公开(公告)号：US6035059A

公开(公告)日：2000-03-07

申请号：US594372

申请日：1996-01-30

申请人： Yoshiaki Kurosawa ,  Bunpei Irie ,  Hideo Horiuchi

发明人： Yoshiaki Kurosawa ,  Bunpei Irie ,  Hideo Horiuchi

IPC分类号： G06K7/12 ,  G06K9/20 ,  G06K9/34 ,  G06K9/62 ,  H04N1/46

CPC分类号： G06K9/2018 ,  G06K9/2054 ,  G06K9/342 ,  G06K9/346 ,  G06K2209/01

摘要： An image processing system capable of facilitating the highly accurate character recognition on the colored input images. In this system, an input image data to be processed is entered, and a color separation of the input image data is determined according to geometrical data for each image portion of the input image data, and color data for each image portion and a background of the input image data. Then, the input image data is appropriately processed according to the determined color separation. Also, in this system, at least one of color image data and gray scale image data according to the input image data are stored along with and binary image data according to the input image data, and the binary image data are processed by looking up the at least one of the color image data and the gray scale image data.

摘要翻译： 一种能够有助于在彩色输入图像上进行高精度字符识别的图像处理系统。 在该系统中，输入要处理的输入图像数据，并且根据输入图像数据的每个图像部分的几何数据和每个图像部分的颜色数据以及每个图像部分的背景来确定输入图像数据的颜色分离 输入图像数据。 然后，根据确定的颜色分离来适当地处理输入图像数据。 此外，在该系统中，根据输入的图像数据，根据输入的图像数据与彩色图像数据和灰度图像数据中的至少一个一起存储，并且根据输入的图像数据存储二进制图像数据，并且通过查找二进制图像数据来处理二进制图像数据 彩色图像数据和灰度图像数据中的至少一个。

公开(公告)号：US5555320A

公开(公告)日：1996-09-10

申请号：US158857

申请日：1993-11-29

申请人： Bunpei Irie ,  Yoshiaki Kurosawa

发明人： Bunpei Irie ,  Yoshiaki Kurosawa

IPC分类号： G06K9/62 ,  G06T7/00 ,  G10L15/08 ,  G10L15/10 ,  G10L15/20 ,  G10L21/02

CPC分类号： G06K9/6232

摘要： A pattern recognition system capable of handling the non-Gaussian feature vector distribution in the feature vector space such that the recognition rate can be improved while using the pattern matching based on the assumption of the Gaussian feature vector distribution. In the system, a nonlinear transformation for each recognizable category is applied to the feature vector extracted from the input pattern to be recognized, to obtain a transformed feature data for the input pattern, where the nonlinear transformation maps linearly inseparable distributions in a vector space containing the feature vector onto linearly separable distributions. Then, the transformed feature data for the input pattern is compared with reference feature model for each recognizable category indicating a feature vector distribution for each category, to find a category of the input pattern as that of the reference feature model closest to the transformed feature data for the input pattern.

摘要翻译： 一种能够处理特征向量空间中的非高斯特征向量分布的模式识别系统，使得可以在基于高斯特征向量分布的假设使用模式匹配的同时改善识别率。 在系统中，将每个可识别类别的非线性变换应用于从要被识别的输入模式提取的特征向量，以获得用于输入模式的变换特征数据，其中非线性变换将线性不可分离的分布映射在包含 特征向量线性可分布。 然后，将用于输入模式的变换的特征数据与用于每个可识别类别的参考特征模型进行比较，以指示每个类别的特征向量分布，以将输入模式的类别寻找为最接近变换的特征数据的参考特征模型的类别 用于输入模式。

公开(公告)号：US09017145B2

公开(公告)日：2015-04-28

申请号：US13083833

申请日：2011-04-11

申请人： Yoshiaki Kurosawa ,  Tomohiro Hashii ,  Yuichi Kakizono

发明人： Yoshiaki Kurosawa ,  Tomohiro Hashii ,  Yuichi Kakizono

IPC分类号： B24B57/00 ,  B24B29/02 ,  B24B37/08 ,  B24B57/02

CPC分类号： B24B37/08 ,  B24B57/02

摘要： The present invention provides a polishing solution distribution apparatus capable of reducing distribution deviation of polishing solution even when leveling for installation is insufficient or inclination of an installation location varies and a polishing apparatus having the same. The polishing solution distribution apparatus includes a cone-shaped branch body in which a solution pan to store supplied polishing solution is formed and in which plural flow passages radially connected to a side face of the solution pan respectively and having a delivery port to supply polishing solution to a position lower than the connected position are formed, a support portion to support the branch body, and a universal joint mechanism to support the branch body via the support portion at a position being higher than the gravity center of the branch body.

