公开(公告)号：US08723310B2

公开(公告)日：2014-05-13

申请号：US13526877

申请日：2012-06-19

申请人： YiSu Park ,  KyungHoon Lee ,  Joungln Yang ,  SangMi Park ,  DaeSik Choi

发明人： YiSu Park ,  KyungHoon Lee ,  Joungln Yang ,  SangMi Park ,  DaeSik Choi

IPC分类号： H01L23/10

CPC分类号： H01L23/3135 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A method of manufacture of an integrated circuit packaging system includes providing a substrate; connecting an integrated circuit die; forming a molding having a temperature-dependent characteristic directly on the top surface of the substrate; and forming a coupling encapsulation having a coupled characteristic different from the temperature-dependent characteristic directly on the molding forms an encapsulation boundary between the coupling encapsulation and the molding.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 连接集成电路管芯; 在衬底的顶表面上直接形成具有温度依赖特性的模制品; 并且形成具有与温度相关特性不同的耦合特性的耦合封装，直接在模塑件上形成耦合封装和模制件之间的封装边界。

公开(公告)号：US20130334714A1

公开(公告)日：2013-12-19

申请号：US13526877

申请日：2012-06-19

申请人： YiSu Park ,  KyungHoon Lee ,  JoungIn Yang ,  SangMi Park ,  DaeSik Choi

发明人： YiSu Park ,  KyungHoon Lee ,  JoungIn Yang ,  SangMi Park ,  DaeSik Choi

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3135 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A method of manufacture of an integrated circuit packaging system includes providing a substrate; connecting an integrated circuit die; forming a molding having a temperature-dependent characteristic directly on the top surface of the substrate; and forming a coupling encapsulation having a coupled characteristic different from the temperature-dependent characteristic directly on the molding forms an encapsulation boundary between the coupling encapsulation and the molding.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 连接集成电路管芯; 在衬底的顶表面上直接形成具有温度依赖特性的模制品; 并且形成具有与温度相关特性不同的耦合特性的耦合封装，直接在模塑件上形成耦合封装和模制件之间的封装边界。

公开(公告)号：US20130328220A1

公开(公告)日：2013-12-12

申请号：US13494721

申请日：2012-06-12

申请人： KyungHoon Lee ,  JoungIn Yang ,  SangMi Park ,  YiSu Park ,  DaeSik Choi

发明人： KyungHoon Lee ,  JoungIn Yang ,  SangMi Park ,  YiSu Park ,  DaeSik Choi

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L21/6836 ,  H01L23/49827 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/18161 ,  H01L2924/014

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming an integrated circuit device having a shaped side; mounting the integrated circuit device on the substrate; forming an encapsulation on the substrate and the integrate circuit device with the shaped side partially exposed from the encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 形成具有成形侧的集成电路器件; 将集成电路器件安装在衬底上; 在衬底和集成电路器件上形成封装，其中成形侧部分地从封装暴露出来。

公开(公告)号：US20120068319A1

公开(公告)日：2012-03-22

申请号：US12884134

申请日：2010-09-16

申请人： DaeSik Choi ,  SangMi Park ,  Oh Han Kim

发明人： DaeSik Choi ,  SangMi Park ,  Oh Han Kim

IPC分类号： H01L23/528 ,  H01L21/98

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/11003 ,  H01L2224/1133 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48155 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83005 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a connection carrier having base device pads and base interconnect pads on a carrier top side of the connection carrier; connecting a base integrated circuit to the base device pads and mounted over the carrier top side; mounting base vertical interconnects directly on the base interconnect pads; attaching a base package substrate to the base integrated circuit and directly on the base vertical interconnects; forming a base encapsulation on the base package substrate, the base device pads, and the base interconnect pads; and removing a portion of the connection carrier with the base device pads and the base interconnect pads partially exposed opposite the base package substrate.

摘要翻译： 一种制造集成电路封装系统的方法，包括：在连接载体的载体顶侧上形成具有基底器件焊盘和基底互连焊盘的连接载体; 将基座集成电路连接到基座装置焊盘并安装在载体顶侧上; 将底座垂直互连直接安装在基底互连焊盘上; 将基底封装衬底附接到基底集成电路并直接在基底垂直互连上; 在基底封装衬底，基底器件焊盘和基底互连焊盘上形成基底封装; 以及使用与基底封装衬底相对部分地露出的基底器件焊盘和基底互连焊盘去除连接载体的一部分。

公开(公告)号：US20130154085A1

公开(公告)日：2013-06-20

申请号：US13325530

申请日：2011-12-14

申请人： DaeSik Choi ,  SangMi Park ,  MinJung Kim ,  MinWook Yu

发明人： DaeSik Choi ,  SangMi Park ,  MinJung Kim ,  MinWook Yu

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/36 ,  H01L21/50 ,  H01L23/10 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在基板上安装集成电路; 在基板上安装盖基座，盖基座具有基座凹口和孔内的集成电路; 并且将热块安装在盖底部上，热块具有部分在基底凹陷内的非水平侧段。

公开(公告)号：US08466567B2

公开(公告)日：2013-06-18

申请号：US12884134

申请日：2010-09-16

申请人： DaeSik Choi ,  SangMi Park ,  Oh Han Kim

发明人： DaeSik Choi ,  SangMi Park ,  Oh Han Kim

IPC分类号： H01L23/28

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/11003 ,  H01L2224/1133 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48155 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83005 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a connection carrier having base device pads and base interconnect pads on a carrier top side of the connection carrier; connecting a base integrated circuit to the base device pads and mounted over the carrier top side; mounting base vertical interconnects directly on the base interconnect pads; attaching a base package substrate to the base integrated circuit and directly on the base vertical interconnects; forming a base encapsulation on the base package substrate, the base device pads, and the base interconnect pads; and removing a portion of the connection carrier with the base device pads and the base interconnect pads partially exposed opposite the base package substrate.

