-
公开(公告)号：US5550185A
公开(公告)日：1996-08-27
申请号：US240530
申请日：1994-05-10
摘要： The silicone rubber composition of the present invention comprises (A) an organopolysiloxane obtained by mixing and heating an organopolysiloxane having a silanol group at both ends of the molecular chain and a silane or a siloxane having two hydrolyzable groups in the molecule, (B) a finely divided silica, and (C) a curing agent. The composition, wherein the content of low-molecule siloxanes is remarkably constrained, is quite useful in the application wherein low-molecular siloxanes are obnoxious, for example, in the application of electrical contacts and parts used adjacent thereto, roll materials of copying machines, gaskets for construction, etc.
摘要翻译： 本发明的硅橡胶组合物包含（A）通过混合并加热分子链两端具有硅烷醇基的有机聚硅氧烷和分子中具有两个可水解基团的硅烷或硅氧烷获得的有机聚硅氧烷，（B） 细分二氧化硅，（C）固化剂。 其中低分子硅氧烷的含量被显着约束的组合物在其中低分子硅氧烷是恶劣的应用中是非常有用的，例如在应用电触点和与其相邻使用的部件，复印机的卷材， 建筑垫片等
-
公开(公告)号：US5502146A
公开(公告)日：1996-03-26
申请号：US298860
申请日：1994-08-31
CPC分类号： C08L83/04 , C08G77/06 , C08G77/045 , C08G77/16 , C08G77/26
摘要： A method of producing a silicone rubber composition, comprising heating a mixture of an organopolysiloxane having a silanol group at both the ends of the molecular chain, a end blocking agent, such as a triorganosilanol, a silane or a siloxane having two dialkylaminosilyl groups in the molecule, and a reinforcing filler thereby carrying out chain lengthening and end blocking of said organopolysiloxane. According to this method, a silicone rubber composition whose low-molecular siloxane content is held down remarkably can be produced without consuming a large amount of energy for the mixing.
摘要翻译： 一种硅橡胶组合物的制造方法，其特征在于，在所述分子链的两端加入具有硅烷醇基的有机聚硅氧烷，三有机硅烷醇等封端剂，硅烷或具有二烷基氨基甲硅烷基的硅氧烷的混合物 分子和增强填料，从而进行所述有机聚硅氧烷的链延长和端部封闭。 根据该方法，可以制造低分子量硅氧烷含量显着降低的硅橡胶组合物，而不会消耗大量的用于混合的能量。
-
3.发明授权
公开(公告)号：US5449735A
公开(公告)日：1995-09-12
申请号：US240886
申请日：1994-05-11
摘要： Organopolysiloxanes having a silanol group at both terminal ends of molecular chain thereof are brought into condensation reaction with each other in the presence of a silane or siloxane having at least two dialkylaminosilyl groups per molecule as a condensation catalyst and a triorganosilanol or other endblocking agent, to lengthen the chain of the organopolysiloxane under reaction, whereby a triorganosilyl-endblocked organopolysiloxane with a high polymerization degree is obtained. The process yields a triorganosilyl-endblocked high-polymerization-degree organopolysiloxane while effectively suppressing or preventing the formation of low-molecular-weight siloxanes.
摘要翻译： 在其分子链的两个末端具有硅烷醇基团的有机聚硅氧烷在每分子具有至少两个二烷基氨基甲硅烷基的硅烷或硅氧烷作为缩合催化剂和三有机硅烷醇或其它封端剂的存在下进行缩合反应， 在反应中延长有机聚硅氧烷的链，得到具有高聚合度的三有机甲硅烷基封端的有机聚硅氧烷。 该方法产生三有机甲硅烷基封端的高聚合度有机聚硅氧烷，同时有效抑制或防止低分子量硅氧烷的形成。
-
公开(公告)号：US5468830A
公开(公告)日：1995-11-21
申请号：US189333
申请日：1994-01-31
申请人： Yoshio Inoue , Susumu Sekiguchi , Minoru Igarashi
发明人： Yoshio Inoue , Susumu Sekiguchi , Minoru Igarashi
CPC分类号： C08G77/06 , C08L83/04 , C08G77/045 , C08G77/16 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/70
摘要： A siloxane gum is prepared by adding a silane or siloxane having two hydrolyzable groups in a molecule to a silanol-terminated organopolysiloxane in such an amount to give a molar ratio of silanol group/hydrolyzable group of from 0.5 to 3 and effecting condensation polymerization. The resulting organopoly-siloxane has a degree of polymerization of higher than 1,000 and a minimized content of low-molecular weight cyclic siloxanes of less than 5,000 ppm.