摘要翻译： 本发明提供一种能够减少抛光液的分布偏差的抛光液分配装置，即使在安装调平不足或安装位置的倾斜变化的情况下，也能够减少研磨液的分布偏差。 抛光液分配装置包括锥形分支体，其中形成有用于存储供应的抛光溶液的溶液盘，并且其中分别径向地连接到溶液盘的侧面并具有输送口以提供抛光溶液的多个流动通道 形成到比连接位置低的位置，支撑分支体的支撑部和万向接头机构，用于在比分支体的重心高的位置经由支撑部支撑分支体。

公开(公告)号：US08251513B2

公开(公告)日：2012-08-28

申请号：US12611552

申请日：2009-11-03

申请人： Hiroyuki Itsuki ,  Yoshiaki Kurosawa

发明人： Hiroyuki Itsuki ,  Yoshiaki Kurosawa

IPC分类号： G03B21/26

CPC分类号： G03B21/16 ,  H04N9/3144 ,  H04N9/3167

摘要： The present invention provides a projector apparatus capable of ensuring stable operation, which is configured to efficiently cool an optical device by circulating air cooled by a cooling part of a refrigeration unit, and further to prevent moisture resulting from evaporation of dew adhered to the cooling part from adversely affecting the optical device when stopping the operation of the refrigeration unit. The optical chamber and the cooling chamber are enclosed respectively by adiabatic walls, the cooling chamber and the optical chamber are connected to each other through a cold air inlet port and a cold air outlet port, and the cold air inlet port and the cold air outlet port are provided with opening and closing mechanisms. In a cooling operation mode, the optical device is cooled with cold air by opening the opening and closing mechanisms, and upon stoppage of the cooling operation, the opening and closing mechanisms are closed to prevent the inflow of the moisture in the cooling chamber to the optical chamber.

摘要翻译： 本发明提供一种能够确保稳定运行的投影仪装置，该投影仪装置被配置为通过使由制冷单元的冷却部冷却的空气循环的空气来有效地冷却光学装置，并且进一步防止由于冷却部附着的露水蒸发而产生的湿气 在停止制冷单元的操作时对光学装置产生不利影响。 光学室和冷却室分别由绝热壁封闭，冷却室和光学室通过冷空气入口和冷气出口连接，冷空气入口和冷气出口 端口设有开闭机构。 在冷却运转模式中，通过打开开闭机构，用冷空气对光学装置进行冷却，在停止冷却运转时，关闭开闭机构，防止冷却室内的水分流入 光学室。

公开(公告)号：US08196545B2

公开(公告)日：2012-06-12

申请号：US12426532

申请日：2009-04-20

申请人： Yoshiaki Kurosawa

发明人： Yoshiaki Kurosawa

IPC分类号： B05C11/00 ,  H01L21/66 ,  C23F1/08 ,  B24B49/02

CPC分类号： H01L22/12 ,  G05B2219/37224 ,  G05B2219/37398 ,  H01L22/20

摘要： In order to manufacture an epitaxial wafer having satisfactory flatness over its entire surface, epitaxial layers are experimentally grown upon actual wafer samples under various different layer formation conditions, the thickness profiles are measured over the entire surfaces of these wafers before and after growth of the layers, and, from the differences thereof, layer thickness profiles over the entire areas of the epitaxial layers under the various different layer formation conditions are ascertained and stored. Thereafter, the thickness profile of a substrate wafer is measured over its entire area, this is added to each of the layer thickness profiles under the various different layer formation conditions which have been stored, and the planarities of the manufactured wafers which would be manufactured under these various different layer formation conditions are predicted. And one set of processing conditions is selected which is predicted to satisfy a required flatness specification, and an epitaxial layer is actually grown upon the substrate wafer under these processing conditions.

摘要翻译： 为了制造在其整个表面上具有令人满意的平坦度的外延晶片，外延层在各种不同的层形成条件下在实际的晶片样品上实验生长，在层的生长之前和之后在这些晶片的整个表面上测量厚度分布 ，并且根据其差异，确定并存储在各种不同层形成条件下在外延层的整个区域上的层厚度分布。 此后，在其整个面积上测量衬底晶片的厚度分布，将其添加到已经存储的各种不同层形成条件下的每个层厚度分布以及将在下制造的制造的晶片的平面度 预测这些各种不同的层形成条件。 并且选择预定满足所需平坦度规格的一组处理条件，并且在这些处理条件下实际上在衬底晶片上生长外延层。

