公开(公告)号：US06510365B1

公开(公告)日：2003-01-21

申请号：US09830363

申请日：2001-04-25

申请人： Yasuhiko Nishinakayama ,  Shigeru Ishizawa ,  Hiroaki Saeki ,  Takashi Kawano ,  Tetsu Osawa

发明人： Yasuhiko Nishinakayama ,  Shigeru Ishizawa ,  Hiroaki Saeki ,  Takashi Kawano ,  Tetsu Osawa

IPC分类号： G06F700

CPC分类号： H01L21/681 ,  G05B19/4015 ,  G05B19/402 ,  G05B2219/37339 ,  G05B2219/45031 ,  G05B2219/49299 ,  H01L21/67745 ,  Y10S414/136

摘要： The invention is a method for positioning a conveying mechanism having a holding portion for semiconductor wafers. Respective provisional position coordinates of an orienting teaching standard position and a container teaching standard positions are inputted into a controlling unit in advance. A wafer to be conveyed precisely positioned with respect to and held by the holding portion is conveyed and placed on the rotating orienting device according a control based on the provisional coordinates of the orienting teaching standard position. A posture detector then detects the eccentric volume and eccentric direction of the wafer. Appropriate position coordinates are made by amending the provisional coordinates. Then, a wafer to be conveyed precisely positioned with respect to the container teaching standard position is conveyed and placed on the rotating orienting device according a control based on the provisional coordinates of the orienting teaching standard position. A posture detector then detects the eccentric volume and eccentric direction of the wafer. Appropriate position coordinates are made by amending the provisional coordinates.

摘要翻译： 本发明是用于定位具有用于半导体晶片的保持部分的输送机构的方法。 定向教学标准位置和容器教学标准位置的各个临时位置坐标被预先输入到控制单元中。 根据定向教学标准位置的临时坐标的控制，将要被输送的精确定位的晶片相对于保持部分保持并被放置在旋转定向装置上。 然后姿势检测器检测晶片的偏心体积和偏心方向。 通过修改临时坐标来进行适当的位置坐标。 然后，基于定向教学标准位置的临时坐标的控制，将要相对于容器教导标准位置精确定位的晶片输送并放置在旋转取向装置上。 然后姿势检测器检测晶片的偏心体积和偏心方向。 通过修改临时坐标来进行适当的位置坐标。

公开(公告)号：US20060210387A1

公开(公告)日：2006-09-21

申请号：US10564618

申请日：2004-07-09

申请人： Hiroaki Saeki ,  Shigeru Ishizawa ,  Takehiro Shindo ,  Tsutomu Hiroki ,  Wataru Machiyama

发明人： Hiroaki Saeki ,  Shigeru Ishizawa ,  Takehiro Shindo ,  Tsutomu Hiroki ,  Wataru Machiyama

IPC分类号： B66C23/00

CPC分类号： H01L21/67742 ,  B25J9/042 ,  B25J9/107 ,  H01L21/68707 ,  Y10T74/20305

摘要： A transfer apparatus (20) for a target substrate (W) includes a rotatable rotary base (24). First and second arm mechanisms (26, 28) are attached to the rotary base and configured to bend and stretch. Each of the first and second arm mechanisms has a proximal end arm (26A, 28A), an intermediate arm (26B, 28B), and a pick (26C, 28C) which are pivotally coupled to each other sequentially from the rotary base. The picks are disposed to support the target substrate. A link mechanism (30) is coupled to the proximal end arms of the first and second arm mechanisms to drive the first and second arm mechanisms. A first driving source (32) is disposed to rotatably drive the rotary base. A second driving source (34) is disposed to drive the link mechanism so as to bend or stretch the first and second arm mechanisms.

摘要翻译： 用于目标基板（W）的转印装置（20）包括可旋转的旋转基座（24）。 第一和第二臂机构（26,28）附接到旋转底座并且构造成弯曲和拉伸。 第一和第二臂机构中的每一个具有近端臂（26A，28A），中间臂（26B，28B）和拾取器（26C，28C），该拾取器彼此顺序地相互联接 从旋转底座。 设置拾取器以支撑目标衬底。 连杆机构（30）联接到第一和第二臂机构的近端臂以驱动第一和第二臂机构。 第一驱动源（32）设置成可旋转地驱动旋转底座。 第二驱动源（34）设置成驱动连杆机构以使第一和第二臂机构弯曲或拉伸。

公开(公告)号：US20050087300A1

公开(公告)日：2005-04-28

申请号：US10500102

申请日：2002-12-25

申请人： Shigeru Ishizawa ,  Hiroaki Saeki

发明人： Shigeru Ishizawa ,  Hiroaki Saeki

IPC分类号： B65G49/00 ,  B65G49/07 ,  H01L21/00 ,  H01L21/677 ,  C23F1/00

CPC分类号： H01L21/67173 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135 ,  Y10S414/139

