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公开(公告)号：US20100207057A1
公开(公告)日：2010-08-19
申请号：US12733309
申请日：2008-08-25
申请人： Hiroshi Nitta , Yoshiyuki Matsumura
发明人： Hiroshi Nitta , Yoshiyuki Matsumura
IPC分类号： C09K13/00
CPC分类号： H01L21/3212 , C09G1/02
摘要： An object of one embodiment of the present invention is to provide a polishing composition which suppresses generation of recessing and dishing and includes a higher polishing rate. The polishing composition of an embodiment of the invention is a polishing composition suitable for a metal film, particularly a copper (CU) film, and contains ammonia, hydrogen peroxide, an amino acid and an anionic surfactant, the remainder being water. By containing those, the polishing composition can suppress generation of recessing and dishing when particularly used in the second step polishing.
摘要翻译： 本发明的一个实施方案的目的是提供一种抑制凹陷和凹陷的产生的抛光组合物，并且包括更高的抛光速率。 本发明的实施方案的抛光组合物是适用于金属膜，特别是铜（CU）膜，并含有氨，过氧化氢，氨基酸和阴离子表面活性剂的抛光组合物，其余为水。 通过包含这些，抛光组合物可以抑制在第二阶段抛光中特别使用的凹陷和凹陷的产生。
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公开(公告)号：US20100155655A1
公开(公告)日：2010-06-24
申请号：US12452798
申请日：2008-07-24
申请人： Yoshiyuki Matsumura , Hiroshi Nitta
发明人： Yoshiyuki Matsumura , Hiroshi Nitta
IPC分类号： C09K13/00
CPC分类号： C09G1/02 , C23F3/04 , H01L21/3212
摘要： An object of one embodiment of the present invention is to provide a polishing composition that can achieve high polishing rate and as well can improve flatness. A polishing composition of an embodiment of the invention is a polishing composition suitable for a metal film, in particular, a copper film, and contains a basic compound containing an ammonium group, alkylbenzene sulfonate having an alkyl group with carbon number of from 9 to 18, and hydrogen peroxide, the remainder being water. Ammonium hydroxide can be used as the basic compound, and dodecylbenzene sulfonate or the like can be used as the alykbenzene sulfonate.
摘要翻译： 本发明的一个实施方案的目的是提供一种可以实现高抛光速率并且还可以提高平坦度的抛光组合物。 本发明的实施方案的抛光组合物是适用于金属膜，特别是铜膜的抛光组合物，并且含有含有铵基团的碱性化合物，具有碳数为9至18的烷基的烷基苯磺酸盐 ，和过氧化氢，其余为水。 可以使用氢氧化铵作为碱性化合物，可以使用十二烷基苯磺酸盐等作为亚氨基苯磺酸盐。
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公开(公告)号：US20100207058A1
公开(公告)日：2010-08-19
申请号：US12733328
申请日：2008-08-25
申请人： Yoshiyuki Matsumura , Hiroshi Nitta
发明人： Yoshiyuki Matsumura , Hiroshi Nitta
IPC分类号： C09K13/00
CPC分类号： H01L21/3212 , C09G1/02
摘要： At least one embodiment of the invention provides a polishing composition that can achieve high polishing rate and as well can improve flatness. The polishing composition of at least one embodiment of the invention is a polishing composition suitable for a metal film, particularly a copper (Cu) film, and contains a basic compound containing an ammonium group, alkyl naphthalene sulfonate and hydrogen peroxide, the remainder being water. The pH of the polishing composition is within a range of 8 to 12. By containing those, a polishing composition that can achieve high polishing rate and improve flatness can be realized.
摘要翻译： 本发明的至少一个实施方案提供了可以实现高抛光速率并且还可以改善平坦度的抛光组合物。 本发明的至少一个实施方案的抛光组合物是适用于金属膜，特别是铜（Cu）膜的抛光组合物，并且含有含有铵基，萘基磺酸烷基酯和过氧化氢的碱性化合物，其余为水 。 抛光组合物的pH在8〜12的范围内。通过包含这些可以实现能够实现高抛光速度并提高平坦度的抛光组合物。
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公开(公告)号：US20090278080A1
公开(公告)日：2009-11-12
申请号：US11794626
申请日：2006-01-05
申请人： Yoshiharu Ohta , Rika Tanaka , Hiroshi Nitta , Yoshitaka Morioka
发明人： Yoshiharu Ohta , Rika Tanaka , Hiroshi Nitta , Yoshitaka Morioka
IPC分类号： C09K13/00
CPC分类号： C09K3/1463 , C09G1/02 , C23F3/06 , H01L21/30625 , H01L21/31053 , H01L21/3212
摘要： An object of one embodiment of the present invention is to provide a polishing slurry which can reduce dishing and erosion of a to-be-polished semiconductor wafer. The polishing slurry contains an oxidizing agent and two or more kinds of abrasive grains for polishing, i.e., fumed silica and colloidal silica. A ratio (selectivity ratio) between a polishing rate of a metal film such as a tungsten film and a polishing rate of an insulating film (oxide film) such as a SiO2 film can be adjusted by changing a mixing ratio between fumed silica and colloidal silica, and dishing and erosion of the semiconductor wafer can be thus reduced.