摘要翻译： 一种制造集成电路封装系统的方法，包括：在连接载体的载体顶侧上形成具有基底器件焊盘和基底互连焊盘的连接载体; 将基座集成电路连接到基座装置焊盘并安装在载体顶侧上; 将底座垂直互连直接安装在基底互连焊盘上; 将基底封装衬底附接到基底集成电路并直接在基底垂直互连上; 在基底封装衬底，基底器件焊盘和基底互连焊盘上形成基底封装; 以及使用与基底封装衬底相对部分地露出的基底器件焊盘和基底互连焊盘去除连接载体的一部分。

公开(公告)号：US08679900B2

公开(公告)日：2014-03-25

申请号：US13325530

申请日：2011-12-14

申请人： DaeSik Choi ,  SangMi Park ,  MinJung Kim ,  MinWook Yu

发明人： DaeSik Choi ,  SangMi Park ,  MinJung Kim ,  MinWook Yu

IPC分类号： H01L21/00

CPC分类号： H01L23/36 ,  H01L21/50 ,  H01L23/10 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在基板上安装集成电路; 在基板上安装盖基座，盖基座具有基座凹口和孔内的集成电路; 并且将热块安装在盖底部上，热块具有部分在基底凹陷内的非水平侧段。

公开(公告)号：US08372695B2

公开(公告)日：2013-02-12

申请号：US12950631

申请日：2010-11-19

申请人： SangMi Park ,  MinJung Kim

发明人： SangMi Park ,  MinJung Kim

IPC分类号： H01L21/00 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate base side and a substrate stack side; mounting an integrated circuit over the substrate stack side; attaching a stack connector to the substrate stack side; forming an encapsulation over the stack connector and the integrated circuit; attaching an external connector to the substrate base side; attaching an adhesive tape to the external connector having spacing between the adhesive tape and the substrate base side; cutting a step portion in the encapsulation to expose the stack connector; cutting a singulation kerf in the package substrate having exit damage on the substrate base side; and removing the adhesive tape.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有基板基面侧和基板叠层侧的封装基板; 在衬底堆叠侧上安装集成电路; 将堆叠连接器附接到基板堆叠侧; 在堆叠连接器和集成电路上形成封装; 将外部连接器附接到基板基座侧; 将粘合带附接到具有在所述胶带和所述基板基部侧之间的间隔的所述外部连接器; 在封装中切割台阶部分以露出堆叠连接器; 在具有基板基面侧的出口损坏的封装基板上切割单切割切口; 并去除胶带。

公开(公告)号：US20120126428A1

公开(公告)日：2012-05-24

申请号：US12950631

申请日：2010-11-19

申请人： SangMi Park ,  MinJung Kim

发明人： SangMi Park ,  MinJung Kim

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a substrate base side and a substrate stack side; mounting an integrated circuit over the substrate stack side; attaching a stack connector to the substrate stack side; forming an encapsulation over the stack connector and the integrated circuit; attaching an external connector to the substrate base side; attaching an adhesive tape to the external connector having spacing between the adhesive tape and the substrate base side; cutting a step portion in the encapsulation to expose the stack connector; cutting a singulation kerf in the package substrate having exit damage on the substrate base side; and removing the adhesive tape.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有基板基面侧和基板叠层侧的封装基板; 在衬底堆叠侧上安装集成电路; 将堆叠连接器附接到基板堆叠侧; 在堆叠连接器和集成电路上形成封装; 将外部连接器附接到基板基座侧; 将粘合带附接到具有在所述胶带和所述基板基部侧之间的间隔的所述外部连接器; 在封装中切割台阶部分以露出堆叠连接器; 在具有基板基面侧的出口损坏的封装基板上切割单切割切口; 并去除胶带。

公开(公告)号：US08816404B2

公开(公告)日：2014-08-26

申请号：US13234902

申请日：2011-09-16

申请人： YoungJoon Kim ,  SangMi Park ,  YongHyuk Jeong

发明人： YoungJoon Kim ,  SangMi Park ,  YongHyuk Jeong

IPC分类号： H01L23/58

CPC分类号： H01L21/76877 ,  H01L21/561 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/80 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/03

摘要： A semiconductor device has a first conductive layer formed over a first substrate. A second conductive layer is formed over a second substrate. A first semiconductor die is mounted to the first substrate and electrically connected to the first conductive layer. A second semiconductor die is mounted to the second substrate and electrically connected to the second conductive layer. The first semiconductor die is mounted over the second semiconductor die. An encapsulant is deposited over the first and second semiconductor die and the first and second substrates. A conductive interconnect structure is formed through the encapsulant to electrically connect the first and second semiconductor die to the second surface of the semiconductor device. Forming the conductive interconnect structure includes forming a plurality of conductive vias through the encapsulant and the first substrate outside a footprint of the first and second semiconductor die.

摘要翻译： 半导体器件具有形成在第一衬底上的第一导电层。 在第二衬底上形成第二导电层。 第一半导体管芯安装到第一基板并电连接到第一导电层。 第二半导体管芯安装到第二衬底并电连接到第二导电层。 第一半导体管芯安装在第二半导体管芯上。 密封剂沉积在第一和第二半导体管芯以及第一和第二衬底上。 通过密封剂形成导电互连结构，以将第一和第二半导体管芯电连接到半导体器件的第二表面。 形成导电互连结构包括在第一和第二半导体管芯的覆盖区之外形成通过密封剂和第一衬底的多个导电通孔。