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公开(公告)号：US07014534B2
公开(公告)日：2006-03-21
申请号：US10857841
申请日：2004-06-02
IPC分类号： B24B1/00
CPC分类号： C09K3/1463 , B24B37/044 , C09G1/02
摘要： A method for manufacturing a substrate, a polishing process for a substrate, a method of reducing microwaviness for a substrate, each including the step of polishing a substrate to be polished with a polishing composition containing an abrasive and water with a polishing pad of which surface member has an average pore size of from 1 to 35 μm; and a method of reducing scratches for a substrate, comprising the step of polishing a substrate to be polished with a polishing composition comprising an abrasive, an oxidizing agent, an acid, a salt thereof, or a mixture thereof and water, with a polishing pad of which surface member has an average pore size of from 1 to 35 μm. The method for manufacturing a substrate can be used for finish polishing of a memory hard disk or for polishing of a semiconductor element.
摘要翻译： 一种基板的制造方法，基板的研磨工序，降低基板的微波的方法，其特征在于，具备：研磨用抛光组合物研磨待研磨基板的步骤，所述抛光组合物的表面 成员的平均孔径为1至35μm; 以及减少基材划痕的方法，包括用抛光组合物抛光待抛光基材的步骤，抛光组合物包括研磨剂，氧化剂，酸，其盐或其混合物和水，抛光垫 其表面成员的平均孔径为1〜35μm。 用于制造基板的方法可以用于存储硬盘的精抛光或半导体元件的抛光。
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公开(公告)号：US07147682B2
公开(公告)日：2006-12-12
申请号：US10726581
申请日：2003-12-04
CPC分类号： C09K3/1463 , C09G1/02
摘要： A polishing composition for a substrate for memory hard disk comprising water and silica particles, wherein the silica particles have a particle size distribution in which the relationship of a particle size (R) and a cumulative volume frequency (V) in a graph of particle size-cumulative volume frequency obtained by plotting a cumulative volume frequency (%) of the silica particles counted from a small particle size side against a particle size (nm) of the silica particles satisfies the above formula (1) and the above formula (2), and wherein a particle size at 90% of a cumulative volume frequency (D90) is within the range of 65 nm or more and less than 105 nm. By using the polishing composition of the present invention, there can be efficiently manufactured an Ni—P plated substrate for a disk polished to have an excellent surface smoothness, in which the micropits are effectively reduced.
摘要翻译： 一种包含水和二氧化硅颗粒的用于存储硬盘的基底的抛光组合物，其中二氧化硅颗粒具有粒度分布，其中颗粒尺寸（R）和颗粒尺寸图中的累积体积频率（V）的关系 通过绘制从小粒径方向计数的二氧化硅粒子的累积体积频率（％）与二氧化硅粒子的粒径（nm）相对应的累积体积频率满足上述式（1）和上述式（2） ，其中累积体积频率（D90）的90％处的粒径在65nm以上且小于105nm的范围内。 通过使用本发明的抛光组合物，可以有效地制造用于盘抛光的Ni-P镀覆基板，以具有优异的表面平滑度，其中微型点被有效地减小。
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公开(公告)号：US06383991B1
公开(公告)日：2002-05-07
申请号：US09647592
申请日：2000-11-27
IPC分类号： C10M10508
CPC分类号： C10M107/34 , C10M125/26 , C10M169/04 , C10M2201/087 , C10M2201/10 , C10M2201/102 , C10M2201/105 , C10M2209/1033 , C10M2209/1045 , C10M2209/1055 , C10M2209/1065 , C10M2209/107 , C10M2209/1075 , C10M2209/1085 , C10M2209/1095 , C10M2215/042 , C10M2215/224 , C10N2240/401
摘要： The present invention relates to a cutting oil comprising (a) a polyether compound represented by the formula (I): R1O(EO)m(AO)nR2 (I) wherein each of R1 and R2, which may be identical or different, is hydrogen atom or a hydrocarbon group having 1 to 24 carbon atoms, at least one of which is a hydrocarbon group; EO is oxyethylene group; AO is an oxyalkylene group having 3 or 4 carbon atoms; and each of m and n is 1 to 50, wherein a sum of m and n is from 4 to 100; a cutting oil composition comprising the above cutting oil and an abrasive; a cutting method using the above cutting oil composition; and a process of cleaning a wafer, comprising the steps of cleaning a wafer obtainable by cutting an ingot with a wire saw using the above cutting oil composition; heating the resulting waste water to a temperature equal to or higher than a cloud point of a polyether compound represented by the formula (I) contained in the waste water, to allow separation into an oil phase and an aqueous phase; and removing the oil phase comprising the polyether compound from the waste water. According to the present invention, there can be obtained excellent dispersibility of the abrasive, and excellent re-dispersibility, cutting performance and workability when sedimented, and the object to be cut obtained after cutting can be easily cleaned.
