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公开(公告)号：US07014534B2
公开(公告)日：2006-03-21
申请号：US10857841
申请日：2004-06-02
IPC分类号： B24B1/00
CPC分类号： C09K3/1463 , B24B37/044 , C09G1/02
摘要： A method for manufacturing a substrate, a polishing process for a substrate, a method of reducing microwaviness for a substrate, each including the step of polishing a substrate to be polished with a polishing composition containing an abrasive and water with a polishing pad of which surface member has an average pore size of from 1 to 35 μm; and a method of reducing scratches for a substrate, comprising the step of polishing a substrate to be polished with a polishing composition comprising an abrasive, an oxidizing agent, an acid, a salt thereof, or a mixture thereof and water, with a polishing pad of which surface member has an average pore size of from 1 to 35 μm. The method for manufacturing a substrate can be used for finish polishing of a memory hard disk or for polishing of a semiconductor element.
摘要翻译： 一种基板的制造方法，基板的研磨工序，降低基板的微波的方法，其特征在于，具备：研磨用抛光组合物研磨待研磨基板的步骤，所述抛光组合物的表面 成员的平均孔径为1至35μm; 以及减少基材划痕的方法，包括用抛光组合物抛光待抛光基材的步骤，抛光组合物包括研磨剂，氧化剂，酸，其盐或其混合物和水，抛光垫 其表面成员的平均孔径为1〜35μm。 用于制造基板的方法可以用于存储硬盘的精抛光或半导体元件的抛光。
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公开(公告)号：US06910952B2
公开(公告)日：2005-06-28
申请号：US10753460
申请日：2004-01-09
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1436 , C09K3/1463
摘要： A polishing composition for a substrate for memory hard disk, comprising silica particles in an aqueous medium, wherein the silica particles satisfy a specified relationship between an average particle size of the silica particles on the number basis and a standard deviation on the number basis, wherein the average particle size is obtained by a determination by transmission electron microscope (TEM) observation, and wherein a particle size and a cumulative volume frequency in a range of particle sizes of from 60 to 120 nm satisfies a specified relationship; a method of reducing microwaviness of a substrate for memory hard disk, comprising the step of polishing the substrate for memory hard disk with the polishing composition; and a method for manufacturing a substrate for memory hard disk, comprising the step of polishing a Ni—P plated substrate for memory hard disk with the polishing composition. The method can be suitably used for the manufacture of a substrate for precision parts, such as a substrate for memory hard disk.
摘要翻译： 一种用于存储硬盘的衬底的抛光组合物，其包含在水性介质中的二氧化硅颗粒，其中所述二氧化硅颗粒在数量基础上满足二氧化硅颗粒的平均粒度和基于数量的标准偏差之间的规定关系，其中 通过透射电子显微镜（TEM）观察确定得到平均粒径，其中粒径为60〜120nm的粒径和累积体积频率满足规定的关系; 一种降低存储硬盘用基板的微波的方法，其特征在于，包括用所述研磨用组合物研磨用于存储硬盘的基板的工序; 以及用于制造用于存储硬盘的基板的方法，包括用抛光组合物抛光用于存储硬盘的Ni-P镀覆基板的步骤。 该方法可以适用于制造用于精密部件的基板，例如用于存储硬盘的基板。
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公开(公告)号：US07303601B2
公开(公告)日：2007-12-04
申请号：US10727571
申请日：2003-12-05
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463
摘要： A polishing composition for memory hard disk containing water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R) and a cumulative volume frequency (V) in a graph of particle size-cumulative volume frequency obtained by plotting a cumulative volume frequency (%) of the silica particles counted from a small particle size side against a particle size (nm) of the silica particles in the range of particle sizes of from 40 to 100 nm satisfy the following formula (1): V≧0.5×R+40 (1), wherein the particle size is determined by observation with a transmission electron microscope (TEM). The polishing composition of the present invention can be even more suitably used for the manufacture of a substrate for precision parts such as substrates for memory hard disks.
摘要翻译： 一种含有水和二氧化硅颗粒的记忆硬盘的抛光组合物，其中二氧化硅颗粒具有颗粒尺寸分布，其中颗粒尺寸累积体积（R）和累积体积频率（V） 通过绘制从小粒径侧计数的二氧化硅粒子的累积体积频率（％）与粒径为40〜100nm范围内的二氧化硅粒子的粒径（nm）的曲线图所得到的频率满足下式（ 1）：V> = 0.5×R + 40（1），其中通过用透射电子显微镜（TEM）观察确定粒径。 本发明的抛光组合物甚至可以更适合用于制造用于存储硬盘的基板的精密部件用基板。
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公开(公告)号：US20060030243A1
公开(公告)日：2006-02-09
申请号：US11184960
申请日：2005-07-20
申请人： Kazuhiko Nishimoto , Kouji Taira , Kenichi Suenaga , Yuichi Honma
发明人： Kazuhiko Nishimoto , Kouji Taira , Kenichi Suenaga , Yuichi Honma
CPC分类号： G11B5/8404 , B24B37/0056 , B24B37/044 , C09G1/02 , C09K3/1409 , C09K3/1463
摘要： A polishing composition containing an abrasive and water, wherein the polishing composition has a pH of from 0.1 to 7, and satisfies the following conditions: (1) that the number of polishing particles having sizes of 0.56 μm or more and less than 1 μm is 500,000 or less per 1 cm3 of the polishing composition; and (2) that the ratio of polishing particles having sizes of 1 μm or more is 0.001% by weight or less to the entire polishing particles in the polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, recording disk substrates, such as magnetic disks, optical disks, and opto-magnetic disks, photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.
