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23 条记录 (耗时 0.047 秒)

    Serial port remote control circuit
    4.
    发明授权
    Serial port remote control circuit 失效
    串口遥控电路

    公开(公告)号：US08452905B2

    公开(公告)日：2013-05-28

    申请号：US13081522

    申请日：2011-04-07

    申请人： Qiang Guo ,  Min Tan

    发明人： Qiang Guo ,  Min Tan

    IPC分类号： G06F13/12 ,  G06F13/38

    CPC分类号： G06F13/385 ,  G05B19/0423 ,  G05B2219/25171

    摘要： A serial port remote control circuit includes a first interface circuit, a control circuit, an output circuit, and a power circuit. The first interface circuit converts recommended standard 232 (RS232) level signals to transistor-transistor logic (TTL) level signals or vice versa. The control circuit is connected to the first interface circuit, to convert the TTL level signals to physical bus signal or vice versa. The output circuit is connected to the control circuit, to convert the received physical bus signals from the control circuit to network bus signals or vice versa. The power circuit outputs a first voltage and a second voltage converted from the first voltage to the control circuit, the first interface circuit, and the output circuit.

    摘要翻译： 串行端口遥控电路包括第一接口电路，控制电路，输出电路和电源电路。 第一个接口电路将推荐的标准232（RS232）电平信号转换为晶体管晶体管逻辑（TTL）电平信号，反之亦然。 控制电路连接到第一接口电路，将TTL电平信号转换为物理总线信号，反之亦然。 输出电路连接到控制电路，将接收的物理总线信号从控制电路转换为网络总线信号，反之亦然。 电源电路将从第一电压转换的第一电压和第二电压输出到控制电路，第一接口电路和输出电路。

    METHOD AND APPARATUS FOR CONTROLLING INTELLIGENT ANTENNA SYSTEM
    5.
    发明申请
    METHOD AND APPARATUS FOR CONTROLLING INTELLIGENT ANTENNA SYSTEM 有权
    用于控制智能天线系统的方法和装置

    公开(公告)号：US20130128762A1

    公开(公告)日：2013-05-23

    申请号：US13812456

    申请日：2011-07-27

    申请人： Qiang Guo

    发明人： Qiang Guo

    IPC分类号： H04W52/24

    CPC分类号： H04W52/241 ,  H04B7/0602 ,  H04B7/061 ,  H04B7/0691 ,  H04W52/20 ,  H04W52/42

    摘要： A method and an apparatus for controlling an intelligent antenna system are provided. The method includes: pre-configuring a Request Min Rate (RR), a Request Max PER (RP) and a request TX power (RTP); A). determining a current antenna configuration and a current transmitting power of the intelligent antenna system; B). reducing the transmitting power as long as the packet loss ratio does not exceed the RP with the current antenna configuration and with RR as a current transmitting rate, and adopting a reduced transmitting power as the current transmitting power; and C). switching between different antenna configurations at intervals with the current transmitting rate and the current transmitting power to obtain an antenna configuration under which the packet loss ratio is lower than the current packet loss ratio, and performing B).

    摘要翻译： 提供了一种用于控制智能天线系统的方法和装置。 该方法包括：预配置请求最小速率（RR），请求最大PER（RP）和请求TX功率（RTP）; 一个）。 确定智能天线系统的当前天线配置和当前发射功率; B）。 只要分组丢失率不超过当前天线配置的RP和RR作为当前传输速率，并采用降低的发射功率作为当前发射功率，则降低发射功率; 和C）。 以当前传输速率和当前发射功率间隔切换不同天线配置，以获得丢包率低于当前分组丢失率的天线配置，并执行B）。

    Via electromigration improvement by changing the via bottom geometric profile
    6.
    发明申请
    Via electromigration improvement by changing the via bottom geometric profile 有权

    公开(公告)号：US20060160354A1

    公开(公告)日：2006-07-20

    申请号：US11374848

    申请日：2006-03-14

    申请人： BeiChao Zhang ,  Chun Low ,  Hong Lee ,  Sang Loong ,  Qiang Guo

    发明人： BeiChao Zhang ,  Chun Low ,  Hong Lee ,  Sang Loong ,  Qiang Guo

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/76802 ,  H01L21/76805 ,  H01L21/76814