公开(公告)号：US20090269861A1

公开(公告)日：2009-10-29

申请号：US12426532

申请日：2009-04-20

申请人： Yoshiaki Kurosawa

发明人： Yoshiaki Kurosawa

IPC分类号： H01L21/66 ,  B05C11/00 ,  C23F1/08 ,  B24B49/02

CPC分类号： H01L22/12 ,  G05B2219/37224 ,  G05B2219/37398 ,  H01L22/20

摘要： In order to manufacture an epitaxial wafer having satisfactory flatness over its entire surface, epitaxial layers are experimentally grown upon actual wafer samples under various different layer formation conditions, the thickness profiles are measured over the entire surfaces of these wafers before and after growth of the layers, and, from the differences thereof, layer thickness profiles over the entire areas of the epitaxial layers under the various different layer formation conditions are ascertained and stored. Thereafter, the thickness profile of a substrate wafer is measured over its entire area, this is added to each of the layer thickness profiles under the various different layer formation conditions which have been stored, and the planarities of the manufactured wafers which would be manufactured under these various different layer formation conditions are predicted. And one set of processing conditions is selected which is predicted to satisfy a required flatness specification, and an epitaxial layer is actually grown upon the substrate wafer under these processing conditions.

摘要翻译： 为了制造在其整个表面上具有令人满意的平坦度的外延晶片，外延层在各种不同的层形成条件下在实际的晶片样品上实验生长，在层的生长之前和之后在这些晶片的整个表面上测量厚度分布 ，并且根据其差异，确定并存储在各种不同层形成条件下在外延层的整个区域上的层厚度分布。 此后，在其整个面积上测量衬底晶片的厚度分布，将其添加到已经存储的各种不同层形成条件下的每个层厚度分布以及将在下制造的制造的晶片的平面度 预测这些各种不同的层形成条件。 并且选择预定满足所需平坦度规格的一组处理条件，并且在这些处理条件下实际上在衬底晶片上生长外延层。

公开(公告)号：US5787414A

公开(公告)日：1998-07-28

申请号：US720218

申请日：1996-09-26

申请人： Seiji Miike ,  Satoshi Ito ,  Hiroshi Mizoguchi ,  Yoichi Takebayashi ,  Mika Fukui ,  Yoshiaki Kurosawa ,  Akira Morishita ,  Shigenobu Seto ,  Hideaki Shinchi ,  Yasushi Kawakura ,  Yoshikuni Matsumura ,  Hisako Tanaka

发明人： Seiji Miike ,  Satoshi Ito ,  Hiroshi Mizoguchi ,  Yoichi Takebayashi ,  Mika Fukui ,  Yoshiaki Kurosawa ,  Akira Morishita ,  Shigenobu Seto ,  Hideaki Shinchi ,  Yasushi Kawakura ,  Yoshikuni Matsumura ,  Hisako Tanaka

IPC分类号： G06F17/30

CPC分类号： G06F17/30017 ,  Y10S707/915 ,  Y10S707/951 ,  Y10S707/99932 ,  Y10S707/99933 ,  Y10S707/99935

摘要： A data retrieval system capable of carrying out the retrieval using the secondary information of the primary data to be retrieved such as environmental information or structural information as the retrieval key. In the system, the primary data which are filing target to be stored and retrieved are stored in a first memory while secondary information associated with the primary data, which are not directly related with data content of the primary data, are stored in a second memory in correspondence to the primary data stored in the first memory. Then, when a retrieval key specifying a desired retrieval of the primary data from the first memory is entered, the secondary information is selected from the second memory in accordance with the retrieval key, and the primary data corresponding to the secondary information selected in accordance with the retrieval key is retrieved and outputted as a retrieval result.

摘要翻译： 一种数据检索系统，其能够使用作为检索关键字的环境信息或结构信息等要检索的主要数据的次要信息进行检索。 在系统中，要存储和检索的归档目标的主数据被存储在第一存储器中，而与主数据相关联的与主数据的数据内容不直接相关的辅助信息存储在第二存储器中 对应于存储在第一存储器中的主数据。 然后，当从第一存储器指定主要数据的期望检索的检索关键字输入时，根据检索关键字从第二存储器中选择辅助信息，并且对应于根据检索关键字选择的辅助信息的主数据 作为检索结果检索并输出检索关键字。

公开(公告)号：US5400599A

公开(公告)日：1995-03-28

申请号：US987215

申请日：1992-12-08

申请人： Hiroshi Sekiya ,  Masahisa Otake ,  Junji Matsue ,  Ryouichi Katohno ,  Toshikazu Ishihara ,  Izumi Okamoto ,  Yoshiaki Kurosawa ,  Mitsuhiko Ishino

发明人： Hiroshi Sekiya ,  Masahisa Otake ,  Junji Matsue ,  Ryouichi Katohno ,  Toshikazu Ishihara ,  Izumi Okamoto ,  Yoshiaki Kurosawa ,  Mitsuhiko Ishino

IPC分类号： F02G1/044 ,  F02G1/053 ,  F02G1/057 ,  F25B9/14 ,  F25B9/00

CPC分类号： F02G1/057 ,  F02G1/0445 ,  F02G1/053 ,  F25B9/14 ,  F02G2250/18 ,  F02G2253/02 ,  F02G2253/03 ,  F02G2270/50

摘要： Gas displacement volumes of a high temperature chamber and a middle temperature chamber in a high temperature portion of a hot gas machine are different. Alternatively, a gas displacement volume of a low temperature chamber and a middle temperature chamber in a low temperature portion are different.

