利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

11 条记录 (耗时 0.037 秒)

    Method of manufacturing solid state imaging device, and solid state imaging device
    3.
    发明授权
    Method of manufacturing solid state imaging device, and solid state imaging device 失效
    固态成像装置的制造方法以及固态成像装置

    公开(公告)号：US08603852B2

    公开(公告)日：2013-12-10

    申请号：US12792355

    申请日：2010-06-02

    申请人： Yoshinori Toumiya ,  Ina Hori ,  Tadayuki Dofuku ,  Hitomi Kamiya ,  Atsushi Yamamoto ,  Taichi Natori

    发明人： Yoshinori Toumiya ,  Ina Hori ,  Tadayuki Dofuku ,  Hitomi Kamiya ,  Atsushi Yamamoto ,  Taichi Natori

    IPC分类号： H01L21/302

    CPC分类号： H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/148

    摘要： Disclosed herein is a method of manufacturing a solid state imaging device, including the steps of: forming a light receiving portion in a light receiving area of a semiconductor substrate; forming a pad portion in a pad area of the semiconductor substrate; forming a microlens material layer over the light receiving portion and the pad portion; providing the microlens material layer with a microlens corresponding to the light receiving portion; forming a low-reflection material layer on the microlens material layer; etching the microlens material layer and the low-reflection material layer over the pad portion to form an opening; and imparting hydrophilicity to a surface of the low-reflection material layer and an inside portion of the opening by a normal temperature oxygen radical treatment.

    摘要翻译： 本文公开了一种制造固态成像装置的方法，包括以下步骤：在半导体衬底的光接收区域中形成光接收部分; 在所述半导体衬底的焊盘区域中形成焊盘部分; 在所述光接收部分和所述焊盘部分上形成微透镜材料层; 向所述微透镜材料层提供对应于所述光接收部分的微透镜; 在微透镜材料层上形成低反射材料层; 在所述焊盘部分上蚀刻所述微透镜材料层和所述低反射材料层以形成开口; 并通过常温氧自由基处理赋予低反射材料层的表面和开口的内部亲水性。

    METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE, AND SOLID STATE IMAGING DEVICE
    4.
    发明申请
    METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE, AND SOLID STATE IMAGING DEVICE 失效
    制造固态成像装置的方法和固态成像装置

    公开(公告)号：US20100320554A1

    公开(公告)日：2010-12-23

    申请号：US12792355

    申请日：2010-06-02

    申请人： Yoshinori Toumiya ,  Ina Hori ,  Tadayuki Dofuku ,  Hitomi Kamiya ,  Atsushi Yamamoto ,  Taichi Natori

    发明人： Yoshinori Toumiya ,  Ina Hori ,  Tadayuki Dofuku ,  Hitomi Kamiya ,  Atsushi Yamamoto ,  Taichi Natori

    IPC分类号： H01L31/0232 ,  H01L31/18

    CPC分类号： H01L27/14627 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/148

    摘要： Disclosed herein is a method of manufacturing a solid state imaging device, including the steps of: forming a light receiving portion in a light receiving area of a semiconductor substrate; forming a pad portion in a pad area of the semiconductor substrate; forming a microlens material layer over the light receiving portion and the pad portion; providing the microlens material layer with a microlens corresponding to the light receiving portion; forming a low-reflection material layer on the microlens material layer; etching the microlens material layer and the low-reflection material layer over the pad portion to form an opening; and imparting hydrophilicity to a surface of the low-reflection material layer and an inside portion of the opening by a normal temperature oxygen radical treatment.

    摘要翻译： 本文公开了一种制造固态成像装置的方法，包括以下步骤：在半导体衬底的光接收区域中形成光接收部分; 在所述半导体衬底的焊盘区域中形成焊盘部分; 在所述光接收部分和所述焊盘部分上形成微透镜材料层; 向所述微透镜材料层提供对应于所述光接收部分的微透镜; 在微透镜材料层上形成低反射材料层; 在所述焊盘部分上蚀刻所述微透镜材料层和所述低反射材料层以形成开口; 并通过常温氧自由基处理赋予低反射材料层的表面和开口的内部亲水性。

    Method for producing solid-state imaging device, solid-state imaging device, and camera
    6.
    发明申请
    Method for producing solid-state imaging device, solid-state imaging device, and camera 有权
    固态成像装置，固态成像装置以及相机的制造方法

    公开(公告)号：US20060166389A1

    公开(公告)日：2006-07-27

    申请号：US11331252

    申请日：2006-01-12

    申请人： Hiroyuki Miyamoto ,  Tadayuki Dofuku

    发明人： Hiroyuki Miyamoto ,  Tadayuki Dofuku

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14818 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14837

