公开(公告)号：US06949016B1

公开(公告)日：2005-09-27

申请号：US10112399

申请日：2002-03-29

申请人： Anthony de la Llera ,  Xuyen Pham

发明人： Anthony de la Llera ,  Xuyen Pham

IPC分类号： B24B5/00 ,  B24B21/18 ,  B24B37/04 ,  B24B53/007

CPC分类号： B24B53/017 ,  B24B21/18

摘要： A chemical mechanical planarization (CMP) conditioning apparatus is provided. The CMP conditioning apparatus is designed to connect to a positioning arm which is capable of applying the conditioning apparatus to a processing surface. Embodiments of the CMP conditioning apparatus include a housing configured to connect to the positioning arm, and one side of the housing having a concave gimbal surface. A puck holder that a convex gimbal surface configured to mate with the concave gimbal surface of the housing is further provided. Thee puck holder receives a conditioning puck that has an attach surface and an active surface. The concave gimbal surface and the convex gimbal surface define a projected gimbal point at about a plane defined at about the active surface of the conditioning puck.

摘要翻译： 提供化学机械平面化（CMP）调理装置。 CMP调节装置被设计成连接到能够将调节装置应用于处理表面的定位臂。 CMP调节装置的实施例包括构造成连接到定位臂的壳体，并且壳体的一侧具有凹形万向面。 进一步提供了构造成与壳体的凹面万向节表面配合的凸面万向面的圆盘保持架。 冰球座接收一个具有附着表面和活动表面的调理盘。 凹面万向节表面和凸面万向节表面在约定义在调理盘的活动表面处的平面处限定投影的万向节点。

公开(公告)号：US07018276B2

公开(公告)日：2006-03-28

申请号：US10876415

申请日：2004-06-25

申请人： Anthony de la Llera ,  Xuyen Pham ,  Cangshan Xu ,  David Wei ,  Tony Luong

发明人： Anthony de la Llera ,  Xuyen Pham ,  Cangshan Xu ,  David Wei ,  Tony Luong

IPC分类号： B24B7/22 ,  B24B21/08

CPC分类号： B24B21/10 ,  B24B37/04

摘要： An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

公开(公告)号：US06761626B2

公开(公告)日：2004-07-13

申请号：US10037452

申请日：2001-12-20

申请人： Anthony de la Llera ,  Xuyen Pham ,  Cangshan Xu ,  David Wei ,  Tony Luong

发明人： Anthony de la Llera ,  Xuyen Pham ,  Cangshan Xu ,  David Wei ,  Tony Luong

IPC分类号： B24B722

CPC分类号： B24B21/10 ,  B24B37/04

摘要： An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

摘要翻译： 描述了空气压板组件，并且包括具有多个同心环的压板。 每个环具有多个开口，以便向CMP带提供空气缓冲。 至少一个环延伸超过晶片的外边缘以由CMP带平坦化。 支撑件与压板连接，并且具有多个用于加压空气的空气端口以传递到压板的环。 垫片定位在支撑件和压板之间，并且具有与开口和空气端口对准的多个切口。 还包括基地并支持支持。

公开(公告)号：US06746313B1

公开(公告)日：2004-06-08

申请号：US09999066

申请日：2001-10-24

申请人： Xuyen Pham ,  Anthony de la Llera

发明人： Xuyen Pham ,  Anthony de la Llera

IPC分类号： B24B100

CPC分类号： B24B37/32

摘要： A polishing head assembly for use in a chemical mechanical planarization apparatus is provided. The polishing head assembly includes a carrier head shaped substantially like a disk having a circumference, a top surface, a bottom surface, and an outer wall, the outer wall having a groove therein, the groove extending into the carrier head from the bottom surface of the carrier head, and the groove running the entire circumference of the carrier head; and a retainer ring having an interior wall and an exterior wall, the interior wall of the retainer ring being in contact with the outer wall of the carrier head, the interior wall having a slot therein, the slot defining a lower portion of the interior wall as a flexible leg, the flexible leg having a receiving end that is adapted to secure an object having a surface to be polished, the slot having a first terminal end adjacent to the groove in the carrier head and a second terminal end, opposite the first terminal end, in the body of the retainer ring. A carrier head is provided, as is a retainer ring. A method of compensating for uneven force distribution in a chemical mechanical planarization apparatus is also provided.

