Polishing solution distribution apparatus and polishing apparatus having the same
    2.
    发明授权
    Polishing solution distribution apparatus and polishing apparatus having the same 有权
    抛光液分配装置及其抛光装置

    公开(公告)号:US09017145B2

    公开(公告)日:2015-04-28

    申请号:US13083833

    申请日:2011-04-11

    CPC分类号: B24B37/08 B24B57/02

    摘要: The present invention provides a polishing solution distribution apparatus capable of reducing distribution deviation of polishing solution even when leveling for installation is insufficient or inclination of an installation location varies and a polishing apparatus having the same. The polishing solution distribution apparatus includes a cone-shaped branch body in which a solution pan to store supplied polishing solution is formed and in which plural flow passages radially connected to a side face of the solution pan respectively and having a delivery port to supply polishing solution to a position lower than the connected position are formed, a support portion to support the branch body, and a universal joint mechanism to support the branch body via the support portion at a position being higher than the gravity center of the branch body.

    摘要翻译: 本发明提供一种能够减少抛光液的分布偏差的抛光液分配装置,即使在安装调平不足或安装位置的倾斜变化的情况下,也能够减少研磨液的分布偏差。 抛光液分配装置包括锥形分支体,其中形成有用于存储供应的抛光溶液的溶液盘,并且其中分别径向地连接到溶液盘的侧面并具有输送口以提供抛光溶液的多个流动通道 形成到比连接位置低的位置,支撑分支体的支撑部和万向接头机构,用于在比分支体的重心高的位置经由支撑部支撑分支体。

    Projector apparatus
    3.
    发明授权
    Projector apparatus 失效
    投影仪

    公开(公告)号:US08251513B2

    公开(公告)日:2012-08-28

    申请号:US12611552

    申请日:2009-11-03

    IPC分类号: G03B21/26

    摘要: The present invention provides a projector apparatus capable of ensuring stable operation, which is configured to efficiently cool an optical device by circulating air cooled by a cooling part of a refrigeration unit, and further to prevent moisture resulting from evaporation of dew adhered to the cooling part from adversely affecting the optical device when stopping the operation of the refrigeration unit. The optical chamber and the cooling chamber are enclosed respectively by adiabatic walls, the cooling chamber and the optical chamber are connected to each other through a cold air inlet port and a cold air outlet port, and the cold air inlet port and the cold air outlet port are provided with opening and closing mechanisms. In a cooling operation mode, the optical device is cooled with cold air by opening the opening and closing mechanisms, and upon stoppage of the cooling operation, the opening and closing mechanisms are closed to prevent the inflow of the moisture in the cooling chamber to the optical chamber.

    摘要翻译: 本发明提供一种能够确保稳定运行的投影仪装置,该投影仪装置被配置为通过使由制冷单元的冷却部冷却的空气循环的空气来有效地冷却光学装置,并且进一步防止由于冷却部附着的露水蒸发而产生的湿气 在停止制冷单元的操作时对光学装置产生不利影响。 光学室和冷却室分别由绝热壁封闭,冷却室和光学室通过冷空气入口和冷气出口连接,冷空气入口和冷气出口 端口设有开闭机构。 在冷却运转模式中,通过打开开闭机构,用冷空气对光学装置进行冷却,在停止冷却运转时,关闭开闭机构,防止冷却室内的水分流入 光学室。

    Device and method for manufacturing a semiconductor wafer
    4.
    发明授权
    Device and method for manufacturing a semiconductor wafer 有权
    用于制造半导体晶片的装置和方法

    公开(公告)号:US08196545B2

    公开(公告)日:2012-06-12

    申请号:US12426532

    申请日:2009-04-20

    申请人: Yoshiaki Kurosawa

    发明人: Yoshiaki Kurosawa

    摘要: In order to manufacture an epitaxial wafer having satisfactory flatness over its entire surface, epitaxial layers are experimentally grown upon actual wafer samples under various different layer formation conditions, the thickness profiles are measured over the entire surfaces of these wafers before and after growth of the layers, and, from the differences thereof, layer thickness profiles over the entire areas of the epitaxial layers under the various different layer formation conditions are ascertained and stored. Thereafter, the thickness profile of a substrate wafer is measured over its entire area, this is added to each of the layer thickness profiles under the various different layer formation conditions which have been stored, and the planarities of the manufactured wafers which would be manufactured under these various different layer formation conditions are predicted. And one set of processing conditions is selected which is predicted to satisfy a required flatness specification, and an epitaxial layer is actually grown upon the substrate wafer under these processing conditions.

