第二位置的电压监视电路,而与地电压之间的任何差异无关, 第一个位置和第二个位置。 控制电路被配置为响应于由电压监视器电路提供的检测电压来控制电源的输出。

    Device and method for providing radiation occlusion and aero-thermal protection
    6.
    发明授权
    Device and method for providing radiation occlusion and aero-thermal protection 有权
    用于提供辐射遮挡和航空热保护的装置和方法

    公开(公告)号:US08056858B2

    公开(公告)日:2011-11-15

    申请号:US11679324

    申请日:2007-02-27

    CPC classification number: B23P11/005 B33Y80/00 Y10T29/49826

    Abstract: An extendable device for providing radiation occlusion and/or aero-thermal protection is disclosed. In various representative aspects, the present invention generally includes an extendable collar and a flexure configured to provide elastic properties (e.g., to facilitate stowage and/or deployment with respect to conformational disposition of the flexure). The flexure is coupled to a collar and is also coupled to the housing of an optical device.

    Abstract translation: 公开了一种用于提供辐射阻挡和/或空气 - 热保护的可延伸装置。 在各种代表性方面,本发明通常包括可延伸的套环和挠曲件,其构造成提供弹性性能(例如,以便于相对于挠曲件的构造布置来进行存放和/或展开)。 挠曲件联接到轴环并且还联接到光学装置的壳体。

    Fast transition power supply
    7.
    发明申请
    Fast transition power supply 失效
    快速过渡电源

    公开(公告)号:US20060181155A1

    公开(公告)日:2006-08-17

    申请号:US11060230

    申请日:2005-02-17

    Applicant: Wing Cheng

    Inventor: Wing Cheng

    Abstract: A power supply includes at least one current source for providing current and a reference voltage generator for providing a first reference voltage and a second reference voltage. A control circuit selectively couples the current to the power supply output as a function of a monitored voltage, the first reference voltage, and the second reference voltage.

    Abstract translation: 电源包括用于提供电流的至少一个电流源和用于提供第一参考电压和第二参考电压的参考电压发生器。 控制电路根据所监视的电压,第一参考电压和第二参考电压选择性地将电流耦合到电源输出端。

    Method of operating a resonant push-pull converter in an above resonant frequency mode
    8.
    发明申请
    Method of operating a resonant push-pull converter in an above resonant frequency mode 有权
    在上述谐振频率模式下操作谐振推挽转换器的方法

    公开(公告)号:US20060139970A1

    公开(公告)日:2006-06-29

    申请号:US11021763

    申请日:2004-12-23

    Applicant: Wing Cheng

    Inventor: Wing Cheng

    CPC classification number: H02M3/3372 Y02B70/1433

    Abstract: A method is disclosed for operating a push-pull converter in an above resonant frequency operating mode, where the above resonant frequency operating mode produces a switching frequency that is higher than the natural operating resonant frequency of the converter circuit. This in turn means that the resonant period is longer than the turn-on period of each of the switches in the primary circuit. A method for operating a push-pull converter in an above resonant frequency mode, the push-pull converter having a first power switch and a second power switch operating in alternating sequence with each, the push pull converter having a transformer with a primary winding coupled to the first and second power switches and with a secondary winding coupled to a secondary circuit and an output capacitor, comprises generating an operating resonant frequency from a leakage inductance of said transformer in series with a capacitance; and generating a switching frequency for the power switches that is higher than the operating resonant frequency.