摘要翻译： 提供了一种用于化学机械平面化装置的抛光头组件。 抛光头组件包括基本上类似于具有圆周，顶表面，底表面和外壁的盘的托架头，该外壁在其中具有槽，该槽从底表面延伸到承载头中 所述承载头和所述槽围绕所述承载头的整个圆周延伸; 以及具有内壁和外壁的保持环，所述保持环的内壁与所述承载头的外壁接触，所述内壁在其中具有槽，所述槽限定所述内壁的下部 作为柔性腿，柔性腿具有适于固定具有待抛光表面的物体的接收端，所述狭槽具有与载体头部中的凹槽相邻的第一端部端部和与第一端子相对的第二端子端部 终端，在保持环的主体中。 保持环也是一个承载头。 还提供了补偿化学机械平面化装置中的不均匀力分布的方法。

公开(公告)号：US06712670B2

公开(公告)日：2004-03-30

申请号：US10033671

申请日：2001-12-27

申请人： Anthony de la Llera ,  Xuyen Pham ,  Andrew Siu ,  Tuan A. Nguyen ,  Tony Luong

发明人： Anthony de la Llera ,  Xuyen Pham ,  Andrew Siu ,  Tuan A. Nguyen ,  Tony Luong

IPC分类号： B24B4900

CPC分类号： B24B37/30 ,  B24B49/16

摘要： An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

摘要翻译： 在CMP操作期间将晶片施加到研磨带的装置包括具有上端和下端的心轴。 晶片载体联接到主轴的下端。 线轴力发生器设置在主轴的上端。 称重传感器位于线性力发生器和主轴上端之间。 控制器耦合到负载传感器，用于控制由线性力发生器施加的力。 还描述了在CMP期间在晶片上施加向下的力的方法。

公开(公告)号：US20070246079A1

公开(公告)日：2007-10-25

申请号：US11408664

申请日：2006-04-21

申请人： Xuyen Pham

发明人： Xuyen Pham

IPC分类号： B08B3/00 ,  B08B7/00

CPC分类号： H01L21/67051 ,  H01L21/6708

摘要： A method and system to clean and rinse and dry wafer comprises a precision control of an outward-moving inner boundary condition and a steady state edge boundary condition. The edge boundary condition can confine the liquid within the substrate by an edge liquid flow step, to create an outer liquid boundary, to confine the liquid within the wafer, and to compensate for liquid lost through process conditions such as wafer spinning. The outward-moving inner boundary condition can control or distribute the liquid within the substrate by an inner liquid boundary condition that moves outward to the edge of the wafer, to create an outward-moving inner liquid boundary, to uniformly distribute liquid within the wafer, and to uniformly drying the wafer.

摘要翻译： 清洗和干燥晶片的方法和系统包括向外移动的内边界条件和稳态边界边界条件的精确控制。 边缘边界条件可以通过边缘液流步骤将液体限制在基板内，以产生外部液体边界，以将液体限制在晶片内，并补偿在诸如晶片旋转之类的工艺条件下损失的液体。 向外移动的内边界条件可以通过向外移动到晶片边缘的内部液体边界条件来控制或分布在基板内的液体，以产生向外移动的内部液体边界，以将液体均匀地分布在晶片内， 并均匀干燥晶片。

公开(公告)号：US07054719B2

公开(公告)日：2006-05-30

申请号：US10828026

申请日：2004-04-19

申请人： Xuyen Pham ,  Tuan Nguyen ,  Vien Quach ,  Ren Zhou

发明人： Xuyen Pham ,  Tuan Nguyen ,  Vien Quach ,  Ren Zhou

IPC分类号： G05B21/00

CPC分类号： G05D11/132

摘要： A method of mixing two or more chemicals such as for a CMP system. The method includes delivering a first chemical to a first inlet port of a point of use mixer at a first flow rate, delivering a second chemical to a second inlet port of the point of use mixer at a second flow rate, controlling the flow of the first and second chemicals into the mixer upon demand for a mixture of the first and second chemicals and balancing the flow of the first and second chemicals into the mixer. The mixture can also be output such as to a CMP process. A system for mixing two or more chemicals is also described.

