公开(公告)号：US08723310B2

公开(公告)日：2014-05-13

申请号：US13526877

申请日：2012-06-19

申请人： YiSu Park ,  KyungHoon Lee ,  Joungln Yang ,  SangMi Park ,  DaeSik Choi

发明人： YiSu Park ,  KyungHoon Lee ,  Joungln Yang ,  SangMi Park ,  DaeSik Choi

IPC分类号： H01L23/10

CPC分类号： H01L23/3135 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A method of manufacture of an integrated circuit packaging system includes providing a substrate; connecting an integrated circuit die; forming a molding having a temperature-dependent characteristic directly on the top surface of the substrate; and forming a coupling encapsulation having a coupled characteristic different from the temperature-dependent characteristic directly on the molding forms an encapsulation boundary between the coupling encapsulation and the molding.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 连接集成电路管芯; 在衬底的顶表面上直接形成具有温度依赖特性的模制品; 并且形成具有与温度相关特性不同的耦合特性的耦合封装，直接在模塑件上形成耦合封装和模制件之间的封装边界。

公开(公告)号：US08334601B2

公开(公告)日：2012-12-18

申请号：US13169387

申请日：2011-06-27

申请人： DongSam Park ,  Joungln Yang

发明人： DongSam Park ,  Joungln Yang

IPC分类号： H01L23/28 ,  H01L21/44

CPC分类号： H01L23/5226 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/28 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of a package-on-package system includes: providing a package substrate; attaching a semiconductor die to the package substrate; forming an encapsulant around the semiconductor die to have a bottom exposed surface coplanar with a bottom surface of the package substrate and to have a top exposed surface with through openings extending therefrom through the bottom exposed surface; and creating through vias by applying solder into the through openings, the through vias coplanar with the bottom exposed surface of the encapsulant and coplanar with the top exposed surface of the encapsulant.

摘要翻译： 包装封装系统的制造方法包括：提供封装衬底; 将半导体管芯附接到所述封装衬底; 在所述半导体管芯周围形成密封剂以具有与所述封装衬底的底表面共面的底部暴露表面，并且具有顶部暴露表面，所述顶部暴露表面具有从其穿过所述底部暴露表面延伸的通孔; 并且通过将焊料施加到通孔中来形成通孔，所述通孔与所述密封剂的底部暴露表面共面并且与所述密封剂的顶部暴露表面共面。

公开(公告)号：US07863100B2

公开(公告)日：2011-01-04

申请号：US12408662

申请日：2009-03-20

申请人： Joungln Yang ,  Dongjin Jung ,  DongSam Park

发明人： Joungln Yang ,  Dongjin Jung ,  DongSam Park

IPC分类号： H01L21/00 ,  H01L23/02 ,  H01R12/16

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1011 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a base package having a base interposer; forming an intermediate package having an intermediate interposer and an intermediate package embedded link trace, the intermediate package embedded link trace being encapsulated in an intermediate package mold compound; forming a cap package having a cap interposer; and connecting the intermediate package to the cap package and the base package using the intermediate package embedded link trace.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有基底插入件的基底封装; 形成具有中间插入件和中间封装嵌入链节迹线的中间封装，所述中间封装嵌入链节迹线封装在中间封装模具化合物中; 形成具有盖插入件的盖封装; 以及使用所述中间封装的嵌入式链路迹线将所述中间封装连接到所述封装封装和所述基底封装。