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公开(公告)号:US20210064529A1
公开(公告)日:2021-03-04
申请号:US16560217
申请日:2019-09-04
Applicant: XILINX, INC.
Inventor: Jaideep DASTIDAR , Millind MITTAL
IPC: G06F12/0811 , G06F12/0804 , G06F12/121
Abstract: The embodiments herein creates DCT mechanisms that initiate a DCT at the time the updated data is being evicted from the producer cache. These DCT mechanisms are applied when the producer is replacing the updated contents in its cache because the producer has either moved on to working on a different data set (e.g., a different task) or moved on to working on a different function, or when the producer-consumer task manager (e.g., a management unit) enforces software coherency by sending Cache Maintenance Operations (CMO). One advantage of the DCT mechanism is that because the direct cache transfer takes place at the time the updated data is being evicted, by the time the consumer begins its task, the updated contents have already been placed in its own cache or another cache within the cache hierarchy.
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公开(公告)号:US20240411715A1
公开(公告)日:2024-12-12
申请号:US18807703
申请日:2024-08-16
Applicant: XILINX, INC.
Inventor: Krishnan SRINIVASAN , Sagheer AHMAD , Ygal ARBEL , Millind MITTAL
Abstract: Embodiments herein describe using an adaptive chip-to-chip (C2C) interface to interconnect two chips, wherein the adaptive C2C interface includes circuitry for performing multiple different C2C protocols to communicate with the other chip. One or both of the chips in the C2C connection can include the adaptive C2C interface. During boot time, the adaptive C2C interface is configured to perform one of the different C2C protocols. During runtime, the chip then uses the selected C2C protocol to communicate with the other chip in the C2C connection.
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公开(公告)号:US20210382838A1
公开(公告)日:2021-12-09
申请号:US16894446
申请日:2020-06-05
Applicant: XILINX, INC.
Inventor: Millind MITTAL , Jaideep DASTIDAR
Abstract: Embodiments herein describe techniques for separating data transmitted between I/O functions in an integrated component and a host into separate data paths. In one embodiment, data packets are transmitted using a direct data path that bypasses a switch in the integrated component. In contrast, configuration packets (e.g., hot-swap, hot-add, hot-remove data, some types of descriptors, etc.) are transmitted to the switch which then forwards the configuration packets to their destination. The direct path for the data packets does not rely on switch connectivity (and its accompanying latency) to transport bandwidth sensitive traffic between the host and the I/O functions, and instead avoids (e.g., bypasses) the bandwidth, resource, store/forward, and latency properties of the switch. Meanwhile, the software compatibility attributes, such as hot plug attributes (which are not latency or bandwidth sensitive), continue to be supported by using the switch to provide a configuration data path.
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4.
公开(公告)号:US20230325333A1
公开(公告)日:2023-10-12
申请号:US18206045
申请日:2023-06-05
Applicant: XILINX, INC.
Inventor: Jaideep DASTIDAR , Millind MITTAL
CPC classification number: G06F13/4022 , G06F9/30043 , G06F13/1663 , G06F13/1668 , G06F2209/5011 , G06F2213/0038
Abstract: An integrated circuit (IC) for adaptive memory expansion scheme is proposed, which comprises: a home agent comprising a first memory expansion pool and a second memory expansion pool; a first port connecting the home agent to a first memory expansion device, where the first memory expansion device comprises a first memory pool; a second port connecting the home agent to a second memory expansion device, where the second memory expansion device comprises a second memory pool; a first address table mapping the first memory expansion pool to the first memory pool based on a size of the first memory expansion pool or a size of the first memory pool; and a second address table mapping the second memory expansion pool to the second memory pool based on a size of the second memory expansion pool or a size of the second memory pool.
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公开(公告)号:US20230195684A1
公开(公告)日:2023-06-22
申请号:US18112362
申请日:2023-02-21
Applicant: XILINX, INC.
Inventor: Jaideep DASTIDAR , Millind MITTAL
CPC classification number: G06F15/7825 , G06N20/00 , G06F9/544 , G06F9/546 , G06F13/4282 , H04L12/66 , G06F3/067 , G06F2213/0026
Abstract: Examples herein describe a peripheral I/O device with a hybrid gateway that permits the device to have both I/O and coherent domains. As a result, the compute resources in the coherent domain of the peripheral I/O device can communicate with the host in a similar manner as CPU-to-CPU communication in the host. The dual domains in the peripheral I/O device can be leveraged for machine learning (ML) applications. While an I/O device can be used as an ML accelerator, these accelerators previously only used an I/O domain. In the embodiments herein, compute resources can be split between the I/O domain and the coherent domain where a ML engine is in the I/O domain and a ML model is in the coherent domain. An advantage of doing so is that the ML model can be coherently updated using a reference ML model stored in the host.