摘要翻译： 一种混合两种或更多种化学物质的方法，例如用于CMP系统。 该方法包括以第一流速将第一化学品输送到使用混合点的第一入口端口，以第二流量将第二化学品输送到使用混合器的第二入口端口， 第一和第二化学品进入混合器中，根据需要混合第一和第二化学品并将第一和第二化学品的流动平衡到混合器中。 混合物也可以输出到CMP工艺。 还描述了用于混合两种或更多种化学品的系统。

公开(公告)号：US06569004B1

公开(公告)日：2003-05-27

申请号：US09476459

申请日：1999-12-30

申请人： Xuyen Pham

发明人： Xuyen Pham

IPC分类号： B24D1100

CPC分类号： B24B37/20 ,  B29C53/382 ,  B29C65/02 ,  B29C65/04 ,  B29C65/06 ,  B29C65/08 ,  B29C65/10 ,  B29C65/4815 ,  B29C65/505 ,  B29C66/1142 ,  B29C66/1282 ,  B29C66/12841 ,  B29C66/14 ,  B29C66/43 ,  B29C66/4322 ,  B29C66/4324 ,  B29L2009/00 ,  B29L2031/709 ,  B29L2031/736

摘要： A method of joining sections of polishing pad for use in the chemical mechanical planarization of a semiconductor wafer. Two sections of polishing pad are positioned so that they contact one another. The two sections are then welded together to create a robust joint. The joint is resistant to infiltration of slurry and is not susceptible to delamination that commonly occurs in a typical laminate joint.

摘要翻译： 一种接合用于半导体晶片的化学机械平面化的抛光垫部分的方法。 抛光垫的两个部分被定位成使得它们彼此接触。 然后将两个部分焊接在一起以形成牢固的接头。 接头耐浆料渗透，并且不易于在典型的层压接头中通常发生分层。

公开(公告)号：US06447380B1

公开(公告)日：2002-09-10

申请号：US09607896

申请日：2000-06-30

申请人： Xuyen Pham ,  Joe Simon

发明人： Xuyen Pham ,  Joe Simon

IPC分类号： B24B3704

CPC分类号： B24B37/32

摘要： A polishing apparatus includes a rotatable head assembly including a substrate retainer that incorporates a cavity in the face surface of the substrate retainer for temporarily holding polishing slurry during operation of the polishing apparatus. The cavity resides in the face surface of the substrate retainer at a location adjacent the perimeter surface of the retainer. During operation of the polishing apparatus, slurry flowing along the surface of the polishing pad flows into the cavity where a portion of the slurry is temporarily held. As the head assembly of the polishing apparatus rotates against the polishing pad, slurry continuously flows from the cavity across the polishing pad and is uniformly distributed across the exposed surface of the substrate being polished. An offset in the cavity wall permits used slurry to flow away from the substrate retainer during rotation of the head assembly.

摘要翻译： 抛光装置包括可旋转的头部组件，其包括基板保持器，该基板保持器在基板保持器的表面中并入腔体，用于在抛光装置的操作期间临时保持抛光浆料。 空腔位于与保持器的周边表面相邻的位置处的基板保持器的表面。 在抛光装置的操作期间，沿着抛光垫的表面流动的浆料流入其中浆料的一部分暂时保持的空腔。 当抛光装置的头部组件相对于抛光垫旋转时，浆料从腔体连续地流过抛光垫，并且均匀分布在被抛光的基底的暴露表面上。 空腔壁中的偏移允许使用的浆料在头部组件旋转期间从衬底保持器流出。

公开(公告)号：USRE42942E1

公开(公告)日：2011-11-22

申请号：US10360603

申请日：2003-02-06

申请人： Gordon Stout ,  Xuyen Pham ,  Michael J. Rocchio ,  Kyle A. Naydo ,  Derrick J. Parks ,  Patrick Reich

发明人： Gordon Stout ,  Xuyen Pham ,  Michael J. Rocchio ,  Kyle A. Naydo ,  Derrick J. Parks ,  Patrick Reich

IPC分类号： B65B1/08

CPC分类号： A61J3/02 ,  A61M15/005 ,  A61M2202/064

摘要： The invention provides methods, systems and apparatus for the metered transport of fine powders into receptacles. According to one exemplary embodiment, an apparatus is provided which comprises a hopper having an opening. The hopper is adapted to receive a bed of fine powder. At least one chamber, which is moveable to allow the chamber to be placed in close proximity to the opening, is also provided. An element having a proximal end and a distal end is positioned within the hopper such that the distal end is near the opening. A vibrator motor is provided to vibrate the element when within the fine powder.

摘要翻译： 本发明提供了用于将精细粉末计量运送到容器中的方法，系统和装置。 根据一个示例性实施例，提供了一种包括具有开口的料斗的装置。 料斗适于接纳细粉床。 还提供了至少一个室，其可移动以允许室被放置在靠近开口处。 具有近端和远端的元件位于料斗内，使得远端靠近开口。 提供振动电机以在细粉末内振动元件。