公开(公告)号：US20090053553A1

公开(公告)日：2009-02-26

申请号：US12171568

申请日：2008-07-11

申请人： Yasushi MASAGO ,  Ryoichi Ozaki ,  Hiroshi Sakamoto ,  Yukio Sugishita

发明人： Yasushi MASAGO ,  Ryoichi Ozaki ,  Hiroshi Sakamoto ,  Yukio Sugishita

IPC分类号： B32B15/01

CPC分类号： B32B15/01 ,  Y10S428/929 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/1291

摘要： Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 μm; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D1] of the minimum inscribed circle of the Sn covering layer is 0.2 μm or less, the diameter [D2] of the maximum inscribed circle of the Sn covering layer is 1.2 to 20 μm, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu—Sn alloy covering layer is 0.2 μm or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 μm or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.

摘要翻译： 公开了一种用于连接部件的导电材料，包括：由Cu带构成的基材; 平均厚度为0.2〜3.0μm的Cu-Sn合金覆盖层; 和Sn覆盖层，所述Cu-Sn合金覆盖层设置在所述基材和所述Sn覆盖层之间，其中在与所述导电材料的表面垂直的截面中，所述最小内切圆的直径[D1] Sn覆盖层为0.2μm以下，Sn覆盖层的最大内切圆的直径[D2]为1.2〜20μm，材料的最外点与最外点之间的仰角[y] Cu-Sn合金被覆层为0.2μm以下，作为Sn覆盖层的一部分，在最外层形成有大致均匀厚度的平均厚度为0.01μm以上的亮色或半亮锡电镀层 。

公开(公告)号：US20080257581A1

公开(公告)日：2008-10-23

申请号：US12101398

申请日：2008-04-11

申请人： Yasushi MASAGO ,  Ryoichi Ozaki ,  Kouichi Taira

发明人： Yasushi MASAGO ,  Ryoichi Ozaki ,  Kouichi Taira

IPC分类号： H01B5/00

CPC分类号： C23C2/28 ,  C23C2/02 ,  C23C26/02 ,  C23C28/021 ,  C23C28/023 ,  C25D5/10 ,  C25D5/34 ,  C25D5/505 ,  H01R13/03

摘要： A terminal for an engaging type connector includes a punched Cu alloy strip as a base material, a coating formed on the Cu alloy strip by postplating processes and including a Sn layer, and a Cu—Sn alloy layer sandwiched between the base material and the Sn layer. The Sn layer is smoothed by a reflowing process. The terminal has an engaging part and a solder-bonding part, and the surface of a part of the base material corresponding to the engaging part has a surface roughness higher than that of the surface of the base material corresponding to the solder-bonding part. The engaging part has a low frictional property and the solder-bonding part has improved solder wettability.

摘要翻译： 用于接合型连接器的端子包括作为基材的冲孔Cu合金带，通过后处理并包括Sn层在Cu合金带上形成的涂层以及夹在基材和Sn之间的Cu-Sn合金层 层。 Sn层通过回流工艺平滑。 端子具有接合部分和焊接部分，并且对应于接合部分的部分基材的表面的表面粗糙度高于与焊接部分对应的基材表面的表面粗糙度。 接合部具有低摩擦性能，并且焊接部分具有改善的焊料润湿性。

公开(公告)号：US20120138330A1

公开(公告)日：2012-06-07

申请号：US13312546

申请日：2011-12-06

申请人： Yasushi MASAGO ,  Koichi Taira ,  Toshiyuki Mitsui ,  Junichi Kakumoto ,  Masayasu Nishimura

发明人： Yasushi MASAGO ,  Koichi Taira ,  Toshiyuki Mitsui ,  Junichi Kakumoto ,  Masayasu Nishimura

IPC分类号： H05K1/02 ,  H01R43/16

CPC分类号： H01R12/55 ,  C25D5/10 ,  H01R13/03 ,  Y10T29/49224

摘要： The invention forms a Sn coating layer and a Cu—Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu—Sn alloy coating layer 2 is exposed on the outermost surface on both sides of Sn coating layers each constituting the group of Sn coating layers. The Sn coating layers have a width of 1 to 500 μm, an interval between adjacent Sn coating layers is 1 to 20000 μm, and an outermost maximum height roughness in a terminal insertion direction is at most 10 μm.