摘要翻译： 通过将分子中具有两个可水解基团的硅烷或硅氧烷加入到硅烷醇封端的有机聚硅氧烷中，使得硅烷醇基/可水解基团的摩尔比为0.5至3并进行缩聚制备硅氧烷胶。 得到的有机聚硅氧烷的聚合度高于1,000，低分子量环状硅氧烷的含量最小值低于5,000ppm。
-
公开(公告)号：US5449714A
公开(公告)日：1995-09-12
申请号：US159164
申请日：1993-11-30
摘要： A conductive silicone rubber composition is prepared by mixing an organopolysiloxane having an aminoalkyl radical, an organopolysiloxane having a (meth)acryloxyalkyl or glycidoxyalkyl radical, and conductive carbon black to form silicone rubber composition (A) in which the carbon black is fixed, and then mixing it with a silicone rubber composition (B) comprising a dimethylpolysiloxane. The composition has stable resistivity in the semiconductive region independent of molding conditions.
摘要翻译： 通过混合具有氨基烷基的有机聚硅氧烷，具有（甲基）丙烯酰氧基烷基或缩水甘油氧基烷基的有机聚硅氧烷和导电性炭黑，形成其中固定有碳黑的硅橡胶组合物（A），制备导电硅橡胶组合物，然后 将其与包含二甲基聚硅氧烷的硅橡胶组合物（B）混合。 组合物在半导体区域中具有稳定的电阻率，与成型条件无关。
-
公开(公告)号：US08044121B2
公开(公告)日：2011-10-25
申请号：US12145984
申请日：2008-06-25
申请人： Hiroshi Mogi , Susumu Sekiguchi , Thomas Tupa
发明人： Hiroshi Mogi , Susumu Sekiguchi , Thomas Tupa
IPC分类号： C08L83/05
摘要： A cement mold-making silicone rubber composition is provided comprising (A) 100 parts by weight of a polyorganosiloxane having at least two silicon-bonded monovalent aliphatic unsaturated hydrocarbon groups in a molecule, (B) a polyorganohydrogensiloxane having at least three silicon-bonded hydrogen atoms in a molecule, in such an amount as to provide 0.1-5 silicon-bonded hydrogen atoms per monovalent aliphatic unsaturated hydrocarbon group in component (A), (C) a platinum base compound in such an amount as to provide 1-100 ppm of platinum atoms based on the weight of component (A), (D) 5-60 parts by weight of finely divided silica having a specific surface area of at least 50 m2/g, and (E) 0.1-100 parts by weight of coal ash and/or pozzolan powder.
摘要翻译： 提供一种水泥制模硅橡胶组合物，其包含（A）100重量份的在分子中具有至少两个与硅键合的一价脂族不饱和烃基的聚有机硅氧烷，（B）具有至少三个与硅键合的氢的聚有机氢硅氧烷 分子中的原子，其量使得组分（A）中的每一个脂族不饱和烃基提供0.1-5个硅键合的氢原子，（C）铂基化合物，其量可提供1-100ppm 的铂原子，基于组分（A）的重量，（D）5-60重量份比表面积为至少50m 2 / g的细碎二氧化硅，和（E）0.1-100重量份的 煤灰和/或火山灰粉末。
-
公开(公告)号：US20060281875A1
公开(公告)日：2006-12-14
申请号：US11441138
申请日：2006-05-26
申请人： Takao Uno , Kenichi Takita , Susumu Sekiguchi
发明人： Takao Uno , Kenichi Takita , Susumu Sekiguchi
CPC分类号： C08L83/08 , Y10T428/31663 , C08L83/00 , C08L2666/28 , C08L2666/54
摘要： A fluorosilicone rubber composition is provided comprising (A) a first organopolysiloxane having the formula: R1aR2bR3cSiO(4-a-b-c)/2 wherein R1 is trifluoropropyl, R2 is an aliphatic unsaturated hydrocarbon group, R3 is an aliphatic saturated hydrocarbon or aromatic hydrocarbon group, (B) a silica filler, (C) a second organopolysiloxane having formula (2) wherein R4 is an aliphatic unsaturated hydrocarbon group or the like, and (D) a cure catalyst. The fluorosilicone rubber composition affords satisfactory adhesion at the interface with dimethylsilicone rubber even when the molding pressure is low.