    摘要翻译: 为了制造在其整个表面上具有令人满意的平坦度的外延晶片,外延层在各种不同的层形成条件下在实际的晶片样品上实验生长,在层的生长之前和之后在这些晶片的整个表面上测量厚度分布 ,并且根据其差异,确定并存储在各种不同层形成条件下在外延层的整个区域上的层厚度分布。 此后,在其整个面积上测量衬底晶片的厚度分布,将其添加到已经存储的各种不同层形成条件下的每个层厚度分布以及将在下制造的制造的晶片的平面度 预测这些各种不同的层形成条件。 并且选择预定满足所需平坦度规格的一组处理条件,并且在这些处理条件下实际上在衬底晶片上生长外延层。

    Device and method for manufacturing a semiconductor wafer
    5.
    发明申请
    Device and method for manufacturing a semiconductor wafer 有权
    用于制造半导体晶片的装置和方法

    公开(公告)号:US20090269861A1

    公开(公告)日:2009-10-29

    申请号:US12426532

    申请日:2009-04-20

    申请人: Yoshiaki Kurosawa

    发明人: Yoshiaki Kurosawa

    摘要: In order to manufacture an epitaxial wafer having satisfactory flatness over its entire surface, epitaxial layers are experimentally grown upon actual wafer samples under various different layer formation conditions, the thickness profiles are measured over the entire surfaces of these wafers before and after growth of the layers, and, from the differences thereof, layer thickness profiles over the entire areas of the epitaxial layers under the various different layer formation conditions are ascertained and stored. Thereafter, the thickness profile of a substrate wafer is measured over its entire area, this is added to each of the layer thickness profiles under the various different layer formation conditions which have been stored, and the planarities of the manufactured wafers which would be manufactured under these various different layer formation conditions are predicted. And one set of processing conditions is selected which is predicted to satisfy a required flatness specification, and an epitaxial layer is actually grown upon the substrate wafer under these processing conditions.

    摘要翻译: 为了制造在其整个表面上具有令人满意的平坦度的外延晶片,外延层在各种不同的层形成条件下在实际的晶片样品上实验生长,在层的生长之前和之后在这些晶片的整个表面上测量厚度分布 ,并且根据其差异,确定并存储在各种不同层形成条件下在外延层的整个区域上的层厚度分布。 此后,在其整个面积上测量衬底晶片的厚度分布,将其添加到已经存储的各种不同层形成条件下的每个层厚度分布以及将在下制造的制造的晶片的平面度 预测这些各种不同的层形成条件。 并且选择预定满足所需平坦度规格的一组处理条件,并且在这些处理条件下实际上在衬底晶片上生长外延层。

    Pattern recognition system with improved recognition rate using
nonlinear transformation
    6.
    发明授权
    Pattern recognition system with improved recognition rate using nonlinear transformation 失效
    使用非线性变换提高识别率的模式识别系统

    公开(公告)号:US5555320A

    公开(公告)日:1996-09-10

    申请号:US158857

    申请日:1993-11-29

    CPC分类号: G06K9/6232

    摘要: A pattern recognition system capable of handling the non-Gaussian feature vector distribution in the feature vector space such that the recognition rate can be improved while using the pattern matching based on the assumption of the Gaussian feature vector distribution. In the system, a nonlinear transformation for each recognizable category is applied to the feature vector extracted from the input pattern to be recognized, to obtain a transformed feature data for the input pattern, where the nonlinear transformation maps linearly inseparable distributions in a vector space containing the feature vector onto linearly separable distributions. Then, the transformed feature data for the input pattern is compared with reference feature model for each recognizable category indicating a feature vector distribution for each category, to find a category of the input pattern as that of the reference feature model closest to the transformed feature data for the input pattern.

