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34 条记录 (耗时 0.022 秒)

    Polishing head assembly in an apparatus for chemical mechanical planarization
    1.
    发明授权
    Polishing head assembly in an apparatus for chemical mechanical planarization 失效
    用于化学机械平面化的设备中的抛光头组件

    公开(公告)号：US06746313B1

    公开(公告)日：2004-06-08

    申请号：US09999066

    申请日：2001-10-24

    申请人： Xuyen Pham ,  Anthony de la Llera

    发明人： Xuyen Pham ,  Anthony de la Llera

    IPC分类号： B24B100

    CPC分类号： B24B37/32

    摘要： A polishing head assembly for use in a chemical mechanical planarization apparatus is provided. The polishing head assembly includes a carrier head shaped substantially like a disk having a circumference, a top surface, a bottom surface, and an outer wall, the outer wall having a groove therein, the groove extending into the carrier head from the bottom surface of the carrier head, and the groove running the entire circumference of the carrier head; and a retainer ring having an interior wall and an exterior wall, the interior wall of the retainer ring being in contact with the outer wall of the carrier head, the interior wall having a slot therein, the slot defining a lower portion of the interior wall as a flexible leg, the flexible leg having a receiving end that is adapted to secure an object having a surface to be polished, the slot having a first terminal end adjacent to the groove in the carrier head and a second terminal end, opposite the first terminal end, in the body of the retainer ring. A carrier head is provided, as is a retainer ring. A method of compensating for uneven force distribution in a chemical mechanical planarization apparatus is also provided.

    摘要翻译： 提供了一种用于化学机械平面化装置的抛光头组件。 抛光头组件包括基本上类似于具有圆周，顶表面，底表面和外壁的盘的托架头，该外壁在其中具有槽，该槽从底表面延伸到承载头中 所述承载头和所述槽围绕所述承载头的整个圆周延伸; 以及具有内壁和外壁的保持环，所述保持环的内壁与所述承载头的外壁接触，所述内壁在其中具有槽，所述槽限定所述内壁的下部 作为柔性腿，柔性腿具有适于固定具有待抛光表面的物体的接收端，所述狭槽具有与载体头部中的凹槽相邻的第一端部端部和与第一端子相对的第二端子端部 终端，在保持环的主体中。 保持环也是一个承载头。 还提供了补偿化学机械平面化装置中的不均匀力分布的方法。

    Method and apparatus for applying downward force on wafer during CMP
    2.
    发明授权
    Method and apparatus for applying downward force on wafer during CMP 失效
    在CMP期间向晶片施加向下的力的方法和装置

    公开(公告)号：US06712670B2

    公开(公告)日：2004-03-30

    申请号：US10033671

    申请日：2001-12-27

    申请人： Anthony de la Llera ,  Xuyen Pham ,  Andrew Siu ,  Tuan A. Nguyen ,  Tony Luong

    发明人： Anthony de la Llera ,  Xuyen Pham ,  Andrew Siu ,  Tuan A. Nguyen ,  Tony Luong

    IPC分类号： B24B4900

    CPC分类号： B24B37/30 ,  B24B49/16

    摘要： An apparatus for applying a wafer to a polishing belt during a CMP operation includes a spindle having an upper end and a lower end. A wafer carrier is coupled to the lower end of the spindle. A linear force generator is disposed at the upper end of the spindle. A load cell is positioned between the linear force generator and the upper end of the spindle. A controller is coupled to the load cell for controlling the force applied by the linear force generator. A method for applying downward force on a wafer during CMP also is described.

    摘要翻译： 在CMP操作期间将晶片施加到研磨带的装置包括具有上端和下端的心轴。 晶片载体联接到主轴的下端。 线轴力发生器设置在主轴的上端。 称重传感器位于线性力发生器和主轴上端之间。 控制器耦合到负载传感器，用于控制由线性力发生器施加的力。 还描述了在CMP期间在晶片上施加向下的力的方法。

    Gimballed conditioning apparatus
    3.
    发明授权
    Gimballed conditioning apparatus 失效
    金球调节装置