摘要翻译： 1.一种抛光组合物，其含有研磨剂和水，其中，所述研磨用组合物的pH为0.1〜7，满足以下条件：（1）尺寸为0.56μm以上且小于1μm的研磨粒子数为 每抛光组合物1cm 3以上500,000以下; （2）研磨用组合物中的研磨粒子的整体的比例为1μm以上的研磨粒子的比例为0.001重量％以下。 抛光组合物适用于抛光用于精密部件的基板，例如磁盘，光盘，光磁盘，光掩模基板，光学透镜，光学镜，光学棱镜和半导体基板等记录盘基板，以及 类似。
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公开(公告)号：US20100190413A1
公开(公告)日：2010-07-29
申请号：US12754385
申请日：2010-04-05
申请人： Kazuhiko NISHIMOTO , Kouji Taira , Kenichi Suenaga , Yuichi Honma
发明人： Kazuhiko NISHIMOTO , Kouji Taira , Kenichi Suenaga , Yuichi Honma
CPC分类号： G11B5/8404 , B24B37/0056 , B24B37/044 , C09G1/02 , C09K3/1409 , C09K3/1463
摘要： A polishing composition containing an abrasive and water, wherein the polishing composition has a pH of from 0.1 to 7, and satisfies the following conditions: (1) that the number of polishing particles having sizes of 0.56 μm or more and less than 1 μm is 500,000 or less per 1 cm3 of the polishing composition; and (2) that the ratio of polishing particles having sizes of 1 μm or more is 0.001% by weight or less to the entire polishing particles in the polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, recording disk substrates, such as magnetic disks, optical disks, and opto-magnetic disks, photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.
摘要翻译： 1.一种抛光组合物，其含有研磨剂和水，其中，所述研磨用组合物的pH为0.1〜7，满足以下条件：（1）尺寸为0.56μm以上且小于1μm的研磨粒子数为 每1cm3抛光组合物500,000或更少; （2）研磨用组合物中的研磨粒子的整体的比例为1μm以上的研磨粒子的比例为0.001重量％以下。 抛光组合物适用于抛光用于精密部件的基板，例如磁盘，光盘，光磁盘，光掩模基板，光学透镜，光学镜，光学棱镜和半导体基板等记录盘基板，以及 类似。
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公开(公告)号：US08404009B2
公开(公告)日：2013-03-26
申请号：US12259904
申请日：2008-10-28
申请人： Masahiko Suzuki , Kenichi Suenaga , Makoto Suzuki
发明人： Masahiko Suzuki , Kenichi Suenaga , Makoto Suzuki
CPC分类号： C09K3/1463 , C09G1/02 , C09K3/1409
摘要： A polishing composition for a hard disk substrate includes alumina particles, silica particles, and water. The volume median diameter of secondary particles of the alumina particles measured by a laser beam diffraction method is 0.1 to 0.8 μm. The volume median diameter of primary particles of the silica particles measured by transmission electron microscope observation is 40 to 150 nm. The standard deviation in number-basis particle size of the primary particles of the silica particles measured by the transmission electron microscope observation is 11 to 35 nm. The polishing composition for a hard disk substrate can preferably reduce the embedding of alumina abrasive grains into the substrate without impairing the productivity.
摘要翻译： 用于硬盘基材的抛光组合物包括氧化铝颗粒，二氧化硅颗粒和水。 通过激光束衍射法测定的氧化铝粒子的二次粒子的体积中值粒径为0.1〜0.8μm。 通过透射电子显微镜观察测定的二氧化硅粒子的一次粒子的体积中值粒径为40〜150nm。 通过透射电子显微镜观察测定的二氧化硅粒子的一次粒子的基数粒径的标准偏差为11〜35nm。 用于硬盘基材的抛光组合物可以优选地减少氧化铝磨粒在基材中的嵌入，而不损害生产率。
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公开(公告)号：US20060112647A1
公开(公告)日：2006-06-01
申请号：US11288294
申请日：2005-11-29
申请人： Shigeo Fujii , Kenichi Suenaga
发明人： Shigeo Fujii , Kenichi Suenaga
IPC分类号： B24D11/00
CPC分类号： B24B37/042
摘要： The present invention provides a polishing composition containing an organic nitrogen-containing compound, an organic polybasic acid, an abrasive, and water, wherein the organic nitrogen-containing compound has in the molecule two or more amino groups, two or more imino groups, or one or more amino groups and one or more imino groups; a method for manufacturing a substrate with the polishing composition; and a method for reducing surface stains of a substrate with the polishing composition. The polishing composition can be suitably used, for example, in the manufacturing step for a substrate for a hard disk such as a memory hard disk.