    Abstract translation: 公开了一种用于在上述谐振频率工作模式中操作推挽转换器的方法,其中上述谐振频率工作模式产生的开关频率高于转换器电路的自然工作谐振频率。 这又意味着谐振周期长于初级电路中每个开关的导通周期。 一种用于在上述谐振频率模式下操作推挽转换器的方法,所述推挽转换器具有第一功率开关和第二功率开关,其中每个与所述推挽转换器交替顺序工作,所述推挽转换器具有变压器,所述变压器具有初级绕组耦合 耦合到第一和第二功率开关以及耦合到次级电路和输出电容器的次级绕组,包括从所述变压器的漏电感产生与电容串联的工作谐振频率; 并产生高于工作谐振频率的功率开关的开关频率。

    Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber
    9.
    发明授权
    Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber 失效
    用于调节半导体晶片处理室中的处理套件的温度的装置

    公开(公告)号:US06795292B2

    公开(公告)日:2004-09-21

    申请号:US09861984

    申请日:2001-05-15

    CPC classification number: H01L21/67109 H01L21/67103

    Abstract: An apparatus for reducing by-product formation in a semiconductor wafer-processing chamber. In a first embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange. A collar is disposed over the peripheral flange defining a first gap therebetween, and circumscribes the chuck. A heater element is embedded within the collar and adapted for connection to a power source. In a second embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, and a collar having a heater element embedded therein. The collar is disposed over the peripheral flange to define a gap therebetween, and circumscribes the chuck. Moreover, a pedestal having a gas delivery system therein is disposed below the chuck and collar. In a third embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, a collar, and a waste ring having a heater element embedded therein. The waste ring is disposed over the peripheral flange defining a gap therebetween, and circumscribes the chuck. The collar is chucked to the waste ring, and the waste ring is chucked to a pedestal support. Moreover, the waste ring and pedestal each have a gas delivery system therein for regulating the temperature of the collar.

    Abstract translation: 一种用于减少半导体晶片处理室中副产物形成的装置。 在第一实施例中,该装置包括具有夹紧电极和径向延伸的周边凸缘的卡盘。 套环设置在周边凸缘之上,限定了它们之间的第一间隙,并限制卡盘。 加热器元件嵌入在轴环内并且适于连接到电源。 在第二实施例中,该装置包括具有夹紧电极和径向延伸的周边凸缘的卡盘以及嵌入其中的加热器元件的套环。 套环设置在周边凸缘上方以在其间形成间隙并限制卡盘。 此外,其中具有气体输送系统的基座设置在卡盘和轴环的下方。 在第三实施例中,该装置包括具有夹紧电极和径向延伸的周边凸缘,套环和具有嵌入其中的加热器元件的废料环的卡盘。 废环设置在周边凸缘之上,限定了它们之间的间隙,并且围绕卡盘。 将衣领卡在废物环上,将废物环卡在基座支架上。 此外,废环和底座各自具有用于调节套环温度的气体输送系统。

    Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas
    10.
    发明授权
    Method of fabricating a semiconductor wafer support chuck apparatus having small diameter gas distribution ports for distributing a heat transfer gas 失效
    制造具有用于分配传热气体的小直径气体分配端口的半导体晶片支撑卡盘装置的方法

    公开(公告)号:US06572814B2

    公开(公告)日:2003-06-03

    申请号:US09866353

    申请日:2001-05-24

    CPC classification number: H02N13/00 Y10T29/49149

    Abstract: A method of fabricating a semiconductor wafer support chuck apparatus having a first sintered layer and a second sintered layer. The method comprising the steps of providing the first sintered layer having a plurality of gas distribution ports and providing the second sintered layer having a plurality of grooves. The first sintered layer is stacked on top of the second sintered layer, where a diffusion bonding layer is disposed between the first sintered layer and the second sintered layer. Thereafter, the stacked first and second sintered layers are resintered such that the diffusion bonding layer joins the first and second sintered layers together to form a semiconductor wafer support apparatus.

    Abstract translation: 一种制造具有第一烧结层和第二烧结层的半导体晶片支撑卡盘装置的方法。 该方法包括以下步骤:提供具有多个气体分配端口的第一烧结层,并提供具有多个凹槽的第二烧结层。 第一烧结层堆叠在第二烧结层的顶部,在第一烧结层和第二烧结层之间设置扩散接合层。 然后,堆叠的第一和第二烧结层重新烧结,使得扩散接合层将第一和第二烧结层与第二烧结层结合在一起形成半导体晶片支撑装置。

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