摘要翻译： 本发明涉及一种切削油，其包含（a）由式（I）表示的聚醚化合物：其中可以相同或不同的R 1和R 2各自为氢原子或具有1至24个碳原子的烃基 ，其中至少一个是烃基; EO是氧乙烯基; AO是具有3或4个碳原子的氧化烯基团; m和n分别为1〜50，m和n的和为4〜100; 包含上述切削油和磨料的切削油组合物; 使用上述切削油组合物的切削方法; 以及清洁晶片的方法，包括以下步骤：使用上述切削油组合物清洁通过用线锯切割锭块可获得的晶片; 将得到的废水加热至与废水中所含的式（I）所示的聚醚化合物的浊点相同或更高的温度，使其分离成油相和水相。 并从废水中除去包含聚醚化合物的油相。 根据本发明，可以获得磨料的优异的分散性，并且当沉降时优异的再分散性，切割性能和可加工性，并且可以容易地清洁切割后获得的待切割物体。
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公开(公告)号：US20060030243A1
公开(公告)日：2006-02-09
申请号：US11184960
申请日：2005-07-20
申请人： Kazuhiko Nishimoto , Kouji Taira , Kenichi Suenaga , Yuichi Honma
发明人： Kazuhiko Nishimoto , Kouji Taira , Kenichi Suenaga , Yuichi Honma
CPC分类号： G11B5/8404 , B24B37/0056 , B24B37/044 , C09G1/02 , C09K3/1409 , C09K3/1463
摘要： A polishing composition containing an abrasive and water, wherein the polishing composition has a pH of from 0.1 to 7, and satisfies the following conditions: (1) that the number of polishing particles having sizes of 0.56 μm or more and less than 1 μm is 500,000 or less per 1 cm3 of the polishing composition; and (2) that the ratio of polishing particles having sizes of 1 μm or more is 0.001% by weight or less to the entire polishing particles in the polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, recording disk substrates, such as magnetic disks, optical disks, and opto-magnetic disks, photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.
摘要翻译： 1.一种抛光组合物，其含有研磨剂和水，其中，所述研磨用组合物的pH为0.1〜7，满足以下条件：（1）尺寸为0.56μm以上且小于1μm的研磨粒子数为 每抛光组合物1cm 3以上500,000以下; （2）研磨用组合物中的研磨粒子的整体的比例为1μm以上的研磨粒子的比例为0.001重量％以下。 抛光组合物适用于抛光用于精密部件的基板，例如磁盘，光盘，光磁盘，光掩模基板，光学透镜，光学镜，光学棱镜和半导体基板等记录盘基板，以及 类似。
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公开(公告)号：US20070145014A1
公开(公告)日：2007-06-28
申请号：US11642645
申请日：2006-12-21
摘要： The present invention provides a polishing composition for a glass substrate having a pH of from 0.5 to 5, containing a silica of which primary particles have an average particle size of from 5 to 50 nm and an acrylic acid/sulfonic acid copolymer having a weight-average molecular weight of from 1,000 to 5,000; and a method for manufacturing a glass substrate using the polishing composition. The polishing composition for a glass substrate can be suitably used, for example, in the manufacture of glass hard disks, aluminosilicate glass for reinforced glass substrates, glass ceramic substrates (crystallized glass substrates), synthetic quartz glass substrates (photomask substrates), and the like.
