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公开(公告)号：US20090289321A1
公开(公告)日：2009-11-26
申请号：US12387892
申请日：2009-05-08
CPC分类号： H01L25/0657 , H01L23/34 , H01L2225/0651 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
摘要： There is provided a semiconductor package that includes a first semiconductor die mounted on a package substrate. The semiconductor package further includes a second semiconductor die mounted on the first semiconductor die and including a thermal sensing and reset protection circuit. The thermal sensing and reset protection circuit is configured to determine a temperature of the first semiconductor die and to provide a reset protection signal to the first semiconductor die when the temperature of the first semiconductor die is substantially equal to a preset temperature so as to protect the first semiconductor die from thermal runaway. The reset protection signal can cause the first semiconductor die to be in a sleep mode or a reset state.
摘要翻译： 提供了一种半导体封装，其包括安装在封装衬底上的第一半导体管芯。 半导体封装还包括安装在第一半导体管芯上的第二半导体管芯，并且包括热感测和复位保护电路。 热感测和复位保护电路被配置为确定第一半导体管芯的温度，并且当第一半导体管芯的温度基本上等于预设温度时，向第一半导体管芯提供复位保护信号，以便保护 第一个半导体芯片从热失控。 复位保护信号可以使第一半导体管芯处于睡眠模式或复位状态。
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公开(公告)号：US08030719B2
公开(公告)日：2011-10-04
申请号：US12387892
申请日：2009-05-08
IPC分类号： H01L29/82
CPC分类号： H01L25/0657 , H01L23/34 , H01L2225/0651 , H01L2225/06589 , H01L2924/0002 , H01L2924/00
摘要： There is provided a semiconductor package that includes a first semiconductor die mounted on a package substrate. The semiconductor package further includes a second semiconductor die mounted on the first semiconductor die and including a thermal sensing and reset protection circuit. The thermal sensing and reset protection circuit is configured to determine a temperature of the first semiconductor die and to provide a reset protection signal to the first semiconductor die when the temperature of the first semiconductor die is substantially equal to a preset temperature so as to protect the first semiconductor die from thermal runaway. The reset protection signal can cause the first semiconductor die to be in a sleep mode or a reset state.
摘要翻译： 提供了一种半导体封装，其包括安装在封装衬底上的第一半导体管芯。 半导体封装还包括安装在第一半导体管芯上的第二半导体管芯，并且包括热感测和复位保护电路。 热感测和复位保护电路被配置为确定第一半导体管芯的温度，并且当第一半导体管芯的温度基本上等于预设温度时，向第一半导体管芯提供复位保护信号，以便保护 第一个半导体芯片从热失控。 复位保护信号可以使第一半导体管芯处于睡眠模式或复位状态。
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公开(公告)号：US20220066058A1
公开(公告)日：2022-03-03
申请号：US17092359
申请日：2020-11-09
申请人： Jianjun Gan , Jianhua Li , Xiaoming Li
发明人： Jianjun Gan , Jianhua Li , Xiaoming Li
摘要： The invention discloses a landslide deep displacement remote visual monitoring system, comprising monitoring system and transmitting system, the monitoring system comprises displacement sensor, the displacement sensor is arranged on chassis, anchor eyes are provided on the chassis, wire embedding hole is arranged at centroid of the chassis, multiple bracing wires are provided in the wire embedding hole, the transmitting system comprises a data acquisition unit, the data acquisition unit is arranged on the displacement sensor for collecting data thereof, the data acquisition unit is connected to a network transmission module, the network transmission module is connected to a data receiving module through the network, the data receiving module is also provided with network transmission module, the data receiving module is connected to computer, the computer displays the data through display screen.
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公开(公告)号：US08924760B2
公开(公告)日：2014-12-30
申请号：US12655881
申请日：2010-01-08
CPC分类号： G06F1/3203 , G06F1/324 , G06F1/329 , G06F1/3296 , G06F9/4893 , Y02D10/126 , Y02D10/172 , Y02D10/24
摘要： There is provided a method of scheduler assisted power management for semiconductor devices. By accessing and analyzing workload data for tasks to be completed, a scheduler may provide finer grained control for determining and implementing an efficient power management policy. In this manner, tasks with completion deadlines can be allocated sufficient resources without wasteful power consumption resulting from ramping up of performance through overestimating of voltage or frequency increases. Additionally, power management may be planned for longer periods, rather than looking only at immediate data to be processed and constantly fluctuating voltage and frequency. In this manner, power management can run more smoothly and efficiently compared to conventional means of power management that ignore data from a scheduler when determining power management policy.
