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公开(公告)号：US07464591B2
公开(公告)日：2008-12-16
申请号：US11579178
申请日：2006-01-20
申请人： Yoshihisa Fukuda , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo , Ryosuke Meshii , Takashi Yajima
发明人： Yoshihisa Fukuda , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo , Ryosuke Meshii , Takashi Yajima
CPC分类号： G01P15/08 , G01P2015/0871
摘要： A semiconductor acceleration sensor having beam parts formed in substantially L-shape to surround a weight part, wherein formed to surround a square part, as seen in plan view and constituting the weight part, are two elongated L-shaped beam parts, at locations close to proximal end portions of which are formed protruding portions protruding from a fixed part toward the weight part, and receiving recessed portions protruding from the weight part toward the fixed part to surround the protruding portions. The protruding portions have an outer shape substantially the same as an inner wall surface of the receiving recessed portions so that movements of the weight part in any directions in a horizontal direction perpendicular to an up and down direction are limited as a result of reception of the protruding portions by the receiving recessed portions. Thus, even when a side impact is applied to the acceleration sensor, the weight part is prevented from moving significantly, thereby preventing an excessive stress from being applied to the beam parts to break the beam parts.
摘要翻译： 一种半导体加速度传感器，其具有形成为大致L形以包围重量部分的梁部分，其中形成为包围正方形部分，如在平面图中看到并构成重量部分的两个细长L形梁部分，在靠近的位置 其基端部形成有从固定部朝向配重部突出的突出部，并且容纳从重物部朝向固定部突出以包围突出部的凹部。 突出部具有与容纳凹部的内壁面大致相同的外形，使得重量部在与上下方向垂直的水平方向上的任何方向上的移动受到限制 突出部分由接收凹部。 因此，即使当对加速度传感器施加侧面冲击时，防止重量部分显着移动，从而防止过大的应力施加到梁部分以破坏梁部分。
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公开(公告)号：US20080022770A1
公开(公告)日：2008-01-31
申请号：US11579178
申请日：2006-01-20
申请人： Yoshihisa Fukuda , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo , Ryosuke Meshii , Takashi Yajima
发明人： Yoshihisa Fukuda , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo , Ryosuke Meshii , Takashi Yajima
IPC分类号： G01P15/02
CPC分类号： G01P15/08 , G01P2015/0871
摘要： A semiconductor acceleration sensor having beam parts formed in substantially L-shape to surround a weight part, wherein formed to surround a square part, as seen in plan view and constituting the weight part, are two elongated L-shaped beam parts, at locations close to proximal end portions of which are formed protruding portions protruding from a fixed part toward the weight part, and receiving recessed portions protruding from the weight part toward the fixed part to surround the protruding portions. The protruding portions have an outer shape substantially the same as an inner wall surface of the receiving recessed portions so that movements of the weight part in any directions in a horizontal direction perpendicular to an up and down direction are limited as a result of reception of the protruding portions by the receiving recessed portions. Thus, even when a side impact is applied to the acceleration sensor, the weight part is prevented from moving significantly, thereby preventing an excessive stress from being applied to the beam parts to break the beam parts.
摘要翻译： 一种半导体加速度传感器，其具有形成为大致L形以包围重量部分的梁部分，其中形成为包围正方形部分，如在平面图中看到并构成重量部分的两个细长L形梁部分，在靠近的位置 其基端部形成有从固定部朝向配重部突出的突出部，并且容纳从重物部朝向固定部突出以包围突出部的凹部。 突出部具有与容纳凹部的内壁面大致相同的外形，使得重量部在与上下方向垂直的水平方向上的任何方向上的移动受到限制 突出部分由接收凹部。 因此，即使当对加速度传感器施加侧面冲击时，防止重量部分显着移动，从而防止过大的应力施加到梁部分以破坏梁部分。
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3.发明授权公开(公告)号：US07799595B2
公开(公告)日：2010-09-21
申请号：US10599396
申请日：2005-12-12
申请人： Ryosuke Meshii , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo
发明人： Ryosuke Meshii , Kouji Sakai , Atsushi Ishigami , Eiichi Furukubo
CPC分类号： G01L9/0042 , G01L1/14
摘要： In a semiconductor physical quantity sensor of electrostatic capacitance type, mutually facing peripheral areas (bonding areas) of a glass substrate and a silicon substrate are contacted for anodic bonding, while at the same time, both substrates have an anodic bonding voltage applied therebetween so as to be integrated. A fixed electrode is formed on a bonding face-side surface of the silicon substrate, while a movable electrode is formed on a bonding face-side surface of the semiconductor substrate. An equipotential wiring, which short-circuits the fixed electrode to the movable electrode as a countermeasure to discharge in anodic bonding, is formed on the bonding face-side surface of the glass substrate inside the bonding area before the anodic bonding. After the anodic bonding, the equipotential wiring is cut and removed. By manufacturing the sensor in this manner, the fixed electrode of the insulating substrate is made equipotential to the movable electrode of the semiconductor substrate when the insulating substrate is anodically bonded to the semiconductor substrate, thereby preventing discharge from occurring. Accordingly, it is possible to obtain a high bonding strength and desired sensor characteristics without causing bonding voids to occur and a sensor chip to increase in size.