摘要： A main carrying device forming a part of a processing system, comprising a casing (40) forming a main carrying chamber (44) having vacuum atmosphere, the casing (40) further comprising a plurality of transfer ports (52A, 52B) for transferring the processed body (W) between the carrying chamber 44 and the outside, a mobile body (58) is slidably installed on a guide rail (48) horizontally installed in the carrying chamber (44), a linear motor mechanism (54, 62) for moving the mobile body (58) along the guide rail (48) is installed, a holding body (64) for holding the processed body (W) is liftably connected to the mobile body (58) through a support member (66), and a lifting mechanism (74) for lifting the support member (66) relative to the mobile body (58) is installed in the casing (40) at a position corresponding to the transfer ports (52A, 52B).

摘要翻译： 一种形成处理系统的一部分的主承载装置，包括形成具有真空气氛的主承载室（44）的壳体（40），所述壳体（40）还包括多个传送端口（52A，52B），用于 将处理体（W）传送到搬运室44与外部之间，可移动体（58）可滑动地安装在水平安装在运送室（44）中的导轨（48）上，线性马达机构 ），用于沿着导轨（48）移动移动体（58），用于保持加工体（W）的保持体（64）通过支撑构件（66）可拆卸地连接到移动体（58） ，并且用于相对于所述移动体（58）提升所述支撑构件（66）的提升机构（74）在与所述输送口（52A，52B）对应的位置处安装在所述壳体（40）中。

公开(公告)号：US20070107845A1

公开(公告)日：2007-05-17

申请号：US11623573

申请日：2007-01-16

申请人： Shigeru Ishizawa ,  Hiroaki Saeki ,  Yoshimitsu Tamura ,  Shigetoshi Hosaka ,  Masahide Itoh ,  Kazushi Tahara ,  Yasushi Kodashima

发明人： Shigeru Ishizawa ,  Hiroaki Saeki ,  Yoshimitsu Tamura ,  Shigetoshi Hosaka ,  Masahide Itoh ,  Kazushi Tahara ,  Yasushi Kodashima

IPC分类号： C23F1/00 ,  H01L21/306 ,  C23C16/00

CPC分类号： H01L21/67751 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67184 ,  H01L21/67201

摘要： A semiconductor processing system includes an intermediate structure disposed between an atmospheric pressure entrance transfer chamber and a vacuum common transfer chamber. The intermediate structure includes a transfer passage for a target substrate to pass therein. The transfer passage includes a first buffer chamber a middle transfer chamber and a second buffer chamber detachably connected. An additional processing apparatus is detachably connected to the middle transfer chamber. The intermediate structure is selectively arranged in first or second state. In the first state, the additional processing apparatus performs a vacuum process, while the first buffer chamber is a load-lock chamber. In the second state, the additional processing apparatus performs an atmospheric pressure process, while the second buffer chamber is a load-lock chamber.

摘要翻译： 半导体处理系统包括设置在大气压入口传送室和真空公共传送室之间的中间结构。 中间结构包括用于目标基板的传送通道。 传送通道包括第一缓冲室，中间传送室和可拆卸地连接的第二缓冲室。 附加处理装置可拆卸地连接到中间传送室。 中间结构选择性地布置在第一或第二状态。 在第一状态下，附加处理装置执行真空处理，而第一缓冲室是装载锁定室。 在第二状态下，附加处理装置进行大气压处理，而第二缓冲室是装载锁定室。

公开(公告)号：US06466835B1

公开(公告)日：2002-10-15

申请号：US09521999

申请日：2000-03-09

申请人： Shigeru Ishizawa ,  Hiroaki Saeki

发明人： Shigeru Ishizawa ,  Hiroaki Saeki

IPC分类号： G06F1900

CPC分类号： H01L21/67745 ,  H01L21/67167 ,  H01L21/67276

摘要： In a deadlock avoidance method of the present invention, after setting two kinds of transport routes, it is determined whether each of treatment chambers located on the respective transport routes is located upstream or downstream of other treatment chambers on a transport route formed by integrating the transport routes, and an upstream/downstream table indicative of an upstream/downstream relationship between the respective treatment chambers on all the transport routes. When it is determined that a common treatment chamber corresponds to both of upstream and downstream positions while preparing the upstream/downstream table, it is determined that the wafers cause a deadlock.

