Method for fabricating a semiconductor device
    1.
    发明授权
    Method for fabricating a semiconductor device 有权
    半导体器件的制造方法

    公开(公告)号:US08963205B2

    公开(公告)日:2015-02-24

    申请号:US12165164

    申请日:2008-06-30

    摘要: A transistor of a semiconductor device includes a substrate, a gate over the substrate, a source/drain region formed in the substrate to have a channel region therebetween, and an epitaxial layer formed below the channel region to have a different lattice constant from the substrate. The epitaxial layer having a different lattice constant with a substrate material is formed below the channel region to apply a stress to the channel region. Thus, the mobility of carriers of the transistor increases.

    摘要翻译: 半导体器件的晶体管包括衬底,衬底上的栅极,形成在衬底中以在其间具有沟道区的源极/漏极区和形成在沟道区下方的与衬底不同的晶格常数的外延层 。 在沟道区的下方形成具有与衬底材料不同的晶格常数的外延层,以对沟道区施加应力。 因此,晶体管的载流子的迁移率增加。

    Non-volatile memory device with conductive sidewall spacer and method for fabricating the same
    3.
    发明授权
    Non-volatile memory device with conductive sidewall spacer and method for fabricating the same 失效
    具有导电侧壁间隔物的非易失性存储器件及其制造方法

    公开(公告)号:US07667253B2

    公开(公告)日:2010-02-23

    申请号:US11790957

    申请日:2007-04-30

    IPC分类号: H01L27/108 H01L29/94

    摘要: The present invention relates to a non-volatile memory device having conductive sidewall spacers and a method for fabricating the same. The non-volatile memory device includes: a substrate; a gate insulation layer formed on the substrate; a gate structure formed on the gate insulation layer; a pair of sidewall spacers formed on sidewalls of the gate structure; a pair of conductive sidewall spacers for trapping/detrapping charges formed on the pair of sidewall spacers; a pair of lightly doped drain regions formed in the substrate disposed beneath the sidewalls of the gate structure; and a pair of source/drain regions formed in the substrate disposed beneath edge portions of the pair of conductive sidewall spacers.

    摘要翻译: 本发明涉及具有导电侧壁间隔物的非易失性存储器件及其制造方法。 非易失性存储器件包括:衬底; 形成在所述基板上的栅极绝缘层; 形成在栅极绝缘层上的栅极结构; 形成在所述栅极结构的侧壁上的一对侧壁间隔物; 一对导电侧壁间隔物,用于捕获/去除在一对侧壁间隔物上形成的电荷; 形成在所述衬底中的一对轻掺杂漏极区,所述衬底设置在所述栅极结构的侧壁下方; 以及形成在所述基板中的一对源极/漏极区域,所述基极设置在所述一对导电侧壁间隔物的边缘部分的下方。

    Non-volatile memory device with conductive sidewall spacer and method for fabricating the same
    7.
    发明申请
    Non-volatile memory device with conductive sidewall spacer and method for fabricating the same 失效
    具有导电侧壁间隔物的非易失性存储器件及其制造方法

    公开(公告)号:US20070200145A1

    公开(公告)日:2007-08-30

    申请号:US11790957

    申请日:2007-04-30

    IPC分类号: H01L31/00

    摘要: The present invention relates to a non-volatile memory device having conductive sidewall spacers and a method for fabricating the same. The non-volatile memory device includes: a substrate; a gate insulation layer formed on the substrate; a gate structure formed on the gate insulation layer; a pair of sidewall spacers formed on sidewalls of the gate structure; a pair of conductive sidewall spacers for trapping/detrapping charges formed on the pair of sidewall spacers; a pair of lightly doped drain regions formed in the substrate disposed beneath the sidewalls of the gate structure; and a pair of source/drain regions formed in the substrate disposed beneath edge portions of the pair of conductive sidewall spacers.

    摘要翻译: 本发明涉及具有导电侧壁间隔物的非易失性存储器件及其制造方法。 非易失性存储器件包括:衬底; 形成在所述基板上的栅极绝缘层; 形成在栅极绝缘层上的栅极结构; 形成在所述栅极结构的侧壁上的一对侧壁间隔物; 一对导电侧壁间隔物,用于捕获/去除在一对侧壁间隔物上形成的电荷; 形成在所述衬底中的一对轻掺杂漏极区,所述衬底设置在所述栅极结构的侧壁下方; 以及形成在所述基板中的一对源极/漏极区域,所述基极设置在所述一对导电侧壁间隔物的边缘部分的下方。

    Gate structure of semiconductor memory device
    8.
    发明申请
    Gate structure of semiconductor memory device 有权
    半导体存储器件的门结构

    公开(公告)号:US20060001115A1

    公开(公告)日:2006-01-05

    申请号:US11027663

    申请日:2004-12-30

    IPC分类号: H01L29/76 H01L29/82

    CPC分类号: H01L27/10873 H01L27/10888

    摘要: A gate structure of a semiconductor memory device capable of preventing a poly void generation by forming a hard mask and maintaining a hysteresis area within a certain value. The gate structure of the semiconductor memory device includes: a gate insulation layer formed on a semiconductor substrate; a gate electrode formed on the gate insulation layer, wherein the gate electrode is formed by stacking a polysilicon layer and a metal layer; and a hard mask formed on the gate electrode, wherein a hysteresis area between the hard mask and the gate electrode materials is a equal to or less than approximately 2×1012° C.-dyne/cm2.

    摘要翻译: 一种半导体存储器件的栅极结构,其能够通过形成硬掩模并将滞后区域保持在一定值内来防止多孔隙生成。 半导体存储器件的栅极结构包括:形成在半导体衬底上的栅绝缘层; 形成在所述栅绝缘层上的栅电极,其中所述栅电极通过堆叠多晶硅层和金属层而形成; 以及形成在所述栅极电极上的硬掩模,其中所述硬掩模和所述栅极电极材料之间的滞后区域等于或小于约2×10 12·达因/ cm 2, 2