摘要翻译： 本发明提供一种pH为0.5〜5的玻璃基板用研磨用组合物，其含有一次粒子的平均粒径为5〜50nm的二氧化硅和具有重均分子量的丙烯酸/磺酸共聚物， 平均分子量为1,000至5,000; 以及使用该研磨用组合物的玻璃基板的制造方法。 用于玻璃基板的抛光组合物可以适用于例如制造玻璃硬盘，用于强化玻璃基板的铝硅酸盐玻璃，玻璃陶瓷基板（结晶玻璃基板），合成石英玻璃基板（光掩模基板））和 喜欢。
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公开(公告)号：US3948836A
公开(公告)日：1976-04-06
申请号：US458452
申请日：1974-04-05
IPC分类号： C10M169/04 , C08L1/00 , C08L7/00 , C08L15/02 , C08L21/00 , C08L23/00 , C08L23/26 , C08L23/28 , C08L27/00 , C08L91/00 , C08L91/06 , C08L101/00 , C10M111/06 , C10M169/00 , C10N20/00 , C10N20/04 , C10N30/06 , C10N40/20 , C10N40/24
CPC分类号： C10M7/00 , C10M2201/103 , C10M2205/14 , C10M2205/16 , C10M2205/17 , C10M2207/125 , C10M2207/129 , C10M2207/28 , C10M2207/282 , C10M2207/34 , C10M2211/06 , C10M2211/08 , C10M2213/02 , C10M2213/062 , C10M2223/04 , C10M2223/042 , C10N2210/00 , C10N2210/01 , C10N2210/02 , C10N2210/03 , C10N2210/04 , C10N2240/402 , C10N2240/403 , C10N2240/404 , C10N2240/405 , C10N2240/406 , C10N2240/407 , C10N2240/408 , C10N2240/409 , C10N2250/08 , C10N2250/10
摘要： A surface treatment composition for metal working which comprises 20 to 50 parts by weight of a mixture of a chlorine-containing thermoplastic synthetic resin or chlorine-containing rubber having a molecular weight of 8000 to 10000 and a chlorine-containing thermoplastic synthetic resin or chlorine-containing rubber having a molecular weight of 17000 to 19000, 2 to 15 parts by weight of a plasticizer and 2 to 20 parts by weight of a wax having 30 to 80 carbon atoms and melting at 60.degree. to 120.degree.C.
摘要翻译： 一种用于金属加工的表面处理组合物，其包含20至50重量份的含氯热塑性合成树脂或分子量为8000至10000的含氯橡胶和含氯热塑性合成树脂或氯 - 含有17000〜19000的分子量的橡胶，2〜15重量份的增塑剂和2〜20重量份的碳原子数为30〜80的蜡，熔点为60〜120℃。
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7.发明授权公开(公告)号：US09053736B2
公开(公告)日：2015-06-09
申请号：US13642410
申请日：2011-04-19
申请人： Haruhiko Doi , Yosuke Uchino , Kazuhiko Nishimoto
发明人： Haruhiko Doi , Yosuke Uchino , Kazuhiko Nishimoto
CPC分类号： G11B5/8404 , C09K3/1463
摘要： A method for manufacturing an aluminosilicate glass substrate for a hard disk of the present invention includes polishing an aluminosilicate glass substrate to be polished with a polishing composition that includes silica particles, a polymer having a sulfonic acid group, and water, wherein an adsorption constant of the polymer having the sulfonic acid group on aluminosilicate glass is 1.5 to 5.0 L/g. The polymer having the sulfonic acid group is preferably a polymer having an aromatic ring. The weight average molecular weight of the polymer having the sulfonic acid group is 3000 to 100000.
摘要翻译： 本发明的硬质硅铝酸盐玻璃基板的制造方法包括：研磨含有二氧化硅颗粒，具有磺酸基的聚合物和水的研磨用组合物进行研磨的铝硅酸盐玻璃基板，其中，吸附常数 在硅铝酸盐玻璃上具有磺酸基的聚合物为1.5〜5.0L / g。 具有磺酸基的聚合物优选为具有芳环的聚合物。 具有磺酸基的聚合物的重均分子量为3000〜100000。
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8.发明申请公开(公告)号：US20130032571A1
公开(公告)日：2013-02-07
申请号：US13642410
申请日：2011-04-19
申请人： Haruhiko Doi , Yosuke Uchino , Kazuhiko Nishimoto
发明人： Haruhiko Doi , Yosuke Uchino , Kazuhiko Nishimoto
CPC分类号： G11B5/8404 , C09K3/1463
摘要： A method for manufacturing an aluminosilicate glass substrate for a hard disk of the present invention includes polishing an aluminosilicate glass substrate to be polished with a polishing composition that includes silica particles, a polymer having a sulfonic acid group, and water, wherein an adsorption constant of the polymer having the sulfonic acid group on aluminosilicate glass is 1.5 to 5.0 L/g. The polymer having the sulfonic acid group is preferably a polymer having an aromatic ring. The weight average molecular weight of the polymer having the sulfonic acid group is 3000 to 100000.