摘要翻译： 在静电电容型的半导体物理量传感器中，与玻璃基板和硅基板的相互面对的周边区域（接合区域）接触进行阳极接合，同时两基板之间具有阳极接合电压， 被整合。 在硅衬底的接合面侧表面上形成固定电极，而在半导体衬底的接合面侧表面形成可动电极。 在阳极接合之前的接合区域内的玻璃基板的接合面侧面上形成有将固定电极短路到可动电极的等电位线作为阳极接合放电的对策。 阳极接合后，等电位线被切断并移除。 通过以这种方式制造传感器，当绝缘基板被阳极结合到半导体基板上时，使绝缘基板的固定电极与半导体基板的可动电极等电位，从而防止发生放电。 因此，可以获得高的接合强度和期望的传感器特性，而不会发生接合空隙和传感器芯片的尺寸增大。
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4.发明申请公开(公告)号：US20070176249A1
公开(公告)日：2007-08-02
申请号：US10599396
申请日：2005-12-12
申请人： Ryosuke Meshii , Kouji Sakai , Atsushi Ishigami , Eichi Furukubo
发明人： Ryosuke Meshii , Kouji Sakai , Atsushi Ishigami , Eichi Furukubo
CPC分类号： G01L9/0042 , G01L1/14
摘要： In a semiconductor physical quantity sensor of electrostatic capacitance type, mutually facing peripheral areas (bonding areas) of a glass substrate and a silicon substrate are contacted for anodic bonding, while at the same time, both substrates have an anodic bonding voltage applied therebetween so as to be integrated. A fixed electrode is formed on a bonding face-side surface of the silicon substrate, while a movable electrode is formed on a bonding face-side surface of the semiconductor substrate. An equipotential wiring, which short-circuits the fixed electrode to the movable electrode as a countermeasure to discharge in anodic bonding, is formed on the bonding face-side surface of the glass substrate inside the bonding area before the anodic bonding. After the anodic bonding, the equipotential wiring is cut and removed. By manufacturing the sensor in this manner, the fixed electrode of the insulating substrate is made equipotential to the movable electrode of the semiconductor substrate when the insulating substrate is anodically bonded to the semiconductor substrate, thereby preventing discharge from occurring. Accordingly, it is possible to obtain a high bonding strength and desired sensor characteristics without causing bonding voids to occur and a sensor chip to increase in size.
