THIN FILM TRANSISTOR ARRAY PANEL AND FABRICATION
    1.
    发明申请
    THIN FILM TRANSISTOR ARRAY PANEL AND FABRICATION 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US20100203715A1

    公开(公告)日:2010-08-12

    申请号:US12765698

    申请日:2010-04-22

    IPC分类号: H01L21/28

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    THIN FILM TRANSISTOR ARRAY PANEL AND FABRICATION
    2.
    发明申请
    THIN FILM TRANSISTOR ARRAY PANEL AND FABRICATION 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US20080203393A1

    公开(公告)日:2008-08-28

    申请号:US12099718

    申请日:2008-04-08

    IPC分类号: H01L27/088

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    Thin film transistor array panel and fabrication
    3.
    发明授权
    Thin film transistor array panel and fabrication 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US08173493B2

    公开(公告)日:2012-05-08

    申请号:US12765698

    申请日:2010-04-22

    IPC分类号: H01L21/00 H01L21/84

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    Manufacturing method of a thin film transistor array panel
    4.
    发明授权
    Manufacturing method of a thin film transistor array panel 有权
    薄膜晶体管阵列面板的制造方法

    公开(公告)号:US07425476B2

    公开(公告)日:2008-09-16

    申请号:US11242696

    申请日:2005-10-04

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a thin film transistor array panel includes forming a gate line including a gate electrode, forming a gate insulating layer on the gate line, forming a semiconductor stripe on the gate insulating layer; forming ohmic contacts on the semiconductor stripe, forming a data line including a source electrode and a drain electrode on the ohmic contacts, depositing a passivation layer on the data line and the drain electrode, and forming a pixel electrode connected to the drain electrode. The formation of the data line and the drain electrode, the ohmic contacts, and the semiconductor stripe includes depositing an intrinsic silicon layer, an extrinsic silicon layer, and a conductor layer on the gate insulating layer, forming a photoresist including a second portion corresponding to a channel area between the source electrode and the drain electrode, and a first portion corresponding to a wire area on the data line and the drain electrode, wherein the first portion is thicker than the second portion, etching the conductor layer corresponding to a remaining area except for the wire and the channel area using the photoresist as an etch mask, removing the second portion to expose the conductor layer on the channel areas, etching the intrinsic silicon layer and the extrinsic silicon layer on the remaining area, etching the conductor layer and the extrinsic silicon layer on the channel areas, and removing the first portion.

    摘要翻译: 制造薄膜晶体管阵列面板的方法包括:形成包括栅电极的栅极线,在栅极线上形成栅绝缘层,在栅绝缘层上形成半导体条; 在半导体条上形成欧姆接触,在欧姆接触上形成包括源电极和漏电极的数据线,在数据线和漏电极上沉积钝化层,并形成连接到漏电极的像素电极。 数据线和漏电极,欧姆接触和半导体条纹的形成包括在栅绝缘层上沉积本征硅层,非本征硅层和导体层,形成光致抗蚀剂,其包括对应于 源极电极和漏极电极之间的沟道区域,以及对应于数据线和漏极电极的导线区域的第一部分,其中第一部分比第二部分厚,蚀刻对应于剩余区域的导体层 除了使用光致抗蚀剂作为蚀刻掩模的导线和沟道区域之外,去除第二部分以暴露沟道区域上的导体层,蚀刻剩余区域上的本征硅层和非本征硅层,蚀刻导体层和 在通道区域上的非本征硅层,以及去除第一部分。

    Manufacturing method of a thin film transistor array panel
    5.
    发明申请
    Manufacturing method of a thin film transistor array panel 有权
    薄膜晶体管阵列面板的制造方法

    公开(公告)号:US20060073645A1

    公开(公告)日:2006-04-06

    申请号:US11242696

    申请日:2005-10-04

    IPC分类号: H01L21/84

    摘要: A method of manufacturing a thin film transistor array panel includes forming a gate line including a gate electrode, forming a gate insulating layer on the gate line, forming a semiconductor stripe on the gate insulating layer; forming ohmic contacts on the semiconductor stripe, forming a data line including a source electrode and a drain electrode on the ohmic contacts, depositing a passivation layer on the data line and the drain electrode, and forming a pixel electrode connected to the drain electrode. The formation of the data line and the drain electrode, the ohmic contacts, and the semiconductor stripe includes depositing an intrinsic silicon layer, an extrinsic silicon layer, and a conductor layer on the gate insulating layer, forming a photoresist including a second portion corresponding to a channel area between the source electrode and the drain electrode, and a first portion corresponding to a wire area on the data line and the drain electrode, wherein the first portion is thicker than the second portion, etching the conductor layer corresponding to a remaining area except for the wire and the channel area using the photoresist as an etch mask, removing the second portion to expose the conductor layer on the channel areas, etching the intrinsic silicon layer and the extrinsic silicon layer on the remaining area, etching the conductor layer and the extrinsic silicon layer on the channel areas, and removing the first portion.

    摘要翻译: 制造薄膜晶体管阵列面板的方法包括:形成包括栅电极的栅极线,在栅极线上形成栅绝缘层,在栅绝缘层上形成半导体条; 在半导体条上形成欧姆接触,在欧姆接触上形成包括源电极和漏电极的数据线,在数据线和漏电极上沉积钝化层,并形成连接到漏电极的像素电极。 数据线和漏电极,欧姆接触和半导体条纹的形成包括在栅绝缘层上沉积本征硅层,非本征硅层和导体层,形成光致抗蚀剂,其包括对应于 源极电极和漏极电极之间的沟道区域,以及对应于数据线和漏极电极的导线区域的第一部分,其中第一部分比第二部分厚,蚀刻对应于剩余区域的导体层 除了使用光致抗蚀剂作为蚀刻掩模的导线和沟道区域之外,去除第二部分以暴露沟道区域上的导体层,蚀刻剩余区域上的本征硅层和非本征硅层,蚀刻导体层和 在通道区域上的非本征硅层,以及去除第一部分。

    Thin film transistor array panel and fabrication
    6.
    发明授权
    Thin film transistor array panel and fabrication 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US07888675B2

    公开(公告)日:2011-02-15

    申请号:US12099718

    申请日:2008-04-08

    IPC分类号: H01L21/00

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    Thin film transistor array panel and fabrication
    7.
    发明授权
    Thin film transistor array panel and fabrication 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US07371621B2

    公开(公告)日:2008-05-13

    申请号:US11486330

    申请日:2006-07-12

    IPC分类号: H01L21/00

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。

    Thin film transistor array panel and fabrication
    8.
    发明申请
    Thin film transistor array panel and fabrication 有权
    薄膜晶体管阵列和制造

    公开(公告)号:US20070012967A1

    公开(公告)日:2007-01-18

    申请号:US11486330

    申请日:2006-07-12

    IPC分类号: H01L31/113

    摘要: The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.

    摘要翻译: 本发明提供一种薄膜晶体管阵列面板的制造方法,其包括在基板上形成栅极线; 在栅极线上形成栅极绝缘层,半导体层和欧姆接触; 形成包括Mo的第一导电膜,包括Al的第二导电膜和在欧姆接触上包含Mo的第三导电膜; 在所述第三导电膜上形成第一光致抗蚀剂图案; 使用第一光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜,欧姆接触和半导体层; 将第一光致抗蚀剂图案去除预定厚度以形成第二光致抗蚀剂图案; 使用第二光致抗蚀剂图案作为掩模蚀刻第一,第二和第三导电膜以暴露欧姆接触的一部分; 并使用含Cl气体和含F气体蚀刻暴露的欧姆接触。