摘要翻译： 提供了一种用于半导体器件的调度器辅助电源管理的方法。 通过访问和分析要完成的任务的工作负载数据，调度器可以提供更精细的粒度控制以确定和实现有效的电力管理策略。 以这种方式，具有完成期限的任务可以被分配足够的资源，而不会由于通过过高估计电压或频率增加而提高性能而导致浪费的功率消耗。 此外，电源管理可能会计划更长的时间，而不是仅查看要处理的即时数据和不断波动的电压和频率。 以这种方式，与在确定电源管理策略时忽略来自调度器的数据的电力管理的传统手段相比，功率管理可以更平稳和有效地运行。
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公开(公告)号：US08835445B2
公开(公告)日：2014-09-16
申请号：US13151683
申请日：2011-06-02
申请人： Zhiyong Chen , Christopher J. Creighton , Mark Cunningham , John Finn , Mark Hilgers , Michael Jung , Lucy Aguirre Kohnen , Thanh Lam , Xiaoming Li , Mark Stidham , Les Tari , Michael Trzoss , Junhu Zhang
发明人： Zhiyong Chen , Christopher J. Creighton , Mark Cunningham , John Finn , Mark Hilgers , Michael Jung , Lucy Aguirre Kohnen , Thanh Lam , Xiaoming Li , Mark Stidham , Les Tari , Michael Trzoss , Junhu Zhang
IPC分类号： A01N43/54 , A61K31/517 , C07D239/72 , C07D401/00
CPC分类号： C07D401/14 , C07D239/95 , C07D417/14
摘要： The present disclosure provides compounds of Formula I: or a pharmaceutically acceptable salt thereof, wherein R5, R6 and Z are as described herein. The disclosure also provides pharmaceutical compositions thereof; and methods for inhibiting DHFR activity; and methods for treating cell proliferative diseases, autoimmune disease, inflammatory disease or bacterial, fungal or parasitic infection by administering a compound of Formula I.
摘要翻译： 本公开提供式I化合物或其药学上可接受的盐，其中R 5，R 6和Z如本文所述。 本公开还提供其药物组合物; 和抑制DHFR活性的方法; 以及通过给予式I化合物治疗细胞增殖性疾病，自身免疫疾病，炎性疾病或细菌，真菌或寄生虫感染的方法。
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6.发明授权公开(公告)号：US08618782B2
公开(公告)日：2013-12-31
申请号：US13218355
申请日：2011-08-25
申请人： Xiaoming Li , Yunping Lang
发明人： Xiaoming Li , Yunping Lang
IPC分类号： G05F1/00
CPC分类号： H02M3/157 , H02M3/33515 , H02M2001/0012
摘要： The embodiments of the present invention illustrate a means for digitally controlling a converter system and associated method. Wherein the means for digitally controlling a converter system comprises a means for generating a digital error signal according to an output voltage of the converter system and a reference voltage, a means for generating a digital control signal according to a digital reference signal and the digital error signal, and a means for generating a PWM signal according to the digital control signal in order to control the converter system. The means for digitally controlling a converter system and associated method at least alleviate the problem of limit-cycle oscillation, and promote the performance of system transient response and accuracy.
摘要翻译： 本发明的实施例示出了用于数字控制转换器系统和相关方法的装置。 其中用于数字控制转换器系统的装置包括用于根据转换器系统的输出电压和参考电压产生数字误差信号的装置，用于根据数字参考信号和数字误差产生数字控制信号的装置 信号，以及用于根据数字控制信号产生PWM信号以便控制转换器系统的装置。 用于数字控制转换器系统和相关方法的手段至少减轻了极限循环振荡的问题，并提高了系统瞬态响应和精度的性能。
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公开(公告)号：US20110173478A1
公开(公告)日：2011-07-14
申请号：US12655881
申请日：2010-01-08
CPC分类号： G06F1/3203 , G06F1/324 , G06F1/329 , G06F1/3296 , G06F9/4893 , Y02D10/126 , Y02D10/172 , Y02D10/24
摘要： There is provided a method of scheduler assisted power management for semiconductor devices. By accessing and analyzing workload data for tasks to be completed, a scheduler may provide finer grained control for determining and implementing an efficient power management policy. In this manner, tasks with completion deadlines can be allocated sufficient resources without wasteful power consumption resulting from ramping up of performance through overestimating of voltage or frequency increases. Additionally, power management may be planned for longer periods, rather than looking only at immediate data to be processed and constantly fluctuating voltage and frequency. In this manner, power management can run more smoothly and efficiently compared to conventional means of power management that ignore data from a scheduler when determining power management policy.
