公开(公告)号：US5377174A

公开(公告)日：1994-12-27

申请号：US890104

申请日：1992-05-29

申请人： Yoshiaki Nakagawa ,  Takashi Suzuki ,  Yasuyoshi Kagohashi ,  Seiji Nakama ,  Hajime Daigaku ,  Tukasa Nakayama ,  Shinji Sekiya

发明人： Yoshiaki Nakagawa ,  Takashi Suzuki ,  Yasuyoshi Kagohashi ,  Seiji Nakama ,  Hajime Daigaku ,  Tukasa Nakayama ,  Shinji Sekiya

IPC分类号： G11B17/04 ,  G11B17/056 ,  G11B17/22 ,  G11B17/26 ,  G11B33/02

CPC分类号： G11B17/22

摘要： The disk changer comprises a first rack member supporting on its one end side a latch pawl adapted to latch a pin, and a second rack member supporting on its other end side a latch pawl adapted to latch the pin, the first and second rack members being slidably supported in parallel with each other. After the first rack member transfers a tray by a predetermined distance, latching of the tray thereon is switched over from the first rack member to the second rack member. The tray is then further transferred by the second rack member.

摘要翻译： 盘片更换器包括：第一齿条构件，其一端侧支撑适于锁定销的闩锁爪;以及第二齿条构件，其在另一端侧支撑适于闩锁销的闩锁爪，第一和第二支架构件为 可滑动地彼此平行地支撑。 在第一齿条构件将托盘传送预定距离之后，其上的托盘的闩锁从第一齿条构件切换到第二齿条构件。 然后通过第二齿条构件进一步传送托盘。

公开(公告)号：US4545154A

公开(公告)日：1985-10-08

申请号：US523825

申请日：1983-08-15

申请人： Shinji Sekiya ,  Takatoshi Ono

发明人： Shinji Sekiya ,  Takatoshi Ono

IPC分类号： B24D7/02 ,  B24D7/06 ,  B24D18/00 ,  B24B5/00

CPC分类号： B24D7/02 ,  B24D18/0018 ,  B24D7/06

摘要： A grinding wheel that can rotate at high speed to grind flat plates comprised of a thin conical grindstone fastened to the open end of a rotatable inverted cup, with the grinding edge projecting outwardly from and at an inclined angle with respect to the open end. The grindstone includes a cylindrical fitting part which is fastened to the inside of the cup and a conical grinding part formed by electroplating from a nickel plating solution in which super hard abrasive grains are dispersed. The grindstone can also be prepared by electrodepositing abrasive grains directly onto a flange formed at the open end of the cup.

摘要翻译： 可以高速旋转的研磨轮，以研磨由固定在可旋转倒杯的开口端的细圆锥磨石构成的平板，研磨刃相对于开口端向外突出并以倾斜角向外突出。 磨石包括固定到杯内部的圆筒形配件部分和通过从其中分散超硬磨料颗粒的镀镍溶液电镀而形成的锥形研磨部件。 磨石也可以通过将磨料颗粒直接电沉积到形成在杯的开口端的凸缘上来制备。

公开(公告)号：US4839996A

公开(公告)日：1989-06-20

申请号：US118133

申请日：1987-11-09

申请人： Shinji Sekiya

发明人： Shinji Sekiya

IPC分类号： B24B1/00

CPC分类号： B24B1/00

摘要： Machining of a hard, brittle and difficultly-machinable workpiece by a grinding wheel made of superabrasive grains. The grinding wheel is rotated at a peripheral speed of 1000 to 5500 m/min., and the grinding wheel and the workpiece are moved relative to each other in the machining direction at a feed speed of at least 30 mm/sec.

公开(公告)号：US4617766A

公开(公告)日：1986-10-21

申请号：US749043

申请日：1985-06-26

申请人： Shinji Sekiya ,  Takatoshi Ono

发明人： Shinji Sekiya ,  Takatoshi Ono

IPC分类号： B24D7/02 ,  B24D7/06 ,  B24D18/00 ,  B24D5/00

CPC分类号： B24D7/02 ,  B24D18/0018 ,  B24D7/06

摘要： A grinding wheel that can rotate at high speed to grind flat plates is comprised of a thin conical grindstone fastened to the open end of a rotatable inverted cup, with the grinding edge projecting outwardly from and at an inclined angle with respect to the open end. The grindstone includes a cylindrical fitting part which is fastened to the inside of the cup and a conical grinding part formed by electroplating from a nickel plating solution in which super hard abrasive grains are dispersed. The grindstone can also be prepared by electrodepositing abrasive grains directly onto a flange formed at the open end of the cup.

