公开(公告)号：USD985517S1

公开(公告)日：2023-05-09

申请号：US29821330

申请日：2021-12-29

Applicant: WOLFSPEED, INC.

Designer： Brice McPherson ,  Matthew Feurtado

Abstract: FIG. 1 is a front right side perspective view of a power module having pin fins;
FIG. 2 is a bottom right side perspective view of the power module having pin fins shown in FIG. 1;
FIG. 3 is a top view of the power module having pin fins shown in FIG. 1;
FIG. 4 is a left side view of the power module having pin fins shown in FIG. 1;
FIG. 5 is a right side view of the power module having pin fins shown in FIG. 1;
FIG. 6 is a bottom view of the power module having pin fins shown in FIG. 1;
FIG. 7 is a back side view of the power module having pin fins shown in FIG. 1; and,
FIG. 8 is a front side view of the power module having pin fins shown in FIG. 1.
In the drawings, the claimed design is defined by the shaded surfaces; broken lines immediately adjacent shaded surfaces represent boundaries of the claim and form no part thereof; all other broken lines depict unclaimed environmental subject matter and form no part of the claim.

公开(公告)号：US12159909B2

公开(公告)日：2024-12-03

申请号：US18504344

申请日：2023-11-08

Applicant: Wolfspeed, Inc.

Inventor： Daniel Jenner Lichtenwalner ,  Edward Robert Van Brunt ,  Thomas E. Harrington, III ,  Shadi Sabri ,  Brett Hull ,  Brice McPherson ,  Joe W. McPherson

IPC: H01L29/40 ,  H01L29/16

Abstract: Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.

公开(公告)号：US12150258B2

公开(公告)日：2024-11-19

申请号：US17736487

申请日：2022-05-04

Applicant: Wolfspeed, Inc.

Inventor： Brice McPherson ,  Shashwat Singh ,  Roberto M. Schupbach

IPC: H05K1/18 ,  H05K1/11 ,  H05K5/00 ,  H02M3/00

Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal.

公开(公告)号：US20240292575A1

公开(公告)日：2024-08-29

申请号：US18655878

申请日：2024-05-06

Applicant: Wolfspeed, Inc.

Inventor： Daniel Martin ,  Brice McPherson ,  Alexander Lostetter

IPC: H05K7/20 ,  G01R31/40 ,  H01L25/16 ,  H02M1/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/20909 ,  H01L25/165 ,  H05K1/0271 ,  H05K1/181 ,  H05K7/20509 ,  G01R31/40 ,  H02M1/0054

Abstract: The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate.

公开(公告)号：US11869948B2

公开(公告)日：2024-01-09

申请号：US17177641

申请日：2021-02-17

Applicant: Wolfspeed, Inc.

Inventor： Daniel Jenner Lichtenwalner ,  Edward Robert Van Brunt ,  Thomas E. Harrington, III ,  Shadi Sabri ,  Brett Hull ,  Brice McPherson ,  Joe W. McPherson

IPC: H01L29/40 ,  H01L29/16

CPC classification number: H01L29/404 ,  H01L29/1608

Abstract: Strategic placement and patterning of electrodes, vias, and metal runners can significantly reduce strain in a power semiconductor die. By modifying the path defining electrodes, vias, and metal runners, as well as patterning the material layers thereof, strain can be better managed to increase reliability of a power semiconductor die.

公开(公告)号：US20230411359A1

公开(公告)日：2023-12-21

申请号：US17844231

申请日：2022-06-20

Applicant: Wolfspeed, Inc.

