公开(公告)号：US20100000469A1

公开(公告)日：2010-01-07

申请号：US12494453

申请日：2009-06-30

申请人： Yasushi Yagi ,  Shingo Watanabe ,  Yuji Ono ,  Hiroshi Kaneko ,  Koyu Hasegawa ,  Mitsuaki Komino

发明人： Yasushi Yagi ,  Shingo Watanabe ,  Yuji Ono ,  Hiroshi Kaneko ,  Koyu Hasegawa ,  Mitsuaki Komino

IPC分类号： C23C16/54

CPC分类号： C23C14/26 ,  C23C14/243 ,  H01L51/001

摘要： Provided is a deposition apparatus for organic EL capable of allowing vapor of a film forming material to be vapor deposited on a target object to be uniformly heated. A deposition apparatus, which performs a film forming process by vapor depositing a film forming material on a target object in a depressurized processing chamber, includes an evaporating head having a vapor discharge opening, disposed in the processing chamber, for discharging vapor of the film forming material. Inside the evaporating head, provided is a heater receiving member which is sealed with respect to an inside of the processing chamber, and installed is a communication path which allows the heater receiving member to communicate with an outside of the processing chamber. A power supply line for a heater received in the heater receiving member is disposed in the communication path and extended to the outside of the processing chamber.

摘要翻译： 本发明提供一种能够使成膜材料的蒸气气相沉积在目标物体上以均匀加热的有机EL的沉积装置。 通过在减压处理室中对目标物体上的成膜材料进行气相沉积而进行成膜处理的沉积装置包括具有蒸气排出口的蒸发头，设置在处理室中，用于排出成膜用蒸气 材料。 在蒸发头内部设置有相对于处理室的内部密封的加热器接收构件，并且设置有允许加热器接收构件与处理室的外部连通的连通路径。 用于接收在加热器接收构件中的加热器的电源线设置在连通路径中并延伸到处理室的外部。

公开(公告)号：US20120001102A1

公开(公告)日：2012-01-05

申请号：US12864382

申请日：2009-01-21

申请人： Yasuhiro Chiba ,  Kohei Yamamoto ,  Hiroshi Takada ,  Kota Koizumi ,  Yasushi Yagi ,  Shingo Watanabe ,  Yuji Ono ,  Hiroshi Kaneko ,  Koyu Hasegawa

发明人： Yasuhiro Chiba ,  Kohei Yamamoto ,  Hiroshi Takada ,  Kota Koizumi ,  Yasushi Yagi ,  Shingo Watanabe ,  Yuji Ono ,  Hiroshi Kaneko ,  Koyu Hasegawa

IPC分类号： F16K31/122

CPC分类号： F16K41/10 ,  F16K31/126 ,  F16K31/1268

摘要： A highly clean and high temperature valve apparatus includes a valve driving unit and a valve casing connected to a bonnet supporting a valve stem slidably. A stem portion has one end positioned in a circumferential wall closed at its two ends by upper and lower covers, and supports one end of the valve stem with its other end extending through the lower cover. The stem portion has its ends supported respectively by first and second bellows for closing an axial through hole of the lower cover tightly. A first pipe communicates with a first space isolated by the first bellows, and a second pipe communicates with a second space isolated by the first bellows. The fluid quantities in the first and second spaces are increased or decreased relative to each other, thereby to drive the stem portion supported in a floating state by the first and second bellows.

摘要翻译： 高度清洁和高温的阀门装置包括阀驱动单元和阀壳，其可滑动地连接到支撑阀杆的阀盖。 杆部分具有位于周向壁的一端，其两端通过上盖和下盖封闭，并且支撑阀杆的一端，其另一端延伸穿过下盖。 杆部分的端部分别由第一和第二波纹管支撑，用于紧密地封闭下盖的轴向通孔。 第一管与由第一波纹管隔离的第一空间连通，第二管与由第一波纹管隔离的第二空间连通。 第一和第二空间中的流体量相对于彼此增加或减小，从而驱动由第一和第二波纹管以浮动状态支撑的杆部。

公开(公告)号：US20100071623A1

公开(公告)日：2010-03-25

申请号：US12441934

申请日：2007-10-01

申请人： Shingo Watanabe ,  Yuji Ono ,  Koyu Hasegawa ,  Masahiro Ogawa ,  Kouichi Honda

发明人： Shingo Watanabe ,  Yuji Ono ,  Koyu Hasegawa ,  Masahiro Ogawa ,  Kouichi Honda

