摘要:
A read process for a 3D stacked memory device provides an optimum level of channel boosting for unselected memory strings, to repress both normal and weak-erase types of read disturbs. The channel is boosted by controlling of voltages of bit lines (Vbl), drain-side select gates (Vsgd_unsel), source-side select gates (Vsgs_unsel), a selected level (word line layer) of the memory device (Vcg_sel), and unselected levels of the memory device (Vcg_unsel). A channel can be boosted by initially making the drain-side and source-side select gates non-conductive, to allow capacitive coupling from an increasing Vcg_unsel. The drain-side and/or source-side select gates are then made non-conductive by raising Vsgd_unsel and/or Vsgs_unsel, interrupting the boosting. Additionally boosting can occur by making the drain-side and/or source-side select gates conductive again while Vcg_unsel is still increasing. Or, the channel can be driven at Vbl. Two-step boosting drives the channel at Vbl, then provides boosting by capacitive coupling.
摘要:
Channel boosting is improved in non-volatile storage to reduce program disturb. A pre-charge module voltage source is used to pre-charge bit lines during a programming operation. The pre-charge module voltage source is coupled to a substrate channel via the bit lines to boost the channel. An additional source of boosting is provided by electromagnetically coupling a voltage from a conductive element to the bit lines and the channel. To achieve this, the bit lines and the channel are allowed to float together by disconnecting the bit lines from the voltage sources. The conductive element can be a source line, power supply line or substrate body, for instance, which receives an increasing voltage during the pre-charging and is proximate to the bit lines.
摘要:
Channel boosting is improved in non-volatile storage to reduce program disturb. A pre-charge module voltage source is used to pre-charge bit lines during a programming operation. The pre-charge module voltage source is coupled to a substrate channel via the bit lines to boost the channel. An additional source of boosting is provided by electromagnetically coupling a voltage from a conductive element to the bit lines and the channel. To achieve this, the bit lines and the channel are allowed to float together by disconnecting the bit lines from the voltage sources. The conductive element can be a source line, power supply line or substrate body, for instance, which receives an increasing voltage during the pre-charging and is proximate to the bit lines.
摘要:
In a 3D stacked non-volatile memory device, the threshold voltages are evaluated and adjusted for select gate, drain (SGD) transistors at drain ends of strings of series-connected memory cells. To optimize and tighten the threshold voltage distribution, the SGD transistors are read at lower and upper levels of an acceptable range. SGD transistors having a low threshold voltage are subject to programming, and SGD transistors having a high threshold voltage are subject to erasing, to bring the threshold voltage into the acceptable range. The evaluation and adjustment can be repeated such as after a specified number of program-erase cycles of an associated sub-block. The condition for repeating the evaluation and adjustment can be customized for different groups of SGD transistors. Aspects include programming SGD transistors with verify and inhibit, erasing SGD transistors with verify and inhibit, and both of the above.
摘要:
A method in which data is randomized before being stored in a non-volatile memory to minimize data pattern-related read failures. Predetermined randomized non-user data is stored in a block or other location of a memory array, and accessed as needed by a memory device controller to randomize user data before it is stored in other blocks of the array. Each portion of the user data which is stored in a block is randomized using a portion of the non-user data which is stored in the same relative location in another block.
摘要:
A non-volatile memory in which data is randomized before being stored in the non-volatile memory to minimize data pattern-related read failures. Randomizing is performed using circuitry on the memory die so that the memory die is portable relative to an external, off-chip controller. Circuitry on the memory die scrambles user data based on a key which is generated using a seed which is shifted according to a write address. Corresponding on-chip descrambling is also provided.
摘要:
An erase operation for a 3D stacked memory device applies an erase pulse which includes an intermediate level (Vgidl) and a peak level (Verase) to a set of memory cells, and steps up Vgidl in erase iterations of the erase operation. Vgidl can be stepped up when a specified portion of the cells have reached the erase verify level. In this case, a majority of the cells may have reached the erase verify level, such that the remaining cells can benefit from a higher gate-induced drain leakage (GIDL) current to reached the erase verify level. Verase can step up before and, optionally, after Vigdl is stepped up, but remain fixed while Vgidl is stepped. Vgidl can be stepped up until a maximum allowed level, Vgidl_max, is reached. Vgidl may be applied to a drain-side and/or source-side of a NAND string via a bit line or source line, respectively.
摘要:
In a non-volatile storage system, the time needed to perform a programming operation is reduced by minimizing data transfers between sense modules and a managing circuit. A sense module is associated with each storage element. Based on write data, a data node in the sense module is initialized to “0” for a storage element which is to remain in an erased state, and to “1” for a storage element which is to be programmed to a programmed state, then flipped to “0” when programmed is completed. The managing circuit is relieved of the need to access the write data to determine whether a “0” represents a storage element for which programming is completed. Power consumption can also be reduced by keeping a bit line voltage high between a verify phase of one program-verify iteration and a program phase of a next program-verify iteration.
摘要:
An erase operation for a 3D stacked memory device selectively inhibits subsets of memory cells which meet a verify condition as the erase operation progresses. As a result, the faster-erasing memory cells are less likely to be over-erased and degradation is reduced. Each subset of memory cells can be independently erased by controlling a select gate, drain (SGD) transistor line, a bit line or a word line, according to the type of subset. For a SGD line subset or a bit line subset, the SGD line or bit line, respectively, is set at a level which inhibits erase. For a word line subset, the word line voltage is floated to inhibit erase. An inhibit or uninhibit status can be maintained for each subset, and each type of subset can have a different maximum allowable number of fail bits.
摘要:
An erase operation for a 3D stacked memory device selectively inhibits subsets of memory cells which meet a verify condition as the erase operation progresses. As a result, the faster-erasing memory cells are less likely to be over-erased and degradation is reduced. Each subset of memory cells can be independently erased by controlling a select gate, drain (SGD) transistor line, a bit line or a word line, according to the type of subset. For a SGD line subset or a bit line subset, the SGD line or bit line, respectively, is set at a level which inhibits erase. For a word line subset, the word line voltage is floated to inhibit erase. An inhibit or uninhibit status can be maintained for each subset, and each type of subset can have a different maximum allowable number of fail bits.