    公开(公告)号：US06949016B1

    公开(公告)日：2005-09-27

    申请号：US10112399

    申请日：2002-03-29

    申请人： Anthony de la Llera ,  Xuyen Pham

    发明人： Anthony de la Llera ,  Xuyen Pham

    IPC分类号： B24B5/00 ,  B24B21/18 ,  B24B37/04 ,  B24B53/007

    CPC分类号： B24B53/017 ,  B24B21/18

    摘要： A chemical mechanical planarization (CMP) conditioning apparatus is provided. The CMP conditioning apparatus is designed to connect to a positioning arm which is capable of applying the conditioning apparatus to a processing surface. Embodiments of the CMP conditioning apparatus include a housing configured to connect to the positioning arm, and one side of the housing having a concave gimbal surface. A puck holder that a convex gimbal surface configured to mate with the concave gimbal surface of the housing is further provided. Thee puck holder receives a conditioning puck that has an attach surface and an active surface. The concave gimbal surface and the convex gimbal surface define a projected gimbal point at about a plane defined at about the active surface of the conditioning puck.

    摘要翻译： 提供化学机械平面化（CMP）调理装置。 CMP调节装置被设计成连接到能够将调节装置应用于处理表面的定位臂。 CMP调节装置的实施例包括构造成连接到定位臂的壳体，并且壳体的一侧具有凹形万向面。 进一步提供了构造成与壳体的凹面万向节表面配合的凸面万向面的圆盘保持架。 冰球座接收一个具有附着表面和活动表面的调理盘。 凹面万向节表面和凸面万向节表面在约定义在调理盘的活动表面处的平面处限定投影的万向节点。

    Air platen for leading edge and trailing edge control
    5.
    发明授权
    Air platen for leading edge and trailing edge control 失效
    用于前缘和后缘控制的气压盘

    公开(公告)号：US06761626B2

    公开(公告)日：2004-07-13

    申请号：US10037452

    申请日：2001-12-20

    申请人： Anthony de la Llera ,  Xuyen Pham ,  Cangshan Xu ,  David Wei ,  Tony Luong

    发明人： Anthony de la Llera ,  Xuyen Pham ,  Cangshan Xu ,  David Wei ,  Tony Luong

    IPC分类号： B24B722

    CPC分类号： B24B21/10 ,  B24B37/04

    摘要： An air platen assembly is described and includes a platen that has a plurality of concentric rings. Each of the rings has a plurality of openings in order to provide a cushion of air to a CMP belt. At least one of the rings extends beyond an outer edge of a wafer to be planarized by the CMP belt. A support is attached with the platen and has a plurality of air ports for pressurized air to pass to the rings of the platen. A gasket is positioned between the support and the platen and has a plurality of cutouts that align with the openings and the air ports. A base is also included and supports the support.

    摘要翻译： 描述了空气压板组件，并且包括具有多个同心环的压板。 每个环具有多个开口，以便向CMP带提供空气缓冲。 至少一个环延伸超过晶片的外边缘以由CMP带平坦化。 支撑件与压板连接，并且具有多个用于加压空气的空气端口以传递到压板的环。 垫片定位在支撑件和压板之间，并且具有与开口和空气端口对准的多个切口。 还包括基地并支持支持。

    Movable grounding arrangements in a plasma processing chamber and methods therefor
    6.
    发明授权
    Movable grounding arrangements in a plasma processing chamber and methods therefor 有权
    等离子体处理室中的可移动接地装置及其方法

    公开(公告)号：US08847495B2

    公开(公告)日：2014-09-30

    申请号：US13616641

    申请日：2012-09-14

    申请人： Anthony de la Llera ,  Michael C. Kellogg ,  Alexei Marakhtanov ,  Rajinder Dhindsa

    发明人： Anthony de la Llera ,  Michael C. Kellogg ,  Alexei Marakhtanov ,  Rajinder Dhindsa

    IPC分类号： H01J7/24

    CPC分类号： H01J37/32082 ,  H01J37/32577

    摘要： A plasma processing systems having at least one plasma processing chamber, comprising a movable grounding component, an RF contact component configured to receive RF energy from an RF source when the RF source provides the RF energy to the RF contact component, and a ground contact component coupled to ground. The plasma processing system further includes an actuator operatively coupled to the movable grounding component for disposing the movable grounding component in a first position and a second position. The first position represents a position whereby the movable grounding component is not in contact with at least one of the RF contact component and the ground contact component. The second position represents a position whereby the movable grounding component is in contact with both the RF contact component and the ground contact component.