摘要翻译： 可以高速旋转以研磨平板的砂轮由固定在可旋转倒杯的开口端的细圆锥磨石构成，研磨刃相对于开口端向外突出并以倾斜角向外突出。 磨石包括固定到杯内部的圆筒形配件部分和通过从其中分散超硬磨料颗粒的镀镍溶液电镀而形成的锥形研磨部件。 磨石也可以通过将磨料颗粒直接电沉积到形成在杯的开口端的凸缘上来制备。

公开(公告)号：US4565034A

公开(公告)日：1986-01-21

申请号：US567682

申请日：1984-01-03

申请人： Shinji Sekiya

发明人： Shinji Sekiya

IPC分类号： B24D11/00

CPC分类号： B24D11/00

摘要： For adaptation to grinding or cutting precise or minute parts, a grinding and/or cutting endless belt is made of grindstone comprising electrodeposited abrasive grains.

摘要翻译： 为了适应研磨或切割精密或微小零件，研磨和/或切割环形带由包括电沉积磨料颗粒的磨石制成。

公开(公告)号：US4521995A

公开(公告)日：1985-06-11

申请号：US265318

申请日：1981-05-20

申请人： Shinji Sekiya

发明人： Shinji Sekiya

IPC分类号： B24B41/06 ,  H01L21/302 ,  H01L21/683

CPC分类号： B24B41/068 ,  B24B37/30 ,  H01L21/302 ,  H01L21/6838

摘要： A work head for attracting and fixing an IC silicon wafer is comprised of an attracting disc and a base seat surrounding the periphery of the attracting disk. The attracting disc is of an inorganic substance shaped and sintered so that the upper layer of the attracting disc is composed of a porous body of porous grain and the lower layer the attracting body is formed with a slightly coarse body of porous grain.The base seat is made airtight, being formed and sintered with the same substance as the attracting disc. The attracting disc and the base seat are coupled with glass having a low melting point. The attracting disc is connected to a connecting hole drilled through the base seat and further to a water injecting hole and air sucking hole of a lower base. Before the wafer is attracted, water is injected from the injection hole for soaking the attracting surface. The surface tension of water transfers the wafer to the center of the attracting surface. Hereafter, the wafer is attracted onto the attracting surface by sucking air out. After the working, water is injected again for floating the wafer.

摘要翻译： 用于吸引和固定IC硅晶片的工作头包括吸引盘和围绕吸引盘周边的基座。 吸引盘是无机物质成形和烧结的，使得吸引盘的上层由多孔颗粒的多孔体组成，而下层吸引体形成有稍微粗大的多孔颗粒体。 基座是气密的，与吸引盘相同的物质形成和烧结。 吸引盘和基座与具有低熔点的玻璃结合。 吸引盘连接到穿过基座的连接孔，并且进一步连接到下底座的注水孔和空气吸入孔。 在晶片被吸引之前，从喷射孔注入水以浸泡吸引表面。 水的表面张力将晶片转移到吸引表面的中心。 此后，通过吸出空气将晶片吸引到吸引表面上。 工作后，再次注入水以漂浮晶片。

公开(公告)号：US4445300A

公开(公告)日：1984-05-01

申请号：US212669

申请日：1980-12-03

申请人： Shinji Sekiya ,  Takatoshi Ono

发明人： Shinji Sekiya ,  Takatoshi Ono

IPC分类号： B24B7/00 ,  B24D7/00 ,  B24D7/02 ,  B24D7/06 ,  B24D7/18 ,  B24B7/20

CPC分类号： B24D7/06 ,  B24D7/02

摘要： Grinding of flat plates is performed by using a very thin, conical grinding wheel which is attached to the open end of a revolving cup and which projects outwardly from and is inclined with respect to the cup. The peripheral cutting edge of the grinding wheel revolving at high speed is brought into contact with the work. As the grinding wheel is fed, the work is cut by the grinding wheel across its thickness and an undercut part of the work disrupts (i.e. breaks off) by itself to a desired thickness. Thick grinding is also possible if a multiplicity of the grinding wheels are placed one over another at proper intervals.