    摘要： An integration approach to improve electromigration resistance in a semiconductor device is described. A via hole is formed in a stack that includes an upper dielectric layer, a middle TiN ARC, and a lower first metal layer and is filled with a conformal diffusion barrier layer and a second metal layer. A key feature is that the etch process can be selected to vary the shape and location of the via bottom. A round or partially rounded bottom is formed in the first metal layer to reduce mechanical stress near the diffusion barrier layer. On the other hand, a flat bottom which stops on or in the TiN ARC is selected when exposure of the first metal layer to subsequent processing steps is a primary concern. Electromigration resistance is found to be lower than for a via structure with a flat bottom formed in a first metal layer.

    Frame synchronization and scrambling code indentification in wireless communications systems and methods therefor
    7.
    发明授权
    Frame synchronization and scrambling code indentification in wireless communications systems and methods therefor 有权
    无线通信系统中的帧同步和扰码识别及其方法

    公开(公告)号：US07061966B2

    公开(公告)日：2006-06-13

    申请号：US10376191

    申请日：2003-02-27

    申请人： Brian Storm ,  Qiang Guo ,  Ming D. Tan ,  Xuping Zhou ,  Mang Zhu

    发明人： Brian Storm ,  Qiang Guo ,  Ming D. Tan ,  Xuping Zhou ,  Mang Zhu

    IPC分类号： H04L27/30

    CPC分类号： H04B1/70735

    摘要： A mobile wireless communications device and methods therefore, including receiving a signal (710), storing a portion of the received signal (730), identifying all possible pilot signals by determining slot boundary information for the stored signal portion (720), determining frame boundary information and/or scrambling code information (760) of the stored signal portion by correlating the stored signal portion with the scrambling codes based on the slot boundary information. In other embodiments, the search is performed in real-time without storing the signal.

    摘要翻译： 因此，移动无线通信设备和方法包括接收信号（710），存储接收信号的一部分（730），通过确定所存储的信号部分（720）的时隙边界信息来识别所有可能的导频信号，确定帧边界 信息和/或加扰码信息（760），通过将存储的信号部分与基于时隙边界信息的扰码相关联。 在其他实施例中，搜索是实时执行的，而不存储信号。

    VERTICAL TURNING-MILLING COMPLEX MACHINING CENTER
    9.
    发明申请
    VERTICAL TURNING-MILLING COMPLEX MACHINING CENTER 有权
    立式铣床复合加工中心

    公开(公告)号：US20120210551A1

    公开(公告)日：2012-08-23

    申请号：US13504960

    申请日：2010-10-29

    申请人： Dehai Yu ,  Chungang Cai ,  Zhihui Ren ,  Wenfeng Zhang ,  Hu Chen ,  Junmin Zheng ,  Qiang Guo ,  Tao Zou ,  Jingming Li ,  Peng Qu ,  Yang Lin

    发明人： Dehai Yu ,  Chungang Cai ,  Zhihui Ren ,  Wenfeng Zhang ,  Hu Chen ,  Junmin Zheng ,  Qiang Guo ,  Tao Zou ,  Jingming Li ,  Peng Qu ,  Yang Lin

    IPC分类号： B23P23/02

    CPC分类号： B23Q1/4804 ,  B23B3/22 ,  B23B11/00 ,  B23C1/12 ,  B23C9/005 ,  B23P23/02 ,  B23Q1/012 ,  B23Q1/4819 ,  B23Q1/4842 ,  B23Q5/10 ,  B23Q5/40 ,  Y10T29/5109 ,  Y10T29/5114 ,  Y10T82/2511 ,  Y10T409/30448 ,  Y10T409/305656 ,  Y10T409/305768 ,  Y10T409/307672 ,  Y10T409/307728 ,  Y10T409/308288 ,  Y10T409/309296