摘要翻译： 本发明的一个实施方案的目的是提供一种能够减少被抛光的半导体晶片的凹陷和侵蚀的抛光浆料。 抛光浆料含有氧化剂和两种或更多种用于抛光的磨料颗粒，即煅制二氧化硅和胶体二氧化硅。 可以通过改变煅制二氧化硅和胶态二氧化硅之间的混合比来调节诸如钨膜的金属膜的研磨速率与诸如SiO 2膜的绝缘膜（氧化物膜）的研磨速率之间的比率（选择比） ，因此可以减少半导体晶片的凹陷和侵蚀。
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公开(公告)号：US06581817B2
公开(公告)日：2003-06-24
申请号：US10048048
申请日：2002-01-23
IPC分类号： B23K3102
CPC分类号： H01L21/67144 , H01L21/67121 , Y10T156/17
摘要： A die bonding device for installing electronic components S on a metal stem, comprising a bonding nozzle for suctioning an electronic component S and positioning the electronic component S on a component mounting face of the stem, a stem carrying head for carrying the stem, a heater section for heating the electronic component S while it is positioned on the component mounting face of the stem, and an imaging camera having a light axis L extending through the component mounting face of the stem when positioned inside the heater section, which performs reciprocating motion in the direction of the light axis L.
摘要翻译： 一种用于将电子部件S安装在金属杆上的芯片接合装置，包括用于吸引电子部件S并将电子部件S定位在杆的部件安装面上的接合喷嘴，用于承载杆的杆承载头，加热器 用于在电子部件S位于杆的部件安装面上时加热电子部件S的部分，以及成像摄像机，其具有在位于加热部内部时延伸穿过杆的部件安装面的光轴L，其进行往复运动 光轴的方向L.
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公开(公告)号：US08062548B2
公开(公告)日：2011-11-22
申请号：US11794626
申请日：2006-01-05
申请人： Yoshiharu Ohta , Rika Tanaka , Hiroshi Nitta , Yoshitaka Morioka
发明人： Yoshiharu Ohta , Rika Tanaka , Hiroshi Nitta , Yoshitaka Morioka
IPC分类号： C09K13/00
CPC分类号： C09K3/1463 , C09G1/02 , C23F3/06 , H01L21/30625 , H01L21/31053 , H01L21/3212
摘要： An object of one embodiment of the present invention is to provide a polishing slurry which can reduce dishing and erosion of a to-be-polished semiconductor wafer. The polishing slurry contains an oxidizing agent and two or more kinds of abrasive grains for polishing, i.e., fumed silica and colloidal silica. A ratio (selectivity ratio) between a polishing rate of a metal film such as a tungsten film and a polishing rate of an insulating film (oxide film) such as a SiO2 film can be adjusted by changing a mixing ratio between fumed silica and colloidal silica, and dishing and erosion of the semiconductor wafer can be thus reduced.
摘要翻译： 本发明的一个实施方案的目的是提供一种能够减少被抛光的半导体晶片的凹陷和侵蚀的抛光浆料。 抛光浆料含有氧化剂和两种或更多种用于抛光的磨料颗粒，即煅制二氧化硅和胶体二氧化硅。 可以通过改变煅制二氧化硅和胶态二氧化硅之间的混合比来调节诸如钨膜的金属膜的研磨速率与诸如SiO 2膜的绝缘膜（氧化物膜）的研磨速率之间的比率（选择比） ，因此可以减少半导体晶片的凹陷和侵蚀。
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公开(公告)号：US4814790A
公开(公告)日：1989-03-21
申请号：US160131
申请日：1988-02-25
申请人： Hiroshi Nitta
发明人： Hiroshi Nitta
CPC分类号： B41J2/3555 , B41J2/355 , H04N1/502
摘要： A dual mode thermal printer has two modes of operation, i.e., a multi-color recording mode and a monochromatic recording mode. The thermal printer includes a thermal printhead provided with a plurality of resistor elements which are functionally divided into a plurality of blocks, each preferably having the same number of resistor elements. During the multi-color recording mode, the plurality of resistor elements are activated in accordance with image data on a block-by-block basis; whereas, during the monochromatic recording mode, at least two blocks of the plurality of resistor elements are activated at the same time.