IPC分类号： C23C16/00

CPC分类号： C23C14/12 ,  C23C14/243

摘要： Disclosed is an evaporating apparatus for performing a film forming process on a target object to be processed by vapor deposition, wherein a processing chamber and a vapor generating chamber are disposed adjacent to each other, gas exhaust mechanisms for depressurizing an inside of the processing chamber and an inside of the vapor generating chamber are installed, a vapor discharge opening for discharging a vapor of the film forming material is disposed in the processing chamber, vapor generating units for vaporizing the film forming material and control valves for controlling a supply of the vapor of the film forming material are disposed in the vapor generating chamber, and flow paths, which are not exposed to an outside of the processing chamber and the vapor generating chamber, for supplying the vapor of the film forming material generated in the vapor generating units to the vapor discharge opening are installed.

摘要翻译： 本发明公开了一种用于对通过气相沉积处理的目标物体进行成膜处理的蒸发装置，其中处理室和蒸汽发生室彼此相邻设置，用于对处理室内部进行减压的排气机构， 蒸汽发生室内部安装有用于排出成膜材料的蒸汽的蒸汽排放口，用于蒸发成膜材料的蒸汽发生单元和用于控制成膜材料供应的控制阀 成膜材料设置在蒸汽发生室中，并且没有暴露于处理室和蒸气发生室的外部的流路用于将在蒸汽发生单元中产生的成膜材料的蒸汽供应到 安装蒸汽排放口。

公开(公告)号：US20120241023A1

公开(公告)日：2012-09-27

申请号：US13508448

申请日：2010-10-29

申请人： Nobukazu Ikeda ,  Michio Yamaji ,  Tsuyoshi Tanikawa ,  Hiroshi Kaneko ,  Yasushi Yagi ,  Yuji Ono ,  Tadahiro Ohmi ,  Yasuyuki Shirai

发明人： Nobukazu Ikeda ,  Michio Yamaji ,  Tsuyoshi Tanikawa ,  Hiroshi Kaneko ,  Yasushi Yagi ,  Yuji Ono ,  Tadahiro Ohmi ,  Yasuyuki Shirai

IPC分类号： F16K31/128 ,  F16K1/34

CPC分类号： F16K31/126 ,  F16K1/34 ,  F16K25/005 ,  Y10T137/776

摘要： A control valve device develops opening/closing accuracy of a valve assembly. The valve head 310a is configured to open and close a transfer path formed in the valve housing 305 by transmitting the power to the valve assembly 310 from the power transmission member according to a pressure ratio between working fluid supplied to the first space Us and the second space Ls, respectively. The valve head has a Vickers hardness larger than a Vickers hardness of a valve seat of the transfer path to be in contact with the valve head, and a hardness difference therebetween is set to be about 200 Hv to about 300 Hv.

摘要翻译： 控制阀装置产生阀组件的开/关精度。 阀头310a被构造成通过根据供应到第一空间Us的工作流体与第二空间的第二压力之间的压力比将从动力传递构件传递到阀组件310的动力来打开和关闭形成在阀壳体305中的传送路径 空间Ls。 阀头的维氏硬度大于与阀头接触的传送路径的阀座的维氏硬度，并且其间的硬度差设定为约200Hv至约300Hv。

公开(公告)号：US20120074339A1

公开(公告)日：2012-03-29

申请号：US13138670

申请日：2010-03-08

申请人： Nobukazu Ikeda ,  Michio Yamaji ,  Tsuyoshi Tanigawa ,  Hiroshi Kaneko ,  Yasushi Yagi ,  Yuji Ono ,  Tadahiro Ohmi ,  Yasuyuki Shirai

发明人： Nobukazu Ikeda ,  Michio Yamaji ,  Tsuyoshi Tanigawa ,  Hiroshi Kaneko ,  Yasushi Yagi ,  Yuji Ono ,  Tadahiro Ohmi ,  Yasuyuki Shirai

IPC分类号： F16K31/12

CPC分类号： F16K31/126 ,  F16K31/1268 ,  F16K41/10

摘要： [Problem] To provide a regulating valve device having a valve element opened or closed by a working fluid.[Solution to Problem] A valve element 310 has a structure in which a valve head 310a and a valve body 310b are coupled by a valve stem 310c. In the valve box 305, the valve element 310 and a power transmitting member 320a are slidably housed. A first bellows 320b is fixed to the power transmitting member 320a and the valve box 305 to form a first space Us at a position on a side of the power transmitting member 320a opposite the valve element. A second bellows 320c is fixed to the power transmitting member 320a and the valve box 305 to form a second space Ls at a position on a side of the power transmitting member 320a closer to the valve element. According to a ratio of air supplied to the first space Us from a first pipe 320d and air supplied to the second space Ls from a second pipe 320e, the power transmitting member 320a transmits power to the valve head 310a to open or close a transport channel 200a.