摘要翻译： 在静电电容型的半导体物理量传感器中，与玻璃基板和硅基板的相互面对的周边区域（接合区域）接触进行阳极接合，同时两基板之间具有阳极接合电压， 被整合。 在硅衬底的接合面侧表面上形成固定电极，而在半导体衬底的接合面侧表面形成可动电极。 在阳极接合之前的接合区域内的玻璃基板的接合面侧面上形成有将固定电极短路到可动电极的等电位线作为阳极接合放电的对策。 阳极接合后，等电位线被切断并移除。 通过以这种方式制造传感器，当绝缘基板被阳极结合到半导体基板上时，使绝缘基板的固定电极与半导体基板的可动电极等电位，从而防止发生放电。 因此，可以获得高的接合强度和期望的传感器特性，而不会发生接合空隙和传感器芯片的尺寸增大。
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公开(公告)号：US07243561B2
公开(公告)日：2007-07-17
申请号：US10531074
申请日：2004-08-26
申请人： Atsushi Ishigami , Kouji Sakai , Ryosuke Meshii
发明人： Atsushi Ishigami , Kouji Sakai , Ryosuke Meshii
CPC分类号： B60C23/0408 , G01L19/0084 , G01L19/0092 , G01L19/141 , G01L19/148 , G01P1/023 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor unit includes a pressure sensor, an acceleration sensor and a signal-processing circuit, which are disposed on the bottom surface of a lead to form a line in the longitudinal direction of the sensor unit. The pressure sensor and the acceleration sensor are disposed at respective symmetrical positions with respect to the center of the signal-processing circuit in the longitudinal direction of the sensor unit. Each of the pressure sensor and the acceleration sensor has substantially the same height dimension. The sensors, the signal-processing circuit and the lead are sealed with a molded body, in such a manner as to allow lead terminals of the lead to protrude outside the molded body. The signal-processing circuit is operable, based on a signal from the acceleration sensor, to control the ON/OFF action of the pressure sensor.
摘要翻译： 传感器单元包括压力传感器，加速度传感器和信号处理电路，它们设置在引线的底表面上，以在传感器单元的纵向上形成一条线。 压力传感器和加速度传感器相对于传感器单元的纵向方向上的信号处理电路的中心设置在相应的对称位置。 压力传感器和加速度传感器中的每一个具有基本相同的高度尺寸。 传感器，信号处理电路和引线用成型体密封，使得引线的引线端子突出到模制体的外部。 信号处理电路基于来自加速度传感器的信号来操作以控制压力传感器的ON / OFF动作。
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公开(公告)号：US20060053908A1
公开(公告)日：2006-03-16
申请号：US10531074
申请日：2004-08-26
申请人： Atsushi Ishigami , Kouji Sakai , Ryosuke Meshii
发明人： Atsushi Ishigami , Kouji Sakai , Ryosuke Meshii
CPC分类号： B60C23/0408 , G01L19/0084 , G01L19/0092 , G01L19/141 , G01L19/148 , G01P1/023 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor unit includes a pressure sensor, an acceleration sensor and a signal-processing circuit, which are disposed on the bottom surface of a lead to form a line in the longitudinal direction of the sensor unit. The pressure sensor and the acceleration sensor are disposed at respective symmetrical positions with respect to the center of the signal-processing circuit in the longitudinal direction of the sensor unit. Each of the pressure sensor and the acceleration sensor has substantially the same height dimension. The sensors, the signal-processing circuit and the lead are sealed with a molded body, in such a manner as to allow lead terminals of the lead to protrude outside the molded body. The signal-processing circuit is operable, based on a signal from the acceleration sensor, to control the ON/OFF action of the pressure sensor.
摘要翻译： 传感器单元包括压力传感器，加速度传感器和信号处理电路，它们设置在引线的底表面上，以在传感器单元的纵向上形成一条线。 压力传感器和加速度传感器相对于传感器单元的纵向方向上的信号处理电路的中心设置在相应的对称位置。 压力传感器和加速度传感器中的每一个具有基本相同的高度尺寸。 传感器，信号处理电路和引线用成型体密封，使得引线的引线端子突出到模制体的外部。 信号处理电路基于来自加速度传感器的信号来操作以控制压力传感器的ON / OFF动作。
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公开(公告)号：US08781701B2
公开(公告)日：2014-07-15
申请号：US12075914
申请日：2008-03-14
申请人： Yasushi Aoki , Jiro Suzuki , Kouji Sakai
发明人： Yasushi Aoki , Jiro Suzuki , Kouji Sakai
CPC分类号： B60T1/10 , B60K6/48 , B60T8/3655 , B60T8/4827 , B60T8/4872 , B60T13/686 , B60W10/184 , B60W30/18127 , Y02T10/6221
摘要： In a vehicular brake-by-wire braking system, during a four wheel simultaneous control mode when regeneration cooperative braking is implemented, a pair of electromagnetic isolation control valves and one of normally closed electromagnetic pressure relief valves corresponding to regeneration side left and right wheel brakes and normally closed electromagnetic pressure relief valves corresponding to non-regeneration side left and right wheel brakes are caused to operate to open and close, while the other of the normally closed electromagnetic pressure relief valves corresponding to the regeneration side left and right wheel brakes and the normally closed electromagnetic pressure relief valves corresponding to the non-regeneration side left and right wheel brakes are put in de-energized states in which the valves concerned are kept closed, and all normally open electromagnetic pressure supply valves are put in de-energized states in which the valves concerned are kept opened.