摘要翻译： 本发明在PCB端子中形成具有适当可控平面形状的Sn涂层和Cu-Sn合金涂层。 形成作为多个基本上平行的多个Sn层的一组Sn涂层作为表面被覆层，并且Cu-Sn合金涂层2暴露在构成Sn组的Sn涂层两侧的最外表面上 涂层。 Sn被覆层的宽度为1〜500μm，相邻的Sn被覆层的间隔为1〜20000μm，端子插入方向的最外侧的最高高度粗糙度为10μm以下。

公开(公告)号：US20110236712A1

公开(公告)日：2011-09-29

申请号：US13069016

申请日：2011-03-22

申请人： Yasushi MASAGO ,  Koichi TAIRA ,  Toshiyuki MITSUI ,  Junichi KAKUMOTO

发明人： Yasushi MASAGO ,  Koichi TAIRA ,  Toshiyuki MITSUI ,  Junichi KAKUMOTO

IPC分类号： B32B3/30 ,  B32B15/01 ,  H01R43/16 ,  H01R43/00

CPC分类号： H01R43/16 ,  B32B15/00 ,  C23C28/021 ,  C25D5/10 ,  C25D5/12 ,  C25D5/34 ,  C25D5/50 ,  C25D5/505 ,  H01R13/03 ,  Y10T29/49204 ,  Y10T29/49206 ,  Y10T29/49224 ,  Y10T428/12389 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12861 ,  Y10T428/12903

摘要： The surface roughness of a copper sheet is adjusted to have an arithmetic mean roughness Ra of 0.5 μm or more and 4.0 μm or less in a direction parallel to a sliding direction upon connection, a mean projection-depression interval RSm of 0.01 mm or more and 0.3 mm or less in the direction, a skewness Rsk of less than 0, and a protrusion peak portion height Rpk of 1 μm or less. Further, as a surface coating layer, a Sn coating layer group X observed as a plurality of parallel lines is included, and a Cu—Sn alloy coating layer is present adjacent to each side of each of Sn coating layers constituting the Sn coating layer group X. The maximum height roughness Rz is 10 μm or less in a direction of part insertion. At the time of stamping the copper sheet, the copper sheet is surface-roughened by pressing, thereby forming depressions observed as a plurality of parallel lines in the surface of the copper sheet. The copper sheet is then plated with Cu and Sn, followed by reflowing to complete the production.

摘要翻译： 将铜片的表面粗糙度调节为在连接时平行于滑动方向的方向上的算术平均粗糙度Ra为0.5μm以上且4.0μm以下，平均投影 - 凹陷间隔RSm为0.01mm以上， 方向为0.3mm以下，斜度Rsk小于0，突出峰部高度Rpk为1μm以下。 此外，作为表面被覆层，包含作为多条平行线观察到的Sn被覆层群X，并且在构成Sn被覆层组的Sn被覆层各附近存在Cu-Sn合金被覆层 最大高度粗糙度Rz在部分插入方向上为10μm以下。 在冲压铜片时，通过压制对铜箔进行表面粗糙化，从而在铜板的表面上形成作为多条平行线观察到的凹陷。 然后将铜片镀上Cu和Sn，然后回流以完成生产。

公开(公告)号：US20100247959A1

公开(公告)日：2010-09-30

申请号：US12712494

申请日：2010-02-25

申请人： Kouichi TAIRA ,  Yasushi MASAGO

发明人： Kouichi TAIRA ,  Yasushi MASAGO

IPC分类号： B32B15/20 ,  B32B15/01 ,  C25D5/50

CPC分类号： C25D5/12 ,  C25D3/12 ,  C25D3/30 ,  C25D3/40 ,  C25D3/58 ,  C25D5/48 ,  C25D5/50 ,  Y10S428/929 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/1291

摘要： In Sn-plated copper or a Sn-plated copper alloy according to the present invention, a surface plating layer including a Ni layer, a Cu—Sn alloy layer, and a Sn layer which are deposited in this order is formed on a surface of a base material made of copper or a copper alloy. An average thickness of the Ni layer is 0.1 to 1.0 μm, an average thickness of the Cu—Sn alloy layer is 0.55 to 1.0 μm, and an average thickness of the Sn layer is 0.2 to 1.0 μm. The Cu—Sn alloy layer includes Cu—Sn alloy layers having two compositions, a portion thereof in contact with the Ni layer is formed of an ε-phase having an average thickness of 0.5 to 0.95 μm, and a portion thereof in contact with the Sn layer is formed of a η-phase having an average thickness of 0.05 to 0.2 μm.

摘要翻译： 在根据本发明的镀Sn的铜或镀Sn的铜合金中，在其表面上形成有依次沉积的Ni层，Cu-Sn合金层和Sn层的表面镀层 由铜或铜合金制成的基材。 Ni层的平均厚度为0.1〜1.0μm，Cu-Sn合金层的平均厚度为0.55〜1.0μm，Sn层的平均厚度为0.2〜1.0μm。 Cu-Sn合金层包括具有两种组成的Cu-Sn合金层，其与Ni层接触的部分由平均厚度为0.5至0.95μm的相形成，并且其部分与 Sn层由平均厚度为0.05〜0.2μm的相形成。