摘要翻译： [问题]提供一种具有由工作流体打开或关闭的阀元件的调节阀装置。 问题的解决方案阀元件310具有阀头310a和阀体310b通过阀杆310c联接的结构。 在阀箱305中，阀元件310和动力传递部件320a可滑动地容纳。 第一波纹管320b固定到动力传递部件320a和阀箱305，以在与阀元件相对的动力传递部件320a的一侧的位置处形成第一空间Us。 第二波纹管320c固定在动力传递部件320a和阀箱305上，在动力传递部件320a的靠近阀体的一侧的位置形成第二空间Ls。 根据从第一管320d向第一空间Us供给的空气的比例和从第二管320e供给到第二空间Ls的空气的比例，动力传递构件320a向阀头310a传递动力以打开或关闭运送通道 200a。

公开(公告)号：US20100126417A1

公开(公告)日：2010-05-27

申请号：US12593753

申请日：2008-03-25

申请人： Koyu Hasegawa ,  Yuji Ono

发明人： Koyu Hasegawa ,  Yuji Ono

IPC分类号： C23C16/52 ,  C23C16/00

CPC分类号： C23C16/4481 ,  H01L51/0008 ,  H01L51/56 ,  H05B33/10

摘要： A deposition apparatus includes a deposition source unit, a transport mechanism for transporting a vaporized film forming material and a blowing device for blowing off the transported film forming material. The deposition source unit includes a vapor deposition source assembly, a housing and a water cooling jacket. The vapor deposition source assembly includes a gas supply mechanism, a gas inlet and a first material evaporating chamber formed as one body. A heater of the housing heats a film forming material in the first material evaporating chamber and the carrier gas flowing in a plurality of gas passages. The vaporized film forming material is transported by an argon gas. The water cooling jacket is installed apart from an outer peripheral surface of the housing at a certain distance and cools the deposition source unit.

摘要翻译： 沉积装置包括沉积源单元，用于输送蒸发的成膜材料的输送机构和用于吹出传送的成膜材料的吹塑装置。 沉积源单元包括气相沉积源组件，壳体和水冷套。 气相沉积源组件包括气体供应机构，气体入口和形成为一体的第一材料蒸发室。 外壳的加热器加热第一材料蒸发室中的成膜材料和在多个气体通道中流动的载气。 蒸发的成膜材料通过氩气输送。 水冷却套筒以一定距离与壳体的外周表面分开安装，并冷却沉积源单元。

公开(公告)号：US20110240223A1

公开(公告)日：2011-10-06

申请号：US13129167

申请日：2009-11-11

申请人： Shinji Matsubayashi ,  Satoru Kawakami ,  Yasuhiro Tobe ,  Masaru Nishimura ,  Yasushi Yagi ,  Teruyuki Hayashi ,  Yuji Ono ,  Fumio Shimo

发明人： Shinji Matsubayashi ,  Satoru Kawakami ,  Yasuhiro Tobe ,  Masaru Nishimura ,  Yasushi Yagi ,  Teruyuki Hayashi ,  Yuji Ono ,  Fumio Shimo

IPC分类号： B08B13/00 ,  B05C13/00

CPC分类号： H01L51/56 ,  H01L21/67173 ,  H01L21/6723

摘要： There is provided a substrate processing system having high maintainability by widening a gap between various processing apparatuses connected with side surfaces of transfer modules and capable of achieving sufficient productivity by avoiding deterioration in throughput. The substrate processing system for manufacturing an organic EL device by forming a multiple number of layers including, e.g., an organic layer on a substrate includes at least one transfer module configured to be evacuable and arranged along a straight transfer route. Within the transfer module, a multiple number of loading/unloading areas for loading/unloading the substrate with respect to a processing apparatus and at least one stocking area positioned between the loading/unloading areas are alternately arranged along the transfer route in series, and the processing apparatus is connected with a side surface of the transfer module at a position facing each of the loading/unloading areas.