摘要翻译： 在本发明的死锁避免方法中，在设定两种运输路线之后，确定位于相应运输路线上的每个处理室是否位于通过整合运输路线形成的运输路线上的其他处理室的上游或下游 路线，以及表示所有运输路线上各处理室之间的上游/下游关系的上游/下游表。 当准备上游/下游台时，当确定公共处理室对应于上游和下游两个位置时，确定晶片导致死锁。

公开(公告)号：US07622006B2

公开(公告)日：2009-11-24

申请号：US10500102

申请日：2002-12-25

申请人： Shigeru Ishizawa ,  Hiroaki Saeki

发明人： Shigeru Ishizawa ,  Hiroaki Saeki

IPC分类号： C23C16/00 ,  H01L21/67 ,  C23F1/00

CPC分类号： H01L21/67173 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135 ,  Y10S414/139

摘要： A main carrying device forming a part of a processing system, comprising a casing (40) forming a main carrying chamber (44) having vacuum atmosphere, the casing (40) further comprising a plurality of transfer ports (52A, 52B) for transferring the processed body (W) between the carrying chamber 44 and the outside, a mobile body (58) is slidably installed on a guide rail (48) horizontally installed in the carrying chamber (44), a linear motor mechanism (54, 62) for moving the mobile body (58) along the guide rail (48) is installed, a holding body (64) for holding the processed body (W) is liftably connected to the mobile body (58) through a support member (66), and a lifting mechanism (74) for lifting the support member (66) relative to the mobile body (58) is installed in the casing (40) at a position corresponding to the transfer ports (52A, 52B).

摘要翻译： 一种形成处理系统的一部分的主承载装置，包括形成具有真空气氛的主承载室（44）的壳体（40），所述壳体（40）还包括多个传送端口（52A，52B） 在承载室44和外部之间的处理体（W），可移动体（58）可滑动地安装在水平安装在运送室（44）中的导轨（48）上;线性马达机构（54,62） 沿着导轨（48）移动移动体（58），用于保持加工体（W）的保持体（64）通过支撑构件（66）可拆卸地连接到移动体（58），并且 用于相对于移动体（58）提升支撑构件（66）的升降机构（74）在对应于输送口（52A，52B）的位置处安装在壳体（40）中。

公开(公告)号：US20050220582A1

公开(公告)日：2005-10-06

申请号：US11075707

申请日：2005-03-10

申请人： Motohiro Kumagai ,  Shigeru Ishizawa ,  Hiroaki Saeki

发明人： Motohiro Kumagai ,  Shigeru Ishizawa ,  Hiroaki Saeki

IPC分类号： B65B21/02 ,  H01L21/00 ,  H01L21/677 ,  H01L21/68

CPC分类号： H01L21/68 ,  H01L21/67167 ,  H01L21/67259 ,  H01L21/67778

摘要： A teaching method for storing in a controller a target moving position of a transfer mechanism in a processing system includes the steps of temporarily stopping the transfer mechanism in the middle of a moving route to a temporary moving destination position so as to make sure that the transfer mechanism does not interfere with another members at a potential interference location where there is a possibility that the transfer mechanism interferes with said another member, resuming to move the temporarily stopped transfer mechanism by inputting a moving instruction, repeating the temporarily stopping step and the resuming step, and when the pick reaches the temporary moving destination position, storing, as the target moving position, in the controller a position of the pick after adjusting and moving or without adjusting and moving the position of the pick.

摘要翻译： 一种用于在控制器中存储处理系统中的传送机构的目标移动位置的教学方法包括以下步骤：将移动路径中的传送机构临时停止到临时移动目的地位置，以确保传送 机构不影响潜在干扰位置处的另一构件，其中存在转印机构与所述另一构件干涉的可能性，通过输入移动指令恢复移动临时停止的转移机构，重复暂时停止步骤和恢复步骤 并且当拾取器到达临时移动目的地位置时，在调节和移动之后将控制器中的位置存储在控制器中，或者不调整和移动拾取器的位置。

公开(公告)号：US07837425B2

公开(公告)日：2010-11-23

申请号：US10564618

申请日：2004-07-09

申请人： Hiroaki Saeki ,  Shigeru Ishizawa ,  Takehiro Shindo ,  Tsutomu Hiroki ,  Wataru Machiyama

发明人： Hiroaki Saeki ,  Shigeru Ishizawa ,  Takehiro Shindo ,  Tsutomu Hiroki ,  Wataru Machiyama

IPC分类号： B25J18/02

CPC分类号： H01L21/67742 ,  B25J9/042 ,  B25J9/107 ,  H01L21/68707 ,  Y10T74/20305

摘要： A transfer apparatus (20) for a target substrate (W) includes a rotatable rotary base (24). First and second arm mechanisms (26, 28) are attached to the rotary base and configured to bend and stretch. Each of the first and second arm mechanisms has a proximal end arm (26A, 28A), an intermediate arm (26B, 28B), and a pick (26C, 28C) which are pivotally coupled to each other sequentially from the rotary base. The picks are disposed to support the target substrate. A link mechanism (30) is coupled to the proximal end arms of the first and second arm mechanisms to drive the first and second arm mechanisms. A first driving source (32) is disposed to rotatably drive the rotary base. A second driving source (34) is disposed to drive the link mechanism so as to bend or stretch the first and second arm mechanisms.

