-
1.发明授权Composition for producing printed circuit board and printed circuit board using the same 有权用于制造印刷电路板的组合物和使用其的印刷电路板公开(公告)号：US07943856B2
公开(公告)日：2011-05-17
申请号：US12328458
申请日：2008-12-04
申请人： Yoo Seong Yang , Myung Sup Jung , Chung Kun Cho , Sang Hyuk Suh , Bon Hyeok Gu
发明人： Yoo Seong Yang , Myung Sup Jung , Chung Kun Cho , Sang Hyuk Suh , Bon Hyeok Gu
CPC分类号： C09K19/3809 , C08G73/101 , C08L67/00 , C08L69/00 , C08L79/08 , C08L2205/02 , C09K19/38 , C09K19/3838 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/0141 , H05K2201/0154 , H05K2201/0209 , Y10S428/901 , Y10T428/24802 , Y10T428/31681 , C08L2666/20 , C08L2666/18
摘要： A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.
摘要翻译： 提供了一种用于制造印刷电路板的组合物。 该组合物包括在其一端或两端引入一个或两个可交联官能团的聚酰胺酸，液晶聚合物（LCP）或液晶热固性（LCT）低聚物和有机溶剂。 因此，该组合物可以用作下一代板的材料，其重量逐渐变轻，厚度和尺寸更小。 还提供了使用该组合物制造的印刷电路板。
-
2.发明申请公开(公告)号：US20090117348A1
公开(公告)日：2009-05-07
申请号：US12263598
申请日：2008-11-03
申请人： Chung Kun Cho , Myung Sup Jung , Yoo Seong Yang , Sang Hyuk Suh , Bon Hyeok Gu
发明人： Chung Kun Cho , Myung Sup Jung , Yoo Seong Yang , Sang Hyuk Suh , Bon Hyeok Gu
IPC分类号： B32B3/02 , C08L77/06 , C08L81/08 , C08K5/20 , C08K5/3415 , C08K5/3412 , C08K5/41 , C08K5/1535 , B32B15/08 , C08K5/10 , C08L67/00 , C08G69/02 , C08G73/02 , C08G73/10 , C08G18/71
CPC分类号： H05K1/0346 , B32B5/022 , B32B5/024 , B32B15/14 , B32B15/20 , B32B17/02 , B32B2260/021 , B32B2260/046 , B32B2262/02 , B32B2262/062 , B32B2262/101 , B32B2262/106 , B32B2307/20 , B32B2307/306 , B32B2307/50 , B32B2307/73 , B32B2307/734 , B32B2457/08 , B32B2553/00 , C08G69/32 , C08G69/44 , C08L77/10 , C08L77/12 , Y10T428/24802 , Y10T428/31681
摘要： Compositions for producing a board and a printed circuit board produced using the composition are provided. The compositions can be used for the production of a variety of printed circuit boards.
摘要翻译： 提供了使用该组合物制造板和印刷电路板的组合物。 该组合物可用于生产各种印刷电路板。
-
3.发明授权Polyamide combination film prepared by using same, and display device including the film 有权使用其制备的聚酰胺组合膜，以及包括该膜的显示装置公开(公告)号：US08936849B2
公开(公告)日：2015-01-20
申请号：US13244280
申请日：2011-09-24
申请人： Chung Kun Cho , Kalinina Fedosya , Kovalev Mikhail , Tai Gyoo Park , Young Suk Jung , Yoo Seong Yang
发明人： Chung Kun Cho , Kalinina Fedosya , Kovalev Mikhail , Tai Gyoo Park , Young Suk Jung , Yoo Seong Yang
摘要： Provided are a polyamide combination that includes: a first polyamide including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second polyamide including a repeating unit represented by Chemical Formula 3, and a film prepared using the polyamide combination.
摘要翻译： 提供一种聚酰胺组合，其包括：包含由化学式1表示的重复单元的第一聚酰胺，由化学式2表示的重复单元或其组合; 和包含由化学式3表示的重复单元的第二聚酰胺和使用该聚酰胺组合制备的膜。
-
4.发明授权Polyimide precursor composition, method for preparing polyimide, polyimide prepared by using the method, and film including the polyimide 有权聚酰亚胺前体组合物，制备聚酰亚胺的方法，使用该方法制备的聚酰亚胺和包含聚酰亚胺的薄膜公开(公告)号：US08623968B2
公开(公告)日：2014-01-07
申请号：US13226736
申请日：2011-09-07
申请人： Eun Seog Cho , Byung Hee Sohn , Young Suk Jung , Yoo Seong Yang , Sang Mo Kim
发明人： Eun Seog Cho , Byung Hee Sohn , Young Suk Jung , Yoo Seong Yang , Sang Mo Kim
IPC分类号： C08F283/04 , C08G69/48 , C08G69/08 , C08G18/00
CPC分类号： C08G73/1035 , C08G18/346 , C08L79/08 , Y10T428/31721
摘要： A polyimide precursor composition includes a polyamic acid including a repeating unit represented by Chemical Formula 1 and diisocyanate represented by Chemical Formula 2. OCN-A2-NCO Chemical Formula 2 The diisocyanate represented by Chemical Formula 2 is included in an amount of about 0.01 moles to about 10 moles based on 100 moles of the repeating unit represented by Chemical Formula 1 in the polyamic acid.
摘要翻译： 聚酰亚胺前体组合物包括含有由化学式1表示的重复单元的聚酰胺酸和由化学式2表示的二异氰酸酯。OCN-A2-NCOC化学式2由化学式2表示的二异氰酸酯的含量为约0.01摩尔至约 10摩尔，基于100摩尔在聚酰胺酸中由化学式1表示的重复单元。
-
公开(公告)号：US08586689B2
公开(公告)日：2013-11-19
申请号：US13198102
申请日：2011-08-04
申请人： Young Suk Jung , Yoo Seong Yang , Tai Gyoo Park , Sang Mo Kim , Eun Seog Cho
发明人： Young Suk Jung , Yoo Seong Yang , Tai Gyoo Park , Sang Mo Kim , Eun Seog Cho
IPC分类号： C08G77/26
CPC分类号： C08G64/186 , C08G73/106 , C08G77/54 , C08J5/18 , C08J2359/00 , C08J2369/00 , C08J2375/04 , C08J2377/00 , C08J2379/08
摘要： A polymer including a structural unit represented by the following Chemical Formula 1, and a composition and a film including the same are provided. In the above formula at least one of Ra and Rb is either Chemical Formula 3 or Chemical Formula 4, as shown below. The polymer also includes units selected from polyamic acid, polyimide, polyaramid, polyamide, polyurethane, polycarbonate and polyacetal units and mixtures of such units.
摘要翻译： 提供了包含由以下化学式1表示的结构单元的聚合物和包含其的组合物和膜。 在上式中，Ra和Rb中的至少一个是化学式3或化学式4，如下所示。 该聚合物还包括选自聚酰胺酸，聚酰亚胺，聚芳酰胺，聚酰胺，聚氨酯，聚碳酸酯和聚缩醛单元以及这些单元的混合物的单元。
-
-
-
-
搜索结果
5 条记录 (耗时 0.022 秒)