摘要翻译： 提供了一种具有高可维护性的基板处理系统，通过扩大与传送模块的侧表面连接的各种处理设备之间的间隙，并且能够通过避免吞吐量的恶化来实现足够的生产率。 用于通过在衬底上形成包括例如有机层的多个层来制造有机EL器件的衬底处理系统包括至少一个被配置为可沿着直线传送路线排空和布置的传送模块。 在传送模块内，沿着传送路径交替布置多个用于相对于处理装置加载/卸载基板的装载/卸载区域和位于装载/卸载区域之间的至少一个放料区域， 处理设备在面向每个装载/卸载区域的位置处与传送模块的侧表面连接。

公开(公告)号：US10173902B2

公开(公告)日：2019-01-08

申请号：US13502850

申请日：2010-10-20

申请人： Jiro Iriguchi ,  Yasuhiro Yamamoto ,  Shuji Shimizu ,  Yuji Ono

发明人： Jiro Iriguchi ,  Yasuhiro Yamamoto ,  Shuji Shimizu ,  Yuji Ono

IPC分类号： C01B33/145 ,  H01L21/56 ,  C08G59/42 ,  C08K3/36

摘要： Provided are amorphous silica particles for application to industrial fields where there are increasing desires for high purity and colorlessness. The amorphous silica particles are produced through the steps of hydrolysis of an alkoxide, vacuum drying, and firing. The amorphous silica particles have been reduced in coloration and in Fe content, which is causative of coloration of the silica, and can meet the desires. The amorphous silica is characterized by having an Fe content of 20 ppm or less.

公开(公告)号：US20120202923A1

公开(公告)日：2012-08-09

申请号：US13502850

申请日：2010-10-20

申请人： Jiro Iriguchi ,  Yasuhiro Yamamoto ,  Shuji Shimizu ,  Yuji Ono

发明人： Jiro Iriguchi ,  Yasuhiro Yamamoto ,  Shuji Shimizu ,  Yuji Ono

IPC分类号： C08L63/00 ,  B29C39/18

CPC分类号： C01B33/145 ,  C08G59/42 ,  C08K3/36 ,  C08K2201/003 ,  H01L21/563

摘要： Provided are amorphous silica particles for application to industrial fields where there are increasing desires for high purity and colorlessness. The amorphous silica particles are produced through the steps of hydrolysis of an alkoxide, vacuum drying, and firing. The amorphous silica particles have been reduced in coloration and in Fe content, which is causative of coloration of the silica, and can meet the desires. The amorphous silica is characterized by having an Fe content of 20 ppm or less.

摘要翻译： 提供了用于工业领域的无定形二氧化硅颗粒，其中对于高纯度和无色性的需求日益增加。 无定形二氧化硅颗粒通过醇盐水解，真空干燥和烧制的步骤制备。 无定形二氧化硅颗粒的着色和Fe含量已经降低，这是二氧化硅着色的原因，并且可以满足欲望。 无定形二氧化硅的特征在于Fe含量为20ppm以下。

公开(公告)号：US20120031339A1

公开(公告)日：2012-02-09

申请号：US13262335

申请日：2010-04-02

申请人： Yuji Ono ,  Tomohiko Edura ,  Teruyuki Hayashi ,  Akitake Tamura ,  Misako Saito

发明人： Yuji Ono ,  Tomohiko Edura ,  Teruyuki Hayashi ,  Akitake Tamura ,  Misako Saito

IPC分类号： C23C16/455

CPC分类号： C23C14/12 ,  C23C14/24 ,  H01L51/001 ,  H01L51/50

摘要： There is provided a deposition head capable of discharging a material gas having a uniform flow rate and equi-thermal property from each component in a large-sized substrate as well as a conventional small-sized one for forming a uniform thin film. A deposition apparatus including the deposition head is also provided. The deposition head is provided within a deposition apparatus for forming a thin film on a substrate and configured to discharge a material gas toward the substrate. The deposition head includes an outer casing, and an inner casing provided within the outer casing and into which the material gas is introduced. In the inner casing, an opening configured to discharge the material gas toward the substrate is formed, and a heater configured to heat the material gas is provided at an outer surface of the outer casing or in a space between the outer casing and the inner casing.

摘要翻译： 提供一种沉积头，其能够在大尺寸基板中排出具有均匀流速和等热特性的材料气体，以及用于形成均匀薄膜的常规小尺寸基板。 还提供了包括沉积头的沉积设备。 沉积头设置在用于在衬底上形成薄膜并用于将材料气体朝向衬底排出的沉积设备中。 沉积头包括外壳和设置在外壳内并且材料气体被引入的内壳。 在内壳体中，形成有将材料气体朝向基板排出的开口，在外壳的外表面或外壳与内壳之间的空间内设置加热材料气体的加热器 。