    摘要： A vertical turning-milling complex machining center comprises a horizontally-arranged bed body (6) and a vertically-arranged column (7). The bed body (6) is provided with an X-axis lateral supporting linear track (2) and an X-axis guide screw (5). The bed body (6) is also provided with a uniaxial rotating table (1) which can reciprocate and is driven directly by a first external rotor torque motor. The column (7) is vertically provided with a Z-axis lateral supporting linear track (10), a Z-axis guide screw (9) and a crossbeam (11) that reciprocates up and down. The crossbeam (11) is provided with a transverse Y-axis linear track (13), a Y-axis guide screw (12) and a single-pendulum milling head seat frame that can reciprocate along the Y-axis guide screw (12). The single-pendulum milling head is driven directly by a second external rotor torque motor. The vertical turning-milling complex machining center uses direct-drive technology applied to a B-axis and a C-axis, the motor torque is greatly increased and functional parts can stably operate, therefore the integral rigidity and stability of the machining center are improved.

    摘要翻译： 立式车铣复合加工中心包括水平布置的床体（6）和垂直排列的柱（7）。 床体（6）设置有X轴侧支撑线性轨道（2）和X轴导向螺钉（5）。 床体（6）还设置有单轴旋转台（1），其可以由第一外转子扭矩马达往复运动并直接驱动。 柱（7）竖直地设置有Z轴横向支撑线性轨道（10），Z轴导向螺钉（9）和横梁（11），其横向往复运动。 横梁（11）设置有能够沿着Y轴导向螺钉（12）往复运动的横向Y轴线性轨道（13），Y轴导向螺钉（12）和单摆式铣头座椅框架， 。 单摆铣头由第二外转子扭矩马达直接驱动。 立式车铣复合加工中心采用直接驱动技术应用于B轴和C轴，电机转矩大大提高，功能部件可以稳定运行，提高了加工中心的整体刚性和稳定性 。

    VIA ELECTROMIGRATION IMPROVEMENT BY CHANGING THE VIA BOTTOM GEOMETRIC PROFILE
    10.
    发明申请
    VIA ELECTROMIGRATION IMPROVEMENT BY CHANGING THE VIA BOTTOM GEOMETRIC PROFILE 有权
    通过改变通过底部几何轮廓的电力改进

    公开(公告)号：US20090250818A1

    公开(公告)日：2009-10-08

    申请号：US12486521

    申请日：2009-06-17

    申请人： Bei Chao Zhang ,  Chun Hui Low ,  Hong Lim Lee ,  Sang Yee Loong ,  Qiang Guo

    发明人： Bei Chao Zhang ,  Chun Hui Low ,  Hong Lim Lee ,  Sang Yee Loong ,  Qiang Guo

    IPC分类号： H01L23/522

    CPC分类号： H01L21/76802 ,  H01L21/76805 ,  H01L21/76814

    摘要： An integration approach to improve electromigration resistance in a semiconductor device is described. A via hole is formed in a stack that includes an upper dielectric layer, a middle TiN ARC, and a lower first metal layer and is filled with a conformal diffusion barrier layer and a second metal layer. A key feature is that the etch process can be selected to vary the shape and location of the via bottom. A round or partially rounded bottom is formed in the first metal layer to reduce mechanical stress near the diffusion barrier layer. On the other hand, a flat bottom which stops on or in the TiN ARC is selected when exposure of the first metal layer to subsequent processing steps is a primary concern. Electromigration resistance is found to be lower than for a via structure with a flat bottom formed in a first metal layer.

    摘要翻译： 描述了一种用于提高半导体器件中的电迁移阻力的集成方法。 在包括上电介质层，中间TiN ARC和下第一金属层的堆叠中形成通孔，并且填充有共形扩散阻挡层和第二金属层。 一个关键特征是可以选择蚀刻工艺来改变通孔底部的形状和位置。 在第一金属层中形成圆形或部分圆形的底部，以减小扩散阻挡层附近的机械应力。 另一方面，当第一金属层暴露于后续处理步骤时，选择在TiN ARC上或其中停止的平底，这是首要考虑的问题。 发现耐电迁移性低于在第一金属层中形成的平坦底部的通孔结构。