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公开(公告)号:US20230244628A1
公开(公告)日:2023-08-03
申请号:US17589633
申请日:2022-01-31
Applicant: XILINX, INC.
Inventor: Krishnan SRINIVASAN , Sagheer AHMAD , Ygal ARBEL , Millind MITTAL
CPC classification number: G06F13/42 , G06F13/382 , G06F13/4063
Abstract: Embodiments herein describe using an adaptive chip-to-chip (C2C) interface to interconnect two chips, wherein the adaptive C2C interface includes circuitry for performing multiple different C2C protocols to communicate with the other chip. One or both of the chips in the C2C connection can include the adaptive C2C interface. During boot time, the adaptive C2C interface is configured to perform one of the different C2C protocols. During runtime, the chip then uses the selected C2C protocol to communicate with the other chip in the C2C connection.
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公开(公告)号:US20220100523A1
公开(公告)日:2022-03-31
申请号:US17035484
申请日:2020-09-28
Applicant: XILINX, INC.
Inventor: Millind MITTAL , Jaideep DASTIDAR
IPC: G06F9/38 , G06F9/30 , G06F9/54 , G06F12/0891
Abstract: Embodiments herein describe transferring ownership of data (e.g., cachelines or blocks of data comprising multiple cachelines) from a host to hardware in an I/O device. In one embodiment, the host and I/O device (e.g., an accelerator) are part of a cache-coherent system where ownership of data can be transferred from a home agent (HA) in the host to a local HA in the I/O device—e.g., a computational slave agent (CSA). That way, a function on the I/O device (e.g., an accelerator function) can request data from the local HA without these requests having to be sent to the host HA. Further, the accelerator function can indicate whether the local HA tracks the data on a cacheline-basis or by a data block (e.g., multiple cachelines). This provides flexibility that can reduce overhead from tracking the data, depending on the function's desired use of the data.
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公开(公告)号:US20250111119A1
公开(公告)日:2025-04-03
申请号:US18375342
申请日:2023-09-29
Applicant: XILINX, INC. , ATI Technologies ULC
Inventor: David P. SCHULTZ , Yanfeng WANG , Millind MITTAL
IPC: G06F30/347 , G06F115/02
Abstract: A multi-chiplet system includes a first chiplet comprising a first transceiver and a first chiplet-to-chiplet (C2C) interface module, and a second chiplet comprising programmable logic circuitry and a second C2C interface module. The first transceiver is configured to generate a clock, which is transmitted from the first C2C interface module to the second C2C interface module, through a clock transmission wire, for data transfer between the first chiplet and the second chiplet.
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公开(公告)号:US20250030500A1
公开(公告)日:2025-01-23
申请号:US18223517
申请日:2023-07-18
Applicant: XILINX, INC.
Inventor: Millind MITTAL , Krishnan SRINIVASAN , Kenneth MA
IPC: H04L1/00 , H04L49/9005
Abstract: Some examples described herein provide for interconnect in chiplet systems, for example system-level techniques for error correction in chip-to-chip interfaces. In an example, a method of error correction includes receiving, at a first chiplet, a data message via a set of interconnect, and transmitting a first control message that requests retransmission of the data message based on detecting an error associated with receiving the data message. The method also includes transmitting one or more instances of a second control message that indicates an idle operation at the first chiplet until the first chiplet receives a third control message that triggers an end of a retransmission mode. The method also includes transmitting a fourth control message frame indicating the end of the retransmission mode, and receiving a retransmission of the data message from the second chiplet.
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公开(公告)号:US20240313781A1
公开(公告)日:2024-09-19
申请号:US18123160
申请日:2023-03-17
Applicant: XILINX, INC.
Inventor: Brian C. GAIDE , Sagheer AHMAD , Trevor J. BAUER , Kenneth MA , David P. SCHULTZ , John O'DWYER , Richard W. SWANSON , Bhuvanachandran K. NAIR , Millind MITTAL
IPC: H03K19/17736 , G01R31/317 , H03K19/0175 , H03K19/17796
CPC classification number: H03K19/17744 , G01R31/31701 , H03K19/017581 , H03K19/17796
Abstract: Embodiments herein describe connecting an ASIC to another integrated circuit (or die) using inter-die connections. In one embodiment, an ASIC includes a fabric sliver (e.g., a small region of programmable logic circuitry). Inter-die fabric extension connections are used to connect the fabric sliver in the ASIC to fabric (e.g., programmable logic) in the other integrated circuit. These connections effectively extend the fabric in the ASIC to include the fabric in the other integrated circuit. Hardened IP blocks in the ASIC can then use the fabric sliver and the inter-die extension connections to access computer resources in the other integrated circuit.
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