摘要:
A semiconductor memory device, such as a DRAM, includes a word line multi-selection circuit. A row decoder generates a word line selecting signal for selecting a read-out word line for use in the current cycle to read information from a selected memory cell. The word line selecting signal is also used to select a write-back word line which was used in the previous cycle to read cell information and is used in the current cycle to write back cell information. The word line multi-selection circuit includes a register for temporarily storing the cell information read from the selected memory cell and also for providing, in the current cycle, information read in the previous cycle in order to perform the write-back operation.
摘要:
In the storage device of the invention, latch control is performed on a series of signals in response to latch control signals. Latch control terminals are provided to which the latch control signals are input respectively and a plurality of signal terminals to which a series of signals are input. Herein, a plurality of latch circuits is provided so as to correspond to the plurality of signal terminals, respectively. The plurality of latch circuits are located within a specified distance from their associated signal terminals respectively and within a specified distance from the latch control terminals. The delays of signal transmission from the signal terminals to their associated latch circuits can be equalized and the delays of signal transmission from the latch control terminals to which the latch control signals for executing latch control are input to the latch circuits can be equalized. This contributes to a reduction in the skew of the latch characteristics of the signals.
摘要:
A memory system (1A) includes a memory section (2A) and a memory control section (3A). The memory section (2A) includes a test circuit (4A), a data register (5A), a data output section (6A), and a memory core section (9A). Data DI is held in the data resistor (5A). The test circuit (4A) outputs write inhibit signal WINH to the memory core section (9A) in response to test signal TEST. Write instruction recognition signal WR which recognizes that a write command is inputted into the memory section (2A) and select signal S are inverted and, in response thereto, retained data DR of the data register (5A) is outputted as output data DO from the data output section (6A). Thus, it is possible to test whether generation, propagation, or recognition operation of a write command CMD and the data DI is normal or not without executing the operation of writing data into a memory cell of the memory section.
摘要:
A semiconductor memory device includes a memory block having memory cells connected to global bit lines and global word lines are arranged in matrix constitutes a memory block column sharing global bit lines, the memory block column being developed in global word line wiring direction, wherein at least two of memory block columns adjoining each other constitute a to-be-remedied unit, and redundant block(s), which is/are arranged sharing global bit lines with the memory block column(s), which is/are provided in each to-be-remedied unit and number of redundant block(s) is/are smaller than that of memory block column(s) included in the to-be-remedied unit. A minimum number of redundant memory blocks necessary for defectiveness remedy can be provided thereby enhancing the yield with optimization of the manufacturing and circuits. Redundancy remedy efficiency can also be improved while minimizing increased chip die size of the semiconductor memory device.
摘要:
An address identifying memory block is match-compared with address information stored in a to-be-remedied block memory section in a block redundancy judge section. A redundant block select signal is outputted from the block redundancy judge section by judgment of address match. A memory block column select section selects a memory block column having a redundant memory block irrespective of an address signal as the redundant block select signal is activated if block redundancy is activated to output a memory block column select signal. A column redundancy memory section selects address information of column redundancy relating a redundant memory block arranged in a memory block column in accordance with the memory block column select signal.
摘要:
A voltage level detector insusceptible to noise is disclosed. The voltage level detector includes a detector section, an output circuit section coupled to the detector section, and a delay circuit section provided between the detector section and the output circuit section. The detector section receives a target signal, and determines if the voltage level of the target signal lies within a predetermined voltage zone. The output circuit section outputs a detection signal when the target signal is found to be in the predetermined zone by the detector section. When the detector section detects that the target signal has come off the predetermined voltage zone, the delay circuit section delays the vanishing of the detection signal output from the output circuit section by a given delay time.
摘要:
A semiconductor device includes a CAM cell array that stores the operation setting information as to the semiconductor device, a controller that controls read and write of the CAM cell array, a row decoder, and a column decoder. With this structure, different row addresses are allocated to respective functions of the operation setting information. Accordingly, stress is not caused in the CAM cell array of the unselected functions at the time of programming.
摘要:
A memory system (1A) includes a memory section (2A) and a memory control section (3A). The memory section (2A) includes a test circuit (4A), a data register (5A), a data output section (6A), and a memory core section (9A). Data DI is held in the data resistor (5A). The test circuit (4A) outputs write inhibit signal WINH to the memory core section (9A) in response to test signal TEST. Write instruction recognition signal WR which recognizes that a write command is inputted into the memory section (2A) and select signal S are inverted and, in response thereto, retained data DR of the data register (5A) is outputted as output data DO from the data output section (6A). Thus, it is possible to test whether generation, propagation, or recognition operation of a write command CMD and the data DI is normal or not without executing the operation of writing data into a memory cell of the memory section.
摘要:
An access identification circuit (4) identifies a first access operation or a second access operation and outputs an identification signal S. During the first access operation, stored data is read out after detecting a column address CADD, a burst address, and updating a word line to newly select memory cells MC. In the second access operation, the memory cells MC connected to the common word line which has been selected are selected by sequentially switching column selector switches. Operating condition information Dx (DAx and/or DBx) used for setting a load condition in a dummy load circuit (5) and/or setting a pulse width for an equalize signal EQ in an amplification control circuit (6) is stored in each of first and second storage sections (1, 2) that are provided for the first and second access operations, respectively. The operating condition information Dx is selected by a selector circuit (3) in response to the identification signal S and fed to the dummy load circuit (5) and/or the amplification control circuit (6). A suitable operating condition is selected for each of the access operations.
摘要:
A semiconductor memory device includes a memory block having memory cells connected to global bit lines and global word lines are arranged in matrix constitutes a memory block column sharing global bit lines, the memory block column being developed in global word line wiring direction, wherein at least two of memory block columns adjoining each other constitute a to-be-remedied unit, and redundant block(s), which is/are arranged sharing global bit lines with the memory block column(s), which is/are provided in each to-be-remedied unit and number of redundant block(s) is/are smaller than that of memory block column(s) included in the to-be-remedied unit. A minimum number of redundant memory blocks necessary for defectiveness remedy can be provided thereby enhancing the yield with optimization of the manufacturing and circuits. Redundancy remedy efficiency can also be improved while minimizing increased chip die size of the semiconductor memory device.