摘要:
The invention is directed to performing electronic component mounting operations by the suction nozzles of the mounting heads in each of the plurality of the rotary tables independently, moving each of the positioning tables for positioning a printed board in a component mounting position independently, and performing the electronic component mounting operation on the plurality of the printed boards independently. A component feeding device moves a plurality of component feeding tables having a plurality of component feeding units in an arraying direction thereof respectively and independently. Mounting heads having a plurality of suction nozzles for picking up electronic components from the component feeding devices respectively are provided at predetermined intervals corresponding to intermittent pitches on an outer circumference of two rotary tables intermittently rotating. Therefore, the suction nozzle of the mounting head of each of the rotary tables picks up the electronic component fed to a component pickup position in each of the component feeding units set on each of the component feeding tables, and mounts the component on the printed board on the corresponding XY table.
摘要:
Technology is provided for changing a mounting angle of a component to reduce the amount of relative displacement between a mounting head and a board. A component, for which a mounting angle can be changed, is specified based on information stored in a mounting data storage area and a component data storage area according to a predetermined component mounting order. A mounting time in a mounting path with the mounting angle of the specified component being changed is calculated for each mounting angle to specify the mounting path requiring the shortest mounting time.
摘要:
Technology is provided for changing a mounting angle of a component to reduce the amount of relative displacement between a mounting head and a board. A component, for which a mounting angle can be changed, is specified based on information stored in a mounting data storage area and a component data storage area according to a predetermined component mounting order. A mounting time in a mounting path with the mounting angle of the specified component being changed is calculated for each mounting angle to specify the mounting path requiring the shortest mounting time.
摘要:
The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.
摘要:
A word processor including a screen display unit for displaying characters, etc. on a screen, a key input unit for inputting the characters, etc., a print unit for printing document data of documents, a document producing unit for producing the documents from data inputted from the key input unit, and a document control unit for inputting document control data to a recording medium or outputting data stored in the recording medium to the screen display unit. The key input unit includes a command device for giving a command relevant to automatic production of a title of an untitled document, and the document control means includes a title producing device for automatically producing the title of the untitled document in response to the command from the command device.
摘要:
The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.
摘要:
The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.
摘要:
The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.
摘要:
The present invention is directed to a technique that avoids occurrence of interference among multiple placement heads, when multiple placement heads simultaneously access a circuit board, and a pallet which is arranged in one direction with respect to the circuit board. When the component placement part 150 having the multiple placement heads simultaneously pick up the components from the pallet 160 and simultaneously place the components on the circuit board, the controller 140 specifies a pair of component groups to be picked up simultaneously from the pallet 160 by the multiple placement heads and places the components on the circuit board, so that an area where the multiple placement heads move in overlapping manner is minimized, and the placement heads respectively pick up the components included in the pair of component groups being specified and place the components on the circuit board.
摘要:
Method for treating golf ball surface which is made of balta resin, thermoplastic elastomer, ionomer resin or the like to unpolymerizable gas plasma and then applying usual coating in an apparatus adapted to expose the all over surface of the ball to said plasma. Owing to this treatment, exfoliation of the ball coating can unexpectedly sufficiently be prevented.