摘要翻译： 本发明提供了含有机含氮化合物，有机多元酸，研磨剂和水的抛光组合物，其中有机含氮化合物在分子中具有两个或更多个氨基，两个或更多个亚氨基，或 一个或多个氨基和一个或多个亚氨基; 一种用抛光组合物制造衬底的方法; 以及用于减少抛光组合物的基材表面污渍的方法。 抛光组合物可以适用于例如存储硬盘等硬盘用基板的制造工序。
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公开(公告)号：US07780751B2
公开(公告)日：2010-08-24
申请号：US11642676
申请日：2006-12-21
申请人： Shigeo Fujii , Kenichi Suenaga
发明人： Shigeo Fujii , Kenichi Suenaga
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463 , G11B5/8404
摘要： The present invention preferably provides a polishing composition for a hard disk substrate, containing aluminum oxide particles and water, wherein secondary particles of the aluminum oxide particles have a volume-median particle size of from 0.1 to 0.7 μm, and particles having particle sizes of 1 μm or more of the aluminum oxide particles are contained in an amount of 0.2% by weight or less of the polishing composition; and a method for manufacturing a hard disk substrate using the polishing composition. By using the polishing composition and the method for manufacturing a substrate of the present invention, for example, a hard disk substrate suitable for high recording density can be provided in high productivity.
摘要翻译： 本发明优选提供一种含有氧化铝颗粒和水的硬盘基板用抛光组合物，其中氧化铝颗粒的二次颗粒的体积中值粒径为0.1〜0.7μm，粒径为1的颗粒 以上所述的抛光组合物的含量为0.2重量％以下的氧化铝粒子的μm以上， 以及使用该研磨用组合物的硬盘基板的制造方法。 通过使用本发明的研磨用组合物和基板的制造方法，例如可以高生产率提供适合于高记录密度的硬盘基板。
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公开(公告)号：US20070149097A1
公开(公告)日：2007-06-28
申请号：US11642676
申请日：2006-12-21
申请人： Shigeo Fujii , Kenichi Suenaga
发明人： Shigeo Fujii , Kenichi Suenaga
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463 , G11B5/8404
摘要： The present invention preferably provides a polishing composition for a hard disk substrate, containing aluminum oxide particles and water, wherein secondary particles of the aluminum oxide particles have a volume-median particle size of from 0.1 to 0.7 μm, and particles having particle sizes of 1 μm or more of the aluminum oxide particles are contained in an amount of 0.2% by weight or less of the polishing composition; and a method for manufacturing a hard disk substrate using the polishing composition. By using the polishing composition and the method for manufacturing a substrate of the present invention, for example, a hard disk substrate suitable for high recording density can be provided in high productivity.
摘要翻译： 本发明优选提供一种包含氧化铝颗粒和水的硬盘基板用抛光组合物，其中氧化铝颗粒的二次颗粒的体积中值粒径为0.1〜0.7μm，粒径为1μm的颗粒 所述氧化铝粒子的摩尔数以上述抛光组合物的0.2重量％以下， 以及使用该研磨用组合物的硬盘基板的制造方法。 通过使用本发明的研磨用组合物和基板的制造方法，例如可以高生产率提供适合于高记录密度的硬盘基板。
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公开(公告)号：US20090111359A1
公开(公告)日：2009-04-30
申请号：US12259904
申请日：2008-10-28
申请人： Masahiko SUZUKI , Kenichi Suenaga , Makoto Suzuki
发明人： Masahiko SUZUKI , Kenichi Suenaga , Makoto Suzuki
CPC分类号： C09K3/1463 , C09G1/02 , C09K3/1409
摘要： A polishing composition for a hard disk substrate includes alumina particles, silica particles, and water. The volume median diameter of secondary particles of the alumina particles measured by a laser beam diffraction method is 0.1 to 0.8 μm. The volume median diameter of primary particles of the silica particles measured by transmission electron microscope observation is 40 to 150 nm. The standard deviation in number-basis particle size of the primary particles of the silica particles measured by the transmission electron microscope observation is 11 to 35 nm. The polishing composition for a hard disk substrate can preferably reduce the embedding of alumina abrasive grains into the substrate without impairing the productivity.
摘要翻译： 用于硬盘基材的抛光组合物包括氧化铝颗粒，二氧化硅颗粒和水。 通过激光束衍射法测量的氧化铝颗粒的二次颗粒的体积中值直径为0.1至0.8μm。 通过透射电子显微镜观察测定的二氧化硅粒子的一次粒子的体积中值粒径为40〜150nm。 通过透射电子显微镜观察测定的二氧化硅粒子的一次粒子的基数粒径的标准偏差为11〜35nm。 用于硬盘基材的抛光组合物可以优选地减少氧化铝磨粒在基材中的嵌入，而不损害生产率。
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