Inventor： Brice McPherson

IPC: H01L25/07 ,  H01L23/00 ,  H01L23/495 ,  H01L23/34 ,  H01L23/367 ,  H01L23/31

CPC classification number: H01L25/072 ,  H01L24/37 ,  H01L23/49562 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/3107 ,  H01L2224/37012

Abstract: A power module has a substrate having a top side with a first device pad and a second device pad. A first plurality of vertical power devices is coupled to the first device pad via first drain contacts, and a second plurality of vertical power devices is coupled to the second device pad via second drain contacts to form part of a power circuit. A housing encompasses portions of the substrate, the first plurality of vertical power devices, and the second plurality of vertical power devices. A first power terminal extends through a top surface of the housing to the first device pad. A second power terminal extends through the top surface of the housing to the source contacts on a top side of the second plurality of vertical power devices. A third power terminal extends through a top surface of the housing to the second device pad.

公开(公告)号：US20230260861A1

公开(公告)日：2023-08-17

申请号：US17670174

申请日：2022-02-11

Applicant: Wolfspeed, Inc.

Inventor： Geza Dezsi ,  Devarajan Balaraman ,  Brice McPherson

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/3107 ,  H01L23/49568 ,  H01L23/49562 ,  H01L23/3735 ,  H01L23/562 ,  H01L29/78

Abstract: Semiconductor packages and, more particularly, semiconductor packages with increased power handling capabilities are disclosed. Semiconductor packages may include lead frame structures and corresponding housings that incorporate semiconductor die. To promote increased current and voltage capabilities, exemplary semiconductor packages include one or more arrangements of creepage extension structures, lead frame structures that may include integral thermal pads, additional thermal elements, and combinations thereof. Creepage extension structures may be arranged as part of top sides of semiconductor packages along with thermal pads of lead frame structures and additional thermal elements. Creepage extension structures may also be arranged as part of top sides and along on one or more peripheral edges of semiconductor packages to promote further increases in power handling.

公开(公告)号：US12199071B2

公开(公告)日：2025-01-14

申请号：US18429629

申请日：2024-02-01

Applicant: Wolfspeed, Inc.

Inventor： Brice McPherson ,  Shashwat Singh ,  Roberto M. Schupbach

IPC: H01L25/07 ,  H01L23/498 ,  H02M7/00 ,  H01L23/00 ,  H01L23/34 ,  H02M7/5387

Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal. The first and second input power terminals extend out of a first side of the housing, and the at least one output power terminal extends out of a second side of the housing, the first side being opposite the second side.

公开(公告)号：US20240274584A1

公开(公告)日：2024-08-15

申请号：US18429629

申请日：2024-02-01

Applicant: Wolfspeed, Inc.

Inventor： Brice McPherson ,  Shashwat Singh ,  Roberto M. Schupbach

IPC: H01L25/07 ,  H01L23/00 ,  H01L23/34 ,  H01L23/498 ,  H02M7/00 ,  H02M7/5387

CPC classification number: H01L25/072 ,  H01L23/49811 ,  H02M7/003 ,  H01L23/34 ,  H01L23/49861 ,  H01L24/48 ,  H01L2224/48105 ,  H01L2224/48175 ,  H01L2924/10272 ,  H01L2924/13091 ,  H02M7/5387

Abstract: A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal. The first and second input power terminals extend out of a first side of the housing, and the at least one output power terminal extends out of a second side of the housing, the first side being opposite the second side.

公开(公告)号：USD1036395S1

公开(公告)日：2024-07-23

申请号：US29855192

申请日：2022-09-30

Applicant: WOLFSPEED, INC.

Designer： Brice McPherson ,  Alexander Lostetter

Abstract: FIG. 1 is a right front side perspective view of the power module;
FIG. 2 is a top side view of the power module shown in FIG. 1;
FIG. 3 is a bottom side view of the power module shown in FIG. 1;
FIG. 4 is a right side view of the power module shown in FIG. 1;
FIG. 5 is a left side view of the power module shown in FIG. 1;
FIG. 6 is a front side view of the power module shown in FIG. 1; and,
FIG. 7 is a back side view of the power module shown in FIG. 1.
In the drawings, the claimed design is defined by the shaded surfaces; broken lines immediately adjacent shaded surfaces represent boundaries of the claim and form no part thereof; all other broken lines depict unclaimed environmental subject matter and form no part of the claim.