摘要翻译： 用于目标基板（W）的转印装置（20）包括可旋转的旋转基座（24）。 第一和第二臂机构（26,28）附接到旋转底座并且构造成弯曲和拉伸。 第一和第二臂机构中的每一个具有近端臂（26A，28A），中间臂（26B，28B）和拾取器（26C，28C），其从旋转底座依次枢转地联接。 设置拾取器以支撑目标衬底。 连杆机构（30）联接到第一和第二臂机构的近端臂以驱动第一和第二臂机构。 第一驱动源（32）设置成可旋转地驱动旋转底座。 第二驱动源（34）设置成驱动连杆机构以使第一和第二臂机构弯曲或拉伸。

公开(公告)号：US20060021575A1

公开(公告)日：2006-02-02

申请号：US10529171

申请日：2003-09-19

申请人： Shigeru Ishizawa ,  Eiji Horike

发明人： Shigeru Ishizawa ,  Eiji Horike

IPC分类号： C23C16/00

CPC分类号： H01L21/67167 ,  H01L21/67184 ,  H01L21/67745

摘要： A method for carrying an object to be processed used for a processing apparatus which comprises a plurality of process chambers including a specific process chamber for a process in which the object in process is easily contaminated and a carrying mechanism having two picks. The method includes a plurality of carrying steps wherein the object in process is sequentially carried from one chamber to another among the plurality of process chambers. One of the two picks is used in carrying steps up right before carrying the object into the specific process chamber, and the other pick is used in the step of carrying the object into the specific process chamber and the later carrying steps.

摘要翻译： 一种用于运送用于处理设备的被处理物体的方法，该处理设备包括多个处理室，该处理室包括用于处理中的物体容易被污染的过程的特定处理室和具有两个拾取的搬运机构。 该方法包括多个携带步骤，其中处理中的物体在多个处理室中从一个室依次传送到另一个室。 在将物体携带到特定处理室之前，两个拾取器中的一个用于承载步骤，而另一个拾取器用于将物体运送到特定处理室和后续搬运步骤的步骤中。

公开(公告)号：US6162010A

公开(公告)日：2000-12-19

申请号：US99784

申请日：1998-06-19

申请人： Shigeru Ishizawa ,  Tatsuya Ogi ,  Hiroaki Mochizuki

发明人： Shigeru Ishizawa ,  Tatsuya Ogi ,  Hiroaki Mochizuki

IPC分类号： B65G49/07 ,  C23C16/54 ,  H01L21/00 ,  H01L21/677 ,  H01L21/02

CPC分类号： H01L21/67167 ,  C23C16/54 ,  H01L21/67276 ,  Y10S414/137 ,  Y10S414/139

摘要： To a common transfer chamber 102 of a treatment system 100, a treatment chamber 104a of an etching system 104, treatment chambers 106a and 108a of first and second CVD systems 106 and 108, a cooling chamber (a post-treatment chamber) 110a of a cooling system 110, and first and second cassette chambers 112 and 114 are connected. In the common transfer chamber 102, a transport arm 118 and a positioning system 120 are arranged. When the treatment system 100 is restarted after being stopped during a treatment, wafers W are sequentially recovered into a cassette 116 on the basis of the control of an operation storage device, which stores therein the origin data and destination data of the wafers W. At this time, the wafers W heated to a very high temperature by a thin film deposition treatment are sequentially recovered into a cassette 116 after being cooled (post-treated), and other wafers W are sequentially recovered directly into the cassette 116. Thus, there is provided a method for recovering an object to be treated, into a cassette in a desired state when a treatment system is restarted after being stopped during a treatment.

摘要翻译： 对于处理系统100的公共传送室102，蚀刻系统104的处理室104a，第一和第二CVD系统106和108的处理室106a和108a，以及第一和第二CVD系统106和108的冷却室（后处理室）110a 冷却系统110和第一和第二盒室112和114连接。 在公共传送室102中布置有传送臂118和定位系统120。 当处理系统100在处理期间停止之后重新启动处理系统100时，基于操作存储装置的控制，将晶片W依次回收到盒116中，操作存储装置存储有晶片W的原始数据和目的地数据。 此时，通过薄膜沉积处理被加热到非常高的温度的晶片W在冷却（后处理）之后被顺序地回收到盒116中，并且其它晶片W被顺序地直接回收到盒116中。因此，在那里 提供了一种在处理期间停止后重新开始处理系统时将待处理物体回收到期望状态的盒中的方法。