摘要翻译： 在车辆制动马达制动系统中，在实施再生合作制动时的四轮同时控制模式中，一对电磁隔离控制阀和与再生侧左右轮制动器对应的常闭电磁泄压阀之一 对应于非再生侧左右两轮制动器的常闭电磁泄压阀进行操作打开和关闭，而另一个常闭电磁泄压阀对应于再生侧左右轮制动器和 对应于非再生侧左右制动器的常闭电磁泄压阀处于关闭阀门的断电状态，所有常开电磁供压阀均处于断电状态 这些阀门保持打开。
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公开(公告)号：US20090256506A1
公开(公告)日：2009-10-15
申请号：US12385632
申请日：2009-04-14
申请人： Kouji Sakai
发明人： Kouji Sakai
IPC分类号： H02P6/14
摘要： Switching elements are driven by a control signal outputted from a control circuit, so that a rotating magnetic field is generated from a stator coil to rotate a rotor of a synchronous electric motor. The control signal is generated through use of a selected modulation scheme, which is selected from a plurality of modulation schemes. The control circuit determines which one of the modulation schemes is used as the selected modulation scheme based on a sensed voltage value of a voltage sensor, which senses an output voltage of a power supply device.
摘要翻译： 开关元件由从控制电路输出的控制信号驱动，使得从定子线圈产生旋转磁场，使同步电动机的转子旋转。 通过使用从多个调制方案中选择的选择的调制方案来生成控制信号。 控制电路基于感测电力供应装置的输出电压的电压传感器的感测电压值，确定使用哪个调制方案作为所选择的调制方案。
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公开(公告)号：US20080135362A1
公开(公告)日：2008-06-12
申请号：US11951931
申请日：2007-12-06
申请人： Kouji Sakai , Takashi Kawai , Naoki Onda
发明人： Kouji Sakai , Takashi Kawai , Naoki Onda
IPC分类号： F16F9/10
CPC分类号： F16F9/3235 , F16F7/01 , F16F9/006 , F16F9/063 , F16F9/53
摘要： A shock absorber includes a cylinder tube, a piston fitted slidably in an axial direction in the cylinder tube and arranged to divide an inside of the cylinder tube into first and second fluid chambers, a piston rod extending from the piston to an outside of the cylinder tube, and damping force generation sections arranged to generate a damping force by making hydraulic fluid flow between the first and the second fluid chambers. Cavities are formed in at least one of the cylinder tube and the piston rod. Flowable matter having a rheological characteristic is sealed in the cavities.
摘要翻译： 减震器包括：缸筒，活塞，其沿轴向可滑动地安装在缸筒中，并且布置成将缸筒的内部分成第一和第二流体室;活塞杆，其从活塞延伸到缸的外部 管和阻尼力产生部分，其布置成通过使液压流体在第一和第二流体室之间流动而产生阻尼力。 气缸管和活塞杆中的至少一个形成腔。 具有流变特性的流动物质密封在空腔中。
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公开(公告)号：US20050087411A1
公开(公告)日：2005-04-28
申请号：US10979511
申请日：2004-11-02
申请人： Kouji Sakai
发明人： Kouji Sakai
IPC分类号： B60G17/033 , B60G21/06 , F16F9/06 , F16F9/24
CPC分类号： F16F9/06 , B60G17/033 , B60G21/06
摘要： A vehicle is carried by a number of supporting members, such as wheels. Movement between the supporting members and the vehicle body is controlled by respective dampers. Several interrelationships between and among the dampers are disclosed. A flow regulator is provided to augment damping forces under a variety of operating conditions.
摘要翻译： 车辆由许多支撑构件（例如车轮）承载。 支撑构件和车体之间的移动由相应的阻尼器控制。 公布了阻尼器之间和之间的几个相互关系。 提供流量调节器以在各种操作条件下增加阻尼力。
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