摘要翻译： 平板磨削是通过使用非常薄的圆锥形磨轮进行的，该砂轮附接到旋转杯的开口端，并且相对于杯子向外突出并且倾斜。 与高速旋转的砂轮的周边切削刃与工件接触。 当砂轮进给时，工件由砂轮穿过其厚度切割，并且工件的底切部分自身破裂（即断开）到期望的厚度。 如果将多个磨轮以适当的间隔放置在另一个上，则也可以进行粗磨。

公开(公告)号：US4411107A

公开(公告)日：1983-10-25

申请号：US212305

申请日：1980-12-03

申请人： Shinji Sekiya ,  Takatoshi Ono

发明人： Shinji Sekiya ,  Takatoshi Ono

IPC分类号： B24D7/02 ,  B24D7/06 ,  B24D18/00 ,  B24D5/00

CPC分类号： B24D7/02 ,  B24D18/0018 ,  B24D7/06

摘要： A grinding wheel that can rotate at high speed to grind flat plates is comprised of a thin conical grindstone fastened to the open end of a rotatable inverted cup, with the grinding edge projecting outwardly from and at an inclined angle with respect to the open end. The grindstone includes a cylindrical fitting part which is fastened to the inside of the cup and a conical grinding part formed by electroplating from a nickel plating solution in which super hard abrasive grains are dispersed. The grindstone can also be prepared by electrodepositing abrasive grains directly onto a flange formed at the open end of the cup.

公开(公告)号：US4705016A

公开(公告)日：1987-11-10

申请号：US858773

申请日：1986-05-02

申请人： Shinji Sekiya

发明人： Shinji Sekiya

IPC分类号： B23D59/00 ,  B23Q11/00 ,  G01B5/00 ,  G05B19/404 ,  B28D1/04

CPC分类号： G05B19/404 ,  B23D59/002 ,  B23Q11/0007 ,  G01B5/0014 ,  G05B2219/37096 ,  G05B2219/45044 ,  G05B2219/49207

摘要： A precision device including a holding mechanism for holding an object and a supporting mechanism for supporting an operating element, one of which is movable in a predetermined direction. The precision device includes a detecting device for detecting the amount of movement of one of the holding holding and supporting mechanisms in the predetermined direction, and the detecting device includes a scale formed of a material having a coefficient of linear expansion, in a temperature range of -20.degree. to 100.degree. C., of not more than 10.times.10.sup.-7 /.degree.C. as an absolute value. The precision device further includes a detecting device for detecting the amount of thermal expansion of at least a part of the supporting mechanism in the predetermined direction.

摘要翻译： 一种精密装置，包括用于保持物体的保持机构和用于支撑操作元件的支撑机构，其中一个操作元件可沿预定方向移动。 精密装置包括检测装置，用于检测保持保持和支撑机构中的一个在预定方向上的移动量，并且检测装置包括由具有线膨胀系数的材料形成的标尺，温度范围为 -20℃至100℃，绝对值不大于10×10-7 /℃。 精密装置还包括用于检测支撑机构的至少一部分在预定方向上的热膨胀量的检测装置。

公开(公告)号：US4625463A

公开(公告)日：1986-12-02

申请号：US708626

申请日：1985-03-06

申请人： Shinji Sekiya

发明人： Shinji Sekiya

IPC分类号： B24B41/06 ,  H01L21/302 ,  H01L21/683

CPC分类号： B24B41/068 ,  B24B37/30 ,  H01L21/302 ,  H01L21/6838

摘要： A work head for attracting and fixing an IC silicon wafer is comprised of an attracting disc and a base seat surrounding the periphery of the attracting disk. The attracting disc is of an inorganic substance shaped and sintered so that the upper layer of the attracting disc is composed of a porous body of porous grain and the lower layer the attracting body is formed with a slightly coarse body of porous grain.The base seat is made airtight being formed and sintered with the same substance as the attracting disc. The attracting disc and the base seat are coupled with glass having a low melting point. The attracting disc is connected to a connecting hole drilled through the base seat and further to a water injecting hole and air sucking hole of a lower base. Before the wafer is attracted, water is injected from the injection hole for soaking the attracting surface. The surface tension of water transfers the wafer to the center of the attracting surface. Hereafter, the wafer is attracted onto the attracting surface by sucking air out. After the working, water is injected again for floating the wafer.

摘要翻译： 用于吸引和固定IC硅晶片的工作头包括吸引盘和围绕吸引盘周边的基座。 吸引盘是无机物质成形和烧结的，使得吸引盘的上层由多孔颗粒的多孔体组成，而下层吸引体形成有稍微粗大的多孔颗粒体。 基座被气密地形成并与吸引盘相同的物质烧结。 吸引盘和基座与具有低熔点的玻璃结合。 吸引盘连接到穿过基座的连接孔，并且进一步连接到下底座的注水孔和空气吸入孔。 在晶片被吸引之前，从喷射孔注入水以浸泡吸引表面。 水的表面张力将晶片转移到吸引表面的中心。 此后，通过吸出空气将晶片吸引到吸引表面上。 工作后，再次注入水以漂浮晶片。