摘要翻译： 双模热敏打印机具有两种操作模式，即多色记录模式和单色记录模式。 热敏打印机包括设置有多个电阻元件的热敏打印头，其功能上被划分为多个块，每个块优选地具有相同数量的电阻元件。 在多色记录模式期间，根据图像数据逐块地激活多个电阻元件; 而在单色记录模式期间，多个电阻元件中的至少两个块同时被激活。
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公开(公告)号：US20050244919A1
公开(公告)日：2005-11-03
申请号：US10503617
申请日：2003-02-18
申请人： Kiyoshi Abe , Hiroshi Nitta , Enoch Park , Hua Ming , Eun Jung
发明人： Kiyoshi Abe , Hiroshi Nitta , Enoch Park , Hua Ming , Eun Jung
摘要： A method of producing riboflavin by culturing riboflavin-producing microbes in a culture ground using a plant oil or an animal oil as a carbon source, forming and accumulating riboflavin therein and collecting riboflavin therefrom, wherein a carrier of a clay mineral having oil-adsorbing property, a chemically treated product thereof or a calcium compound is made present in the culture ground. The riboflavin is produced maintaining a high yield and at an increased production rate at a low cost without requiring cumbersome operations for concentrating and recovering the riboflavin. It is further allowed to recover the riboflavin by effectively utilizing the waste plant oil or the waste animal oil that is to be disposed of.
摘要翻译： 一种利用植物油或动物油作为碳源在培养基中培养生成核黄素的微生物生成核黄素的方法，在其中形成并积聚核黄素并从中收集核黄素，其中，具有吸油性的粘土矿物的载体 ，其化学处理产物或钙化合物存在于培养基中。 生产的核黄素以较低的成本保持高产率和高生产率，而不需要繁琐的操作来浓缩和回收核黄素。 还可以通过有效利用废弃植物油或废弃的动物油来回收核黄素。
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公开(公告)号：US20050084941A1
公开(公告)日：2005-04-21
申请号：US10477230
申请日：2003-02-28
申请人： Kiyoshi Abe , Hiroshi Nitta , Y. Enoch , Ana Vanessa lara Pizarro
发明人： Kiyoshi Abe , Hiroshi Nitta , Y. Enoch , Ana Vanessa lara Pizarro
摘要： A method of producing bio-fuels by causing an enzyme to act on the oils and fats in a waste clay to decompose them into a fatty acid which is then reacted with a lower alcohol to form an ester that can be used as a bio-fuel. An environment friendly bio-fuel is obtained from the starting waste clay through a decreased number of steps without requiring cumbersome operations.
摘要翻译： 通过使酶对废粘土中的油和脂肪起作用以分解成脂肪酸，然后与低级醇反应形成可用作生物燃料的酯来生产生物燃料的方法 。 通过减少数量的步骤从起始的废土获得环境友好的生物燃料，而不需要繁琐的操作。
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公开(公告)号：US11383905B2
公开(公告)日：2022-07-12
申请号：US16843177
申请日：2020-04-08
申请人： Yoshiteru Hagiwara , Hiroshi Nitta , Tomoo Asami , Tetsuya Yano , Toshiharu Kawase , Kohhei Nagasawa
发明人： Yoshiteru Hagiwara , Hiroshi Nitta , Tomoo Asami , Tetsuya Yano , Toshiharu Kawase , Kohhei Nagasawa
摘要： A binding band includes a band portion, a through opening, a locking portion, a connecting portion, and an index portion. The band portion includes a plurality of locking teeth on one surface of the band portion. The band portion is to be inserted through the through opening. The through opening is disposed on one end of the band portion in a longitudinal direction of the band portion. The locking portion includes a tooth pawl configured to lock the locking teeth when the band portion is inserted through the through opening. The connecting portion protrudes from the locking portion in a direction intersecting the longitudinal direction of the band portion. The index portion is disposed on the connecting portion.
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