摘要:
A method for removing particulate residues from semiconductor substrates. A semiconductor substrate is provided which has upon its surface a particulate residue. At minimum, either the semiconductor substrate or the particulate residue is susceptible to oxidation upon exposure to an oxygen containing plasma. The semiconductor substrate and the particulate residue are exposed to an oxygen plasma. The particulates are then rinsed from the surface of the semiconductor substrate with deionized water.
摘要:
The guard ring is a barrier which prevents contaminates from diffusing through a window opening through insulating layers to adjacent semiconductor devices. The guard ring is formed surrounding a window in the insulation layers over a fuse link or an alignment mark. The guard ring is an annular metal ring that penetrates two or more insulating layers and contacts the substrate.
摘要:
A chemical-mechanical polishing process is described that provides high etch rates while at the same time minimizing the consumption of abrasives. This is achieved by embedding and dispersing the abrasive within the body of the material that is to be subjected to chemical-mechanical polishing.
摘要:
A photomask arrangement is disclosed to prevent the reticle patterns of a photomask from peeling caused by electrostatic discharge damage. The photomask includes: a substrate; a plurality of metal shielding layers formed on the surface of the substrate to provide the reticle patterns, wherein each two of the metal shielding layers are spaced apart by a clear scribe line; and a plurality of metal lines formed on the clear scribe line to connect the adjacent metal shielding layers, thereby increasing the effective surface area of the reticle patterns.
摘要:
A tungsten stud, stacked via process, has been developed, featuring smooth planar topographies at all metal levels. The desirable topography is obtained by allowing the tungsten stud to reside at the same level, or slightly above the level, of the top surface of the via hole insulator. This is achieved via an insulator etch back procedure, performed after metal stud formation.
摘要:
A method and apparatus for monitoring condition of the plasma of a plasma process during processing is disclosed. A spectrum detector (12) detects the intensity of a predetermined wavelength of radiation produced by the plasma process. The output of the spectrum detector is sampled, filtered, and normalized. A parameter calculator (20) calculates a parameter such as velocity or acceleration of the intensity. The calculated parameter is compared to a predetermined threshold. If the parameter exceeds the predetermined threshold, an error condition is indicated.
摘要:
A structure of a mask for use in a lithography process in a semiconductor fabrication procedure is disclosed. The structure comprising: a mask base being made of transparent material; a plurality of patterns formed on said mask base, said patterns being used for generating an image on a wafer and being made of a conductive opaque material; and a conductive layer formed on said mask base and said plurality of patterns.
摘要:
An improved method for selecting etch endpoint when dry etching conductive material layers for use in semiconductor device circuits has been created. The more precise endpoint selection procedure produces metallization patterns which are free from residues (resulting from under-etching) and free from sidewall attack and/or pattern degradation (resulting from over-etching). The method avoids costly and time consuming pre-sorting of substrates according to product pattern density.
摘要:
An accelerated thermal stress cycle test which can be conducted in a significantly reduced test time compared to the conventional test is provided. The test is carried out in a cluster of reaction chambers that includes a CVD chamber and a cool-down chamber such that a pre-processed wafer can be heated from room temperature to at least 350° C. in an inert gas in about 2 min., and then cooled down to not higher than 70° C. in a cool-down chamber in less than 30 sec. The heating and cooling steps can be repeated between 3 and 7 times to reveal any defect formation caused by the thermal stress cycle test. Typical defects are metal film peeling from insulating dielectric material layer or void formation.
摘要:
The present invention discloses a method for preventing electrostatic discharge damages to an article that is made of an insulating material and stored in a container also made of an insulating material by maintaining a minimum safe distance between the article and the top lid of the container such that a saturation electric field cannot be reached at such safety distance and thus electrostatic discharge does not occur. The present invention novel method can be utilized in carrying any insulating articles but is particularly suitable for carrying a quartz reticle in a polycarbonate pod.