摘要:
A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion.
摘要:
There is disclosed herein a leadless electronic component (LEC) which avoids solder joint crack initiation. A preferred embodiment of the LEC 110 comprises a body portion 112 having terminations 114 arranged thereabout, each termination having a bottom portion 124 with an interior edge 126, wherein the interior edge has a substantially meniscus-like shape oriented so as to be concave with respect to a centroid of the LEC.
摘要:
The invention provides molds useful in the production of contact lenses having seamless edges and in which molds movement of one mold half in relation to the other mold half is decreased. These results are attained by providing mold halves with shoulder stops and seam-matching features.
摘要:
A flatwire assembly includes a pair of elongate flatwire segments that are interconnected with a thin, flexible patch that overlies the opposed longitudinal ends of the segments. Conductive traces on the bottom face of the patch are electrically connected to the respective conductive traces of the segments by solder layers that, upon reflow under heat and pressure, respectively extend past an edge of the patch, whereupon visual confirmation of the solder joints between the traces of the patch and the segment is readily obtained. A layer of a thermally-activated or pressure-sensitive adhesive is disposed between the patch and each segment to further mechanically couple the patch to each segment during solder reflow. Longitudinal extensions of the patch substrate are bonded by the adhesive layer to respective portions of the segments farther removed from the segment ends than the solder layer extensions provide enhanced strain relief.
摘要:
Each of said elongated objects comprises a body and a flange. The tray includes a plate with openings and bearing surfaces.According to the invention: the tray includes at least one first bearing surface near a first opening, located at a first distance from the plate of the tray, and at least one second bearing surface near a second opening adjacent said first opening located at a second distance from the plate of the tray, said second distance being different from said first distance; said first and second openings are located at a distance one with respect to the other such that the flange of the object engaged in one of these openings is able to partially overlap the flange of the object engaged in the other of these openings without contact with this flange.
摘要:
A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.
摘要:
A tray for positioning elongated objects each having a body and a flange. The tray includes a plate with openings and bearing surfaces. At least one first bearing surface is near a first opening and located at a first distance from the plate of the tray, and at least one second bearing surface is near a second opening adjacent the first opening and located at a second distance from the plate of the tray. The second distance is different from the first distance. The first and second openings are located at a distance with respect to one another such that the flange of a first elongated object engaged in one of these openings is able to partially overlap the flange of a second elongated object engaged in the other of these openings without contact between the flange of the first elongated object and the flange of the second elongated object.
摘要:
The invention provides molds useful in the production of contact lenses having seamless edges and in which molds movement of one mold half in relation to the other mold half is decreased. These results are attained by providing mold halves with shoulder stops and seam-matching features.