    摘要翻译: 一种能够处理特征向量空间中的非高斯特征向量分布的模式识别系统,使得可以在基于高斯特征向量分布的假设使用模式匹配的同时改善识别率。 在系统中,将每个可识别类别的非线性变换应用于从要被识别的输入模式提取的特征向量,以获得用于输入模式的变换特征数据,其中非线性变换将线性不可分离的分布映射在包含 特征向量线性可分布。 然后,将用于输入模式的变换的特征数据与用于每个可识别类别的参考特征模型进行比较,以指示每个类别的特征向量分布,以将输入模式的类别寻找为最接近变换的特征数据的参考特征模型的类别 用于输入模式。

    Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer
    8.
    发明授权
    Fixed abrasive-grain processing device, method of fixed abrasive-grain processing, and method for producing semiconductor wafer 有权
    固定磨粒加工装置,固定磨粒加工方法以及半导体晶片的制造方法

    公开(公告)号:US09550264B2

    公开(公告)日:2017-01-24

    申请号:US13322955

    申请日:2010-06-04

    摘要: Disclosure relates to a fixed abrasive-grain processing device and a method of fixed abrasive-grain processing used for producing a semiconductor wafer, and a method for producing a semiconductor wafer which make the surface of the semiconductor wafer possible to have preferable flatness and which can prevent the number of steps and the installation area of facilities from increasing. The producing of semiconductor wafers uses a fixed abrasive-grain processing device including a lower fixed abrasive-grain layer that is adjacent to the top surface of the lower surface-plate and that grinds the top surfaces of the plurality of semiconductor wafers; an upper fixed abrasive-grain layer that is adjacent to the bottom surface of the upper surface-plate and that grinds the bottom surfaces of the plurality of semiconductor wafers; a carrier plate that is horizontally interposed between the lower surface-plate and the upper surface-plate and that includes a plurality of holes each accommodating one of the plurality of semiconductor wafers; and a carrier rotating device that circularly moves the carrier plate, wherein the lower fixed abrasive-grain layer and the upper fixed abrasive-grain layer include fixed abrasive grain having a diameter of 4 μm or less and being dispersed and fixed in elastic members.

    摘要翻译: 公开涉及固定磨粒加工装置和用于制造半导体晶片的固定磨粒加工方法,以及制造半导体晶片的方法,其使得半导体晶片的表面可以具有优选的平坦度,并且可以 防止设施的数量和安装面积的增加。 半导体晶片的制造使用固定的磨粒处理装置,其包括与下表面板的顶表面相邻的下固定磨粒层,并且研磨多个半导体晶片的顶表面; 上固定磨粒层,其与所述上表面板的底表面相邻并且研磨所述多个半导体晶片的底表面; 水平插入在所述下表面板和所述上表面板之间并且包括多个孔的承载板,每个孔容纳所述多个半导体晶片中的一个; 以及使所述载板圆周地移动的载体旋转装置,其中,所述下固定磨粒层和所述上固定磨粒层包括直径为4μm以下的固定磨粒,并分散固定在弹性部件中。

    BATTERY DEVICE AND BATTERY UNIT
    10.
    发明申请
    BATTERY DEVICE AND BATTERY UNIT 审中-公开
    电池设备和电池单元

    公开(公告)号:US20110020676A1

    公开(公告)日:2011-01-27

    申请号:US12934175

    申请日:2009-03-17

    申请人: Yoshiaki Kurosawa

    发明人: Yoshiaki Kurosawa

    IPC分类号: H01M10/50

    摘要: Occurrence of noise and invasion of grit or dust are prevented and occurrence of condensed water is suppressed.A battery device having a battery which is mounted in a battery case to accumulate power to be demanded and supplied to a motor for driving a vehicle is characterized in that the battery case is designed in a hermetically-sealed structure, a heat exchanger for cooling ambient atmosphere in the battery case and an air blower for blowing cold air of the heat exchanger to the battery are provided in the battery case, and inert gas or dried air is hermetically filled in the battery case under a state that the battery case is hermetically sealed.

    摘要翻译: 防止发生噪声和侵入砂粒或灰尘,抑制冷凝水的发生。 一种具有电池的电池装置,其被安装在电池壳体中以积蓄要求的电力并被提供给用于驱动车辆的电动机,其特征在于,电池壳体设计为密封结构,用于冷却环境的热交换器 电池壳体中的气氛和用于将热交换器的冷空气吹送到电池的鼓风机设置在电池壳体中,并且在电池壳体被密封的状态下将惰性气体或干燥的空气气密地填充在电池壳体中 。