摘要翻译： 提供了氟硅橡胶组合物，其包含（A）具有下式的第一有机聚硅氧烷：R 1， （4-abc）/ 2其中R 1是三氟丙基，R 1，R 2，R 3， 2是脂族不饱和烃基，R 3是脂族饱和烃或芳族烃基，（B）二氧化硅填料，（C）具有式（2）的第二有机聚硅氧烷，其中 R 4是脂肪族不饱和烃基等，（D）固化催化剂。 即使成型压力低，氟硅酮橡胶组合物在与二甲基硅酮橡胶的界面上也具有令人满意的粘合性。
-
公开(公告)号：US6162854A
公开(公告)日：2000-12-19
申请号：US31691
申请日：1998-02-27
IPC分类号： C08K3/22 , C08F130/08 , C08F283/12 , C08F290/06 , C08K5/5419 , C08L51/08 , C08L83/04 , C08L83/05 , C08L83/07 , H01B3/46 , C08K5/24
CPC分类号： C08K5/5419 , C08F130/08 , C08F283/12 , C08F290/068 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08K2003/2227 , C08L51/085 , C08L83/04 , C08L83/00 , C08L2666/54 , C08L2666/34
摘要： A silicone rubber composition contains (A) 100 parts by weight of an organopolysiloxane composition of the organic peroxide or addition reaction curing type, (B) 20-400 parts by weight of aluminum hydroxide, and (C) 1-20 parts by weight of an organopolysiloxane of formula (I): R.sup.1.sub.a (OX).sub.b SiO.sub.(4-a-b)/2 wherein R.sup.1 is a monovalent hydrocarbon group, at least 10 mol % of the R.sup.1 groups being phenyl, X is hydrogen or a monovalent hydrocarbon group, a and b are positive numbers satisfying the range: 1.0.ltoreq.a
摘要翻译： 硅橡胶组合物含有（A）100重量份的有机过氧化物或加成反应固化型的有机基聚硅氧烷组合物，（B）20-400重量份的氢氧化铝，和（C）1-20重量份的 式（I）的有机聚硅氧烷：R1a（OX）bSiO（4-ab）/ 2其中R1是一价烃基，R 1基团的至少10摩尔％为苯基，X为氢或一价烃基， 和b是满足以下范围的正数：1.0
-
9.发明授权Silicone rubber compositions for high-voltage electrical insulators and polymer insulators 失效用于高压绝缘子和聚合物绝缘子的硅橡胶组合物
公开(公告)号：US6063487A
公开(公告)日：2000-05-16
申请号：US17317
申请日：1998-02-02
CPC分类号： H01B3/46 , C08K3/22 , C08K3/36 , C08L83/04 , C08G77/12 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/70 , Y10T428/252 , Y10T428/256 , Y10T428/259 , Y10T428/31663 , Y10T428/31667
摘要： A silicone rubber composition comprising (A) 100 parts by weight of an organopolysiloxane composition of the organic peroxide or addition curing type, (B) 1-100 parts by weight of finely divided silica, and (C) 30-500 parts by weight of aluminum hydroxide is suitable for use as a high-voltage electrical insulator. The aluminum hydroxide (C) has a water-soluble sodium ion content of up to 0.01% by weight and exhibits pH 6.5-8.0 and an electrical conductivity of up to 50 .mu.s/cm when measured as a 30 wt % water slurry and preferably has been treated to be hydrophobic. The composition cures into a silicone rubber having improved high-voltage electrical insulating properties even under rigorous conditions.
摘要翻译： 一种硅橡胶组合物，其包含（A）100重量份的有机过氧化物或加成固化型的有机聚硅氧烷组合物，（B）1-100重量份的细分二氧化硅，和（C）30-500重量份的 氢氧化铝适合用作高压电绝缘体。 氢氧化铝（C）的水溶性钠离子含量高达0.01重量％，当以30重量％的水浆测定时，其pH值为6.5-8.0，电导率高达50μs/ cm 2，优选 已被处理为疏水性。 组合物即使在严格条件下也固化成具有改进的高电压电绝缘性能的硅橡胶。
-
10.发明授权Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus 有权含有纤维的树脂基板，其上安装有半导体装置的密封基板，其上形成有半导体装置的密封晶片，半导体装置和半导体装置的制造方法公开(公告)号：US08823186B2
公开(公告)日：2014-09-02
申请号：US13301035
申请日：2011-11-21
申请人： Susumu Sekiguchi , Toshio Shiobara
发明人： Susumu Sekiguchi , Toshio Shiobara
IPC分类号： H01L23/29
CPC分类号： H01L21/561 , H01L21/568 , H01L23/293 , H01L24/97 , H01L2924/10253 , H01L2924/15788 , H01L2924/181 , Y10T442/2041 , H01L2924/00
摘要： A fiber-containing resin substrate for collectively sealing a semiconductor devices mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor devices forming surface of a wafer having semiconductor devices formed thereon, includes: a resin-impregnated fiber base material obtained by impregnating a fiber base material with a thermosetting resin and semi-curing or curing the thermosetting resin; and an uncured resin layer containing an uncured thermosetting resin and formed on one side of the resin-impregnated fiber base material. There can be a fiber-containing resin substrate that enables suppressing warp of a wafer and delamination of semiconductor devices even though a large-diameter wafer or a large-diameter substrate made of a metal and the like is sealed, enables collectively sealing a semiconductor devices mounting surface of the substrate or a semiconductor devices forming surface of the wafer, and has excellent heat resistance or moisture resistance after sealing.
摘要翻译： 用于共同密封其上安装有半导体器件的基板的半导体器件安装表面或形成有半导体器件的形成表面的半导体器件的含纤维树脂基板包括：通过浸渍获得的树脂浸渍的纤维基材 具有热固性树脂并半固化或固化所述热固性树脂的纤维基材; 以及未固化的树脂层，其含有未固化的热固性树脂，并且在树脂浸渍的纤维基材的一侧上形成。 即使由金属等制成的大直径晶片或大直径基板被密封，也可以是能够抑制晶片翘曲和半导体器件分层的含纤维树脂基板，能够集中地密封半导体器件 衬底的安装表面或形成晶片表面的半导体器件，并且在密封后具有优异的耐热性或耐湿性。
-
-
-
-
-
-
-
-
-
搜索结果
17 条记录 (耗时 0.021 秒)