摘要翻译： 本发明的硬质硅铝酸盐玻璃基板的制造方法包括：研磨含有二氧化硅颗粒，具有磺酸基的聚合物和水的研磨用组合物进行研磨的铝硅酸盐玻璃基板，其中，吸附常数 在硅铝酸盐玻璃上具有磺酸基的聚合物为1.5〜5.0L / g。 具有磺酸基的聚合物优选为具有芳环的聚合物。 具有磺酸基的聚合物的重均分子量为3000〜100000。
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公开(公告)号：US20080006057A1
公开(公告)日：2008-01-10
申请号：US11808738
申请日：2007-06-12
申请人： Kazuhiko Nishimoto , Toshiaki Oi
发明人： Kazuhiko Nishimoto , Toshiaki Oi
CPC分类号： C09G1/02
摘要： The present invention provides a polishing composition for a glass substrate having a pH of from 1 to 5 and containing silica particles having an average particle size of from 5 to 100 nm, wherein, in a projected image of the silica particles obtainable by an image analysis of electron photomicrographs, an average of an area ratio R of a projected area of the silica particles (A1) to an area of a maximum inscribed circle of the silica particles (A), i.e. (A1/A), is in the range of from 1.2 to 3.0, and the silica particles have an average of 2.0 to 10 projection portions having a curvature radius of from ⅕ to ½ of a radius of the maximum inscribed circle of the silica particles (r) on the outline of the silica particles in the projected image, and a method for manufacturing a glass substrate, including the step of polishing a substrate to be polished with a polishing load of from 3 to 12 kPa and at a pH of from 1 to 5 while allowing the polishing composition to be present between a polishing pad and the substrate to be polished. The polishing composition for a glass substrate of the present invention can be suitably used, for example, in the manufacture of glass hard disks, aluminosilicate glass for reinforced glass substrates, glass ceramic substrates (crystallized glass substrates), and the like.
摘要翻译： 本发明提供一种pH为1〜5的玻璃基板用的研磨用组合物，其含有平均粒径为5〜100nm的二氧化硅粒子，其中，在通过图像分析得到的二氧化硅粒子的投影图像中， 的电子显微照片，二氧化硅粒子（A1）的投影面积与二氧化硅粒子（A）的最大内接圆面积的平均面积比R（即（A1 / A））在 1.2〜3.0，二氧化硅粒子的二氧化硅粒子（r）的最大内切圆的半径的曲率半径为二分之一的1/10至1/2的平均值为2.0〜10个， 投影图像中的粒子，以及玻璃基板的制造方法，其特征在于，包括以3〜12kPa的抛光负荷和1〜5的pH值抛光抛光用基板的工序， 在ap之间存在 衬垫和待抛光的基材。 本发明的玻璃基板用抛光组合物可以适用于例如制造玻璃硬盘，强化玻璃基板用硅铝酸盐玻璃，玻璃陶瓷基板（结晶玻璃基板）等。
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公开(公告)号：US07972398B2
公开(公告)日：2011-07-05
申请号：US11808738
申请日：2007-06-12
申请人： Kazuhiko Nishimoto , Toshiaki Oi
发明人： Kazuhiko Nishimoto , Toshiaki Oi
CPC分类号： C09G1/02
摘要： The present invention provides a polishing composition for a glass substrate having a pH of from 1 to 5 and containing silica particles having an average particle size of from 5 to 100 nm, wherein, in a projected image of the silica particles obtainable by an image analysis of electron photomicrographs, an average of an area ratio R of a projected area of the silica particles (A1) to an area of a maximum inscribed circle of the silica particles (A), i.e. (A1/A), is in the range of from 1.2 to 3.0, and the silica particles have an average of 2.0 to 10 projection portions having a curvature radius of from ⅕ to ½ of a radius of the maximum inscribed circle of the silica particles (r) on the outline of the silica particles in the projected image, and a method for manufacturing a glass substrate, including the step of polishing a substrate to be polished with a polishing load of from 3 to 12 kPa and at a pH of from 1 to 5 while allowing the polishing composition to be present between a polishing pad and the substrate to be polished. The polishing composition for a glass substrate of the present invention can be suitably used, for example, in the manufacture of glass hard disks, aluminosilicate glass for reinforced glass substrates, glass ceramic substrates (crystallized glass substrates), and the like.
摘要翻译： 本发明提供一种pH为1〜5的玻璃基板用的研磨用组合物，其含有平均粒径为5〜100nm的二氧化硅粒子，其中，在通过图像分析得到的二氧化硅粒子的投影图像中， 的电子显微照片，二氧化硅粒子（A1）的投影面积与二氧化硅粒子（A）的最大内接圆面积的平均面积比R（即（A1 / A））在 1.2至3.0，二氧化硅颗粒平均具有2.0至10个凸起部分，其具有二氧化硅颗粒（r）的二氧化硅颗粒（r）的最大内接圆的半径的半径为⅕至1/2的二氧化硅颗粒轮廓的半径 投影图像和玻璃基板的制造方法，包括以3〜12kPa的抛光负荷和1〜5的pH值抛光抛光用基板的步骤，同时使抛光组合物存在 在ap之间 衬垫和待抛光的基材。 本发明的玻璃基板用抛光组合物可以适用于例如制造玻璃硬盘，强化玻璃基板用硅铝酸盐玻璃，玻璃陶瓷基板（结晶玻璃基板）等。
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