公开(公告)号：US20240313781A1

公开(公告)日：2024-09-19

申请号：US18123160

申请日：2023-03-17

Applicant: XILINX, INC.

Inventor： Brian C. GAIDE ,  Sagheer AHMAD ,  Trevor J. BAUER ,  Kenneth MA ,  David P. SCHULTZ ,  John O'DWYER ,  Richard W. SWANSON ,  Bhuvanachandran K. NAIR ,  Millind MITTAL

IPC: H03K19/17736 ,  G01R31/317 ,  H03K19/0175 ,  H03K19/17796

CPC classification number: H03K19/17744 ,  G01R31/31701 ,  H03K19/017581 ,  H03K19/17796

Abstract: Embodiments herein describe connecting an ASIC to another integrated circuit (or die) using inter-die connections. In one embodiment, an ASIC includes a fabric sliver (e.g., a small region of programmable logic circuitry). Inter-die fabric extension connections are used to connect the fabric sliver in the ASIC to fabric (e.g., programmable logic) in the other integrated circuit. These connections effectively extend the fabric in the ASIC to include the fabric in the other integrated circuit. Hardened IP blocks in the ASIC can then use the fabric sliver and the inter-die extension connections to access computer resources in the other integrated circuit.