公开(公告)号：US06805974B2

公开(公告)日：2004-10-19

申请号：US10078020

申请日：2002-02-15

申请人： Won K. Choi ,  Charles C. Goldsmith ,  Timothy A. Gosselin ,  Donald W. Henderson ,  Sung K. Kang ,  Karl J. Puttlitz, Sr. ,  Da-Yuan Shih

发明人： Won K. Choi ,  Charles C. Goldsmith ,  Timothy A. Gosselin ,  Donald W. Henderson ,  Sung K. Kang ,  Karl J. Puttlitz, Sr. ,  Da-Yuan Shih

IPC分类号： B23K3526

CPC分类号： C22C13/00 ,  B23K35/262 ,  B23K2101/36 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  H01L2924/00

摘要： A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling &dgr;T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.

摘要翻译： 焊料组成及相关的形成方法。 焊料组合物包括基本上无铅的合金，其包括锡（Sn），银（Ag）和铜。 锡在合金中的重量百分比浓度至少为约90％。 银在合金中具有重量百分比浓度X. X足够小，当液态的合金通过冷却至固相Sn相成核的较低温度而固化时，基本上抑制了Ag 3 Sn板的形成。 该较低温度对应于相对于合金的共晶熔融温度的过冷度差ΔT。 或者，X可以为约4.0％以下，其中液化合金以足够高的冷却速度被冷却，以基本上抑制合金中的Ag 3 Sn板的形成。 铜在合金中的重量百分比浓度不超过约1.5％。

公开(公告)号：US5868304A

公开(公告)日：1999-02-09

申请号：US674559

申请日：1996-07-02

申请人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

发明人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

IPC分类号： H01L23/12 ,  B23K3/06 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34 ,  B23K31/02

CPC分类号： B23K3/0623 ,  H01L21/4853 ,  H01L23/49816 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/11334 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/0557 ,  H05K3/3478 ,  Y02P70/613

摘要： An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of opening corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.

摘要翻译： 具有包括成型焊料涂覆的金属球体的可插座凸块网格阵列的电子部件通过一种方法提供，该方法包括将焊接涂覆的金属球定位在具有对应于阵列的多个开口的对准装置中，所述开口优选地呈锥形 锥体的底部位于对准装置的上表面并且具有大于焊料涂覆的金属球的直径的直径。 开口构造成使得定位在开口中的球体部分地在对准装置的上表面上方延伸。 然后将衬底的焊盘与定位的球体接触，并且当焊料回流时，焊料在与焊料涂覆的金属球接触的衬底上的导电层之间形成结合，并且采取对准装置的形状和 其在金属球体的整个表面上保持焊料涂层。 还提供了一种用于制造这种可插座凸块网格阵列的装置。

公开(公告)号：US06287126B1

公开(公告)日：2001-09-11

申请号：US09344887

申请日：1999-06-25

申请人： Michael Berger ,  Lewis S. Goldmann ,  Harvey C. Hamel ,  Mario J. Interrante ,  Marlene W. Moyer ,  Thomas P. Moyer ,  Karl J. Puttlitz, Sr.

发明人： Michael Berger ,  Lewis S. Goldmann ,  Harvey C. Hamel ,  Mario J. Interrante ,  Marlene W. Moyer ,  Thomas P. Moyer ,  Karl J. Puttlitz, Sr.

IPC分类号： H01R1200

CPC分类号： H01R4/64

摘要： An electrical connector arrangement for connecting electronic devices to one another. The connector arrangement uses tensile members and compression members, at least the tensile members of which act to provide both an electrical connection between electronic devices and force over a range of distances to hold the devices together. The tensile members provides tensile force acting to hold the electronic devices together while the compression members provide an opposing compressive force over a range of distances which balances the tensile force to thereby form a cellforce connector used to connect an array of electrical contact points on one electronic device to a corresponding array of electrical contact points on another electronic device.

摘要翻译： 一种用于将电子设备彼此连接的电连接器装置。 连接器装置使用拉伸构件和压缩构件，其至少其拉伸构件用于提供电子装置之间的电连接并在一定距离范围内施力以将装置保持在一起。 拉伸构件提供作用以将电子装置保持在一起的张力，同时压缩构件在一定距离范围内提供相反的压缩力，其平衡拉伸力从而形成用于连接一个电子装置上的电接触点阵列的电池单元连接器 设备到另一电子设备上的对应的电接触点阵列。

公开(公告)号：US6070782A

公开(公告)日：2000-06-06

申请号：US113044

申请日：1998-07-09

申请人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

发明人： Peter Jeffrey Brofman ,  Balaram Ghosal ,  Raymond Alan Jackson ,  Kathleen Ann Lidestri ,  Karl J. Puttlitz, Sr. ,  William Edward Sablinski

IPC分类号： H01L23/498 ,  H05K3/34 ,  B23K101/38 ,  H01L23/48 ,  H05K1/00

CPC分类号： H01L23/49816 ,  H05K3/3478 ,  H01L2924/0002 ,  H05K2201/10234 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/3436

摘要： An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of openings corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.

摘要翻译： 具有包括成形焊料涂覆的金属球体的可插座凸块网格阵列的电子部件通过一种方法提供，该方法包括将焊接涂覆的金属球定位在具有对应于阵列的多个开口的对准装置中，所述开口优选地呈锥形 锥体的底部位于对准装置的上表面并且具有大于焊料涂覆的金属球的直径的直径。 开口构造成使得定位在开口中的球体部分地在对准装置的上表面上方延伸。 然后将衬底的焊盘与定位的球体接触，并且当焊料回流时，焊料在与焊料涂覆的金属球接触的衬底上的导电层之间形成结合，并且采取对准装置的形状和 其在金属球体的整个表面上保持焊料涂层。 还提供了一种用于制造这种可插座凸块网格阵列的装置。