摘要翻译： 提供了一种用于半导体器件的调度器辅助电源管理的方法。 通过访问和分析要完成的任务的工作负载数据，调度器可以提供更精细的粒度控制以确定和实现有效的电力管理策略。 以这种方式，具有完成期限的任务可以被分配足够的资源，而不会由于通过过高估计电压或频率增加而提高性能而导致浪费的功率消耗。 此外，电源管理可能会计划更长的时间，而不是仅查看要处理的即时数据和不断波动的电压和频率。 以这种方式，与在确定电源管理策略时忽略来自调度器的数据的电力管理的传统手段相比，功率管理可以更平稳和有效地运行。
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公开(公告)号：US20110169562A1
公开(公告)日：2011-07-14
申请号：US12655879
申请日：2010-01-08
CPC分类号： H01L23/50 , H01L2924/0002 , H01L2924/00
摘要： There is provided a semiconductor package configured for externally controlled power management. Instead of integrating voltage regulation on-chip as done conventionally, power regulation is moved externally to the PCB level, providing numerous package advantages including size, simplicity, power efficiency, integration flexibility, and thermal dissipation. In particular, the use of flip-chip package configurations provides ready access to power supply bumps, which also allows the use of a universal receiving PCB and power supply through simple reconfiguring of voltage traces. As a result, flexible power management can be implemented, and portions of semiconductor packages may be managed for performance or thermal considerations, which may be of particular use for applications such as multi-core processors.
摘要翻译： 提供了一种配置用于外部控制电源管理的半导体封装。 功率调节不是像以往那样集成电压调节片上，而是将功率调节从外部移到PCB级，提供了许多封装优势，包括尺寸，简单性，功率效率，集成灵活性和散热。 特别地，使用倒装芯片封装配置可以方便地访问电源突点，这也允许通过简单重新配置电压迹线来使用通用接收PCB和电源。 因此，可以实现灵活的功率管理，并且可以管理半导体封装的部分以用于性能或热考虑，这可能对于诸如多核处理器的应用特别有用。
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公开(公告)号：US06984652B2
公开(公告)日：2006-01-10
申请号：US10848474
申请日：2004-05-17
申请人： Kraig Yager , Shaosong Chu , Krzysztof Appelt , Xiaoming Li
发明人： Kraig Yager , Shaosong Chu , Krzysztof Appelt , Xiaoming Li
IPC分类号： A61K31/427 , C07D417/04 , C07D401/14
CPC分类号： C07D417/14 , C07D487/08
摘要： Compounds comprising an indazolyl group and a thiazolyl group, preferably 7-substituted 3-(thiazol-2-yl)-1H-indazole compounds in which the indazolyl group and a thiazolyl group are each independently optionally substituted, are useful for the treatment or prophylaxis of bacterial infections in mammals. The compounds are believed to function by inhibiting gyrase B.
摘要翻译： 包含吲唑基和噻唑基的化合物，优选7-取代的3-（噻唑-2-基）-1H-吲唑化合物，其中吲唑基和噻唑基各自独立地任选被取代，可用于治疗或预防 的哺乳动物细菌感染。 据信这些化合物通过抑制促旋酶B起作用。
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公开(公告)号：US06924196B1
公开(公告)日：2005-08-02
申请号：US09370508
申请日：1999-08-06
IPC分类号： H01L21/28 , H01L21/311 , H01L21/314 , H01L21/3213 , H01L21/336 , H01L21/8247
CPC分类号： H01L27/11526 , H01L21/28273 , H01L21/31111 , H01L21/3144 , H01L21/3145 , H01L21/32139 , H01L27/11534 , H01L29/66825
摘要： An anti-reflective coating for use in the fabrication of a semiconductor device includes a thin oxide layer and an overlying layer of silicon oxynitride. The anti-reflective layer is advantageously used in the fabrication of FLASH memory devices which include a layer of polycrystalline silicon and an underlying layer of silicon nitride. After being used to pattern the polycrystalline silicon and silicon nitride, the anti-reflective coating is removed in a solution of hot phosphoric acid with the removal taking place before the silicon oxynitride is exposed to any elevated temperatures.
摘要翻译： 用于制造半导体器件的抗反射涂层包括薄氧化物层和氮氧化硅上覆层。 抗反射层有利地用于制造包括多晶硅层和氮化硅的下层的闪存存储器件。 在用于对多晶硅和氮化硅进行图案化之后，在热磷酸溶液中除去抗反射涂层，在氮氧化硅暴露于任何升高的温度之前进行去除。
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