摘要翻译： 在热气机的高温部分中的高温室和中温室的气体排量是不同的。 或者，低温部的低温室和中温室的气体排出容积不同。

公开(公告)号：US09550264B2

公开(公告)日：2017-01-24

申请号：US13322955

申请日：2010-06-04

申请人： Tomohiro Hashii ,  Yuichi Kakizono ,  Yoshiaki Kurosawa

发明人： Tomohiro Hashii ,  Yuichi Kakizono ,  Yoshiaki Kurosawa

IPC分类号： B24B1/00 ,  B24B7/22 ,  B24D7/06 ,  H01L21/02

CPC分类号： B24B7/228 ,  B24B7/17 ,  B24B37/08 ,  B24B37/22 ,  B24B37/245 ,  B24D7/06 ,  H01L21/02013

摘要： Disclosure relates to a fixed abrasive-grain processing device and a method of fixed abrasive-grain processing used for producing a semiconductor wafer, and a method for producing a semiconductor wafer which make the surface of the semiconductor wafer possible to have preferable flatness and which can prevent the number of steps and the installation area of facilities from increasing. The producing of semiconductor wafers uses a fixed abrasive-grain processing device including a lower fixed abrasive-grain layer that is adjacent to the top surface of the lower surface-plate and that grinds the top surfaces of the plurality of semiconductor wafers; an upper fixed abrasive-grain layer that is adjacent to the bottom surface of the upper surface-plate and that grinds the bottom surfaces of the plurality of semiconductor wafers; a carrier plate that is horizontally interposed between the lower surface-plate and the upper surface-plate and that includes a plurality of holes each accommodating one of the plurality of semiconductor wafers; and a carrier rotating device that circularly moves the carrier plate, wherein the lower fixed abrasive-grain layer and the upper fixed abrasive-grain layer include fixed abrasive grain having a diameter of 4 μm or less and being dispersed and fixed in elastic members.

摘要翻译： 公开涉及固定磨粒加工装置和用于制造半导体晶片的固定磨粒加工方法，以及制造半导体晶片的方法，其使得半导体晶片的表面可以具有优选的平坦度，并且可以 防止设施的数量和安装面积的增加。 半导体晶片的制造使用固定的磨粒处理装置，其包括与下表面板的顶表面相邻的下固定磨粒层，并且研磨多个半导体晶片的顶表面; 上固定磨粒层，其与所述上表面板的底表面相邻并且研磨所述多个半导体晶片的底表面; 水平插入在所述下表面板和所述上表面板之间并且包括多个孔的承载板，每个孔容纳所述多个半导体晶片中的一个; 以及使所述载板圆周地移动的载体旋转装置，其中，所述下固定磨粒层和所述上固定磨粒层包括直径为4μm以下的固定磨粒，并分散固定在弹性部件中。

公开(公告)号：US20120315739A1

公开(公告)日：2012-12-13

申请号：US13581011

申请日：2011-02-16

申请人： Tomohiro Hashii ,  Yuichi Kakizono ,  Yoshiaki Kurosawa

发明人： Tomohiro Hashii ,  Yuichi Kakizono ,  Yoshiaki Kurosawa

IPC分类号： H01L21/78

CPC分类号： B24B37/042 ,  B24B9/065 ,  B24B27/0633 ,  B24B37/08 ,  B24B37/245 ,  B28D5/0076 ,  H01L21/02008 ,  H01L21/02013 ,  H01L21/02021 ,  H01L21/02024

摘要： All treatments performed in machining processes other than a polishing process are performed while pure water free from free abrasive grains is supplied. Thus, an amount of abrasive grains included in a used processing liquid discharged in each process is reduced and semiconductor scraps are collected from the used slurry for recycling.

摘要翻译： 在进行抛光处理以外的加工工序中进行的所有处理都是在不含有游离磨粒的纯水的情况下进行的。 因此，减少了在各工序中排出的使用过的处理液中所含的磨粒的量，并将二氧化硅废料从废浆中回收再循环。