公开(公告)号：US5931371A

公开(公告)日：1999-08-03

申请号：US784333

申请日：1997-01-16

申请人： Yi-Hsin Pao ,  Chan-Jiun Jih ,  Jun Ming Hu ,  Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II ,  Xu Song

发明人： Yi-Hsin Pao ,  Chan-Jiun Jih ,  Jun Ming Hu ,  Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II ,  Xu Song

IPC分类号： B23K35/02 ,  H01L21/60 ,  H05K3/30 ,  H05K3/34 ,  B23K31/02 ,  B23K35/14 ,  B23K35/24

CPC分类号： H01L24/81 ,  B23K35/0244 ,  H05K3/3421 ,  H05K3/3442 ,  H01L2224/13111 ,  H01L2224/17517 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K3/305 ,  Y02P70/611 ,  Y02P70/613

摘要： A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion.

摘要翻译： 用于将部件接合到基板的方法将基底焊接部分施加到基板，并在基底焊接部分中提供支撑焊接部分。 隔离焊料部分具有比基底焊料部分更高的熔化温度和基本上对应于部件和基板之间期望的间隔高度的高度。 该部件位于支座焊接部分上，并且基底焊料部分在回流条件下熔化以在部件和基板之间形成焊接接头。 该接头基本上封装了支座焊接部分，其中回流条件在基底焊料部分和支座焊接部分之间产生树枝状结构。

公开(公告)号：US5936846A

公开(公告)日：1999-08-10

申请号：US786389

申请日：1997-01-16

申请人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II ,  Yi-Hsin Pao

发明人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan, II ,  Yi-Hsin Pao

IPC分类号： H05K1/18 ,  H05K3/34 ,  H05K1/14 ,  H05K1/16

CPC分类号： H05K3/3442 ,  H05K2201/09427 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/611 ,  Y02P70/613

摘要： There is disclosed herein a surface mount printed circuit board having a substrate, at least one surface mount device, at least two mounting pads per device, solder joints connecting the terminations of the device to their respective mounting pads, at least one rectangular lifter pad on the substrate amid the mounting pads, and a solder mass on each lifter pad in contact with the bottom surface of the device. The inner and outer extensions of the mounting pads, the size, number, and shape of the lifter pads, and the amounts of solder deposited on the mounting and lifter pads are designed such that the solder joint has preferably convex outer fillets, the device is maintained at a predetermined height above the mounting pads, the inner fillet angle is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased. An alternate embodiment also includes plugged vias under the lifter pads and/or mounting pads, with gas pockets trapped between the solder masses/solder joints and the plugged vias. This trapped gas pocket provides additional buoyant force upon the SMD during reflow.

摘要翻译： 这里公开了一种表面贴装印刷电路板，其具有衬底，至少一个表面贴装器件，每个器件至少两个安装焊盘，将器件的端子连接到其相应的安装焊盘的焊点，至少一个矩形升降器垫 在安装焊盘之间的衬底，以及每个升降器衬垫上与接触器件的底表面的焊料质量。 安装垫的内部和外部延伸部分，升降器垫的尺寸，数量和形状以及沉积在安装和升降器垫上的焊料的量被设计成使得焊接接头具有优选的凸形外圆角，该装置是 保持在安装焊盘上方的预定高度处，内圆角保持在预定的最小角度以上以增加焊点裂纹的起始时间，并且总的焊点裂纹扩展长度增加。 替代实施例还包括在升降器垫和/或安装垫之下的插入通孔，其中气囊被捕获在焊料块/焊接接头和堵塞的通孔之间。 这种被捕获的气体袋在回流焊时在SMD上提供额外的浮力。

公开(公告)号：US5813884A

公开(公告)日：1998-09-29

申请号：US835366

申请日：1997-04-07

申请人： Yi-Hsin Pao ,  Dangrong Ronald Liu ,  Chan-Jiun Ed Jih ,  Xu Song

发明人： Yi-Hsin Pao ,  Dangrong Ronald Liu ,  Chan-Jiun Ed Jih ,  Xu Song

IPC分类号： H01C1/14 ,  H01C17/00 ,  H05K3/34 ,  H01R4/02

CPC分类号： H01C17/006 ,  H01C1/14 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： There is disclosed herein a leadless electronic component (LEC) which avoids solder joint crack initiation. A preferred embodiment of the LEC 110 comprises a body portion 112 having terminations 114 arranged thereabout, each termination having a bottom portion 124 with an interior edge 126, wherein the interior edge has a substantially meniscus-like shape oriented so as to be concave with respect to a centroid of the LEC.

摘要翻译： 这里公开了一种避免焊点裂纹开始的无引线电子部件（LEC）。 LEC 110的优选实施例包括具有布置在其周围的终端114的主体部分112，每个终端具有带有内部边缘126的底部124，其中内部边缘具有基本上弯月面状的形状，以相对于 到LEC的质心。

公开(公告)号：US5386343A

公开(公告)日：1995-01-31

申请号：US150319

申请日：1993-11-12

申请人： Yi-Hsin Pao

发明人： Yi-Hsin Pao

IPC分类号： H05K1/18

CPC分类号： H05K1/181 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10689 ,  Y02P70/611

摘要： A novel printed circuit board is disclosed. The printed circuit board has a high density of circuit components with lower circuit components residing within recesses in a printed wiring board and upper circuit components residing above the lower circuit components.

摘要翻译： 公开了一种新颖的印刷电路板。 印刷电路板具有高密度的电路元件，其中较低电路元件驻留在印刷线路板的凹槽内，并且位于低电路元件上方的上部电路元件。

公开(公告)号：US5736786A

公开(公告)日：1998-04-07

申请号：US625826

申请日：1996-04-01

申请人： Venkateswara A. Sankaran ,  Xingyi Xu ,  Yi-Hsin Pao ,  Wen-Je Jung

发明人： Venkateswara A. Sankaran ,  Xingyi Xu ,  Yi-Hsin Pao ,  Wen-Je Jung

IPC分类号： H01L23/373 ,  H01L23/492 ,  H01L25/07 ,  H01L23/34 ,  H01L23/48

CPC分类号： H01L24/49 ,  H01L23/3735 ,  H01L23/492 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15787

摘要： A power module has a metallic base plate layer and a substrate layer that has a first metallic layer, a dielectric layer, and a second metallic layer. A solder layer thermally and electrically connects the second metallic layer to the base plate. A plurality of silicon dice are mounted to the first metallic layer of the substrate. The solder layer has a void development region which after a predetermined number of thermal cycles does not significantly increase. The silicon dice are oriented on the substrate layer so that the silicon dice are not aligned over the void development region corresponding to the useful life of the module. The metallic base plate may also be mounted to a heatsink through a thermal grease layer. The heatsink may comprise the outer covering of the power module.

摘要翻译： 功率模块具有金属基板层和具有第一金属层，电介质层和第二金属层的基板层。 焊接层将第二金属层热电连接到基板。 多个硅片被安装到基板的第一金属层上。 焊料层具有在预定数量的热循环之后不显着增加的空隙显影区域。 硅片在衬底层上取向，使得硅片不对准与模块的使用寿命相对应的空隙显影区域。 金属底板也可以通过导热油脂层安装到散热器上。 散热器可以包括电源模块的外壳。