    摘要翻译： 一种具有至少一个等离子体处理室的等离子体处理系统，包括可移动接地部件，RF接触部件，其被配置为当RF源向RF接触部件提供RF能量时从RF源接收RF能量;以及接地部件 加上地面。 等离子体处理系统还包括可操作地耦合到可移动接地部件的致动器，用于将可移动接地部件设置在第一位置和第二位置。 第一位置表示可移动接地部件不与RF接触部件和接地部件中的至少一个接触的位置。 第二位置表示可移动接地部件与RF接触部件和接地部件接触的位置。

    Clamped showerhead electrode assembly
    9.
    发明申请
    Clamped showerhead electrode assembly 有权
    夹紧淋浴头电极组件

    公开(公告)号：US20100003824A1

    公开(公告)日：2010-01-07

    申请号：US12216526

    申请日：2008-07-07

    申请人： Babak Kadkhodayan ,  Rajinder Dhindsa ,  Anthony de la Llera ,  Michael C. Kellogg

    发明人： Babak Kadkhodayan ,  Rajinder Dhindsa ,  Anthony de la Llera ,  Michael C. Kellogg

    IPC分类号： H01L21/3065 ,  C23C16/00 ,  B05C11/00

    CPC分类号： H01J37/32532 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32605

    摘要： An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which includes an inner electrode mechanically attached to a backing plate by a clamp ring and an outer electrode attached to the backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release cam pins extending upward from the upper face of the outer electrode. To compensate for differential thermal expansion, the clamp ring can include expansion joins at spaced locations which allow the clamp ring to absorb thermal stresses.

    摘要翻译： 用于等离子体反应室的电极组件，用于半导体衬底处理。 组件包括上喷头电极，其包括通过夹紧环机械连接到背板的内电极和通过一系列间隔开的凸轮锁附接到背板的外电极。 防护环围绕背板并且可移动到保护环中的开口与背板中的开口对准的位置，使得凸轮锁可以用工具旋转以释放从外部的上表面向上延伸的凸轮销 电极。 为了补偿差分热膨胀，夹紧环可以包括在间隔位置处的膨胀接合，这允许夹紧环吸收热应力。

    Substrate holding and spinning assembly and methods for making the same
    10.
    发明授权
    Substrate holding and spinning assembly and methods for making the same 有权
    基板保持和旋转组件及其制造方法

    公开(公告)号：US07226055B1

    公开(公告)日：2007-06-05

    申请号：US10611227

    申请日：2003-06-30

    申请人： Gregory R. Bettencourt ,  Anthony de la Llera ,  Xuyen N. Pham

    发明人： Gregory R. Bettencourt ,  Anthony de la Llera ,  Xuyen N. Pham

    IPC分类号： B23B31/18

    CPC分类号： H01L21/68728 ,  H01L21/67034 ,  Y10S134/902 ,  Y10T279/18

    摘要： A substrate holding apparatus is provided. The substrate holding apparatus includes a chuck yoke, a plurality of arm assemblies, and a plurality of gripper assemblies. A first end of each of the arm assemblies is connected to the chuck yoke and each of the arm assemblies has a spring. A second end of each of the arm assemblies is connected to a respective one of the plurality of grippers. The chuck yoke is capable of rotating so as to move each of the plurality of arm assemblies and respective plurality of gripper assemblies into either a closed position or an open position. A compression force from each of the springs is applied to a substrate when the grippers are moved to the closed position.

    摘要翻译： 提供了一种基板保持装置。 基板保持装置包括卡盘轭，多个臂组件和多个夹持器组件。 每个臂组件的第一端连接到卡盘轭，并且每个臂组件都具有弹簧。 每个臂组件的第二端连接到多个夹具中的相应一个。 卡盘轭能够旋转，以便将多个臂组件和相应的多个夹持器组件中的每一个移动到关闭位置或打开位置。 当夹持器移动到关闭位置时，来自每个弹簧的压缩力被施加到基底。