    摘要： To provide a method for producing a solid-state imaging device enabling an improvement of a light sensitivity characteristic in a light receiving unit, a solid-state imaging device in which the light sensitivity characteristic is improved, and a camera provided with the solid-state imaging device. A shield film projected around the light receiving unit is formed on a substrate in which the light receiving unit is formed; an transparent insulation film is formed on the shield film; a sidewall insulation film is formed by etch-back of the insulation film, in a side wall of the shield film; a mask layer having an aperture at a position corresponding to the light receiving unit is formed on the shield film; and the shield film is etched by using the sidewall insulation film and the mask layer as a mask to form an aperture portion exposing the light receiving unit.

    摘要翻译： 为了提供一种制造能够提高光接收单元中的光敏特性的固态成像装置的方法，提高了光敏特性的固态成像装置和设置有固态的照相机 成像装置。 在形成有光接收单元的基板上形成有围绕光接收单元投影的屏蔽膜， 在屏蔽膜上形成透明绝缘膜; 通过在屏蔽膜的侧壁中的绝缘膜的回蚀而形成侧壁绝缘膜; 在屏蔽膜上形成有在与光接收单元对应的位置处具有孔径的掩模层; 并且通过使用侧壁绝缘膜和掩模层作为掩模来蚀刻屏蔽膜，以形成露出光接收单元的孔部分。

    Method of manufacturing solid state imaging device, solid state imaging device, and camera using solid state imaging device
    9.
    发明授权
    Method of manufacturing solid state imaging device, solid state imaging device, and camera using solid state imaging device 失效
    使用固态成像装置制造固态成像装置，固态成像装置和照相机的方法

    公开(公告)号：US07999291B2

    公开(公告)日：2011-08-16

    申请号：US11511643

    申请日：2006-08-29

    申请人： Takeshi Takeda ,  Tadayuki Dofuku ,  Kenji Takeo

    发明人： Takeshi Takeda ,  Tadayuki Dofuku ,  Kenji Takeo

    IPC分类号： H01L27/148

    CPC分类号： C23F1/02 ,  H01L27/14623 ,  H01L27/14685 ,  H01L27/14812

    摘要： A method of manufacturing a solid state imaging device having a photo-electric conversion portion array and a transfer electrode array, these arrays being provided in parallel to each other, upper surfaces and side wall surfaces of the transfer electrode array being covered with a light-shielding layer, and a transparent layer showing an oxidizing property at the time of film formation, the transparent layer being formed on the photo-electric conversion parts and the light-shielding layer.

    摘要翻译： 一种制造具有光电转换部分阵列和转印电极阵列的固态成像装置的方法，这些阵列彼此平行地设置，转印电极阵列的上表面和侧壁表面被发光元件覆盖， 屏蔽层，以及在成膜时显示氧化性的透明层，透明层形成在光电转换部分和遮光层上。

    Solid-state imaging device having improved light sensitivity and a method for producing the same
    10.
    发明授权
    Solid-state imaging device having improved light sensitivity and a method for producing the same 有权
    具有改善的光敏度的固态成像装置及其制造方法

    公开(公告)号：US07929036B2

    公开(公告)日：2011-04-19

    申请号：US11331252

    申请日：2006-01-12

    申请人： Hiroyuki Miyamoto ,  Tadayuki Dofuku

    发明人： Hiroyuki Miyamoto ,  Tadayuki Dofuku

    IPC分类号： H04N5/335

    CPC分类号： H01L27/14818 ,  H01L27/1462 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14837

    摘要： To provide a method for producing a solid-state imaging device enabling an improvement of a light sensitivity characteristic in a light receiving unit, a solid-state imaging device in which the light sensitivity characteristic is improved, and a camera provided with the solid-state imaging device. A shield film projected around the light receiving unit is formed on a substrate in which the light receiving unit is formed; an transparent insulation film is formed on the shield film; a sidewall insulation film is formed by etch-back of the insulation film, in a side wall of the shield film; a mask layer having an aperture at a position corresponding to the light receiving unit is formed on the shield film; and the shield film is etched by using the sidewall insulation film and the mask layer as a mask to form an aperture portion exposing the light receiving unit.

    摘要翻译： 为了提供一种制造能够提高光接收单元中的光敏特性的固态成像装置的方法，提高了光敏特性的固态成像装置和设置有固态的照相机 成像装置。 在形成有光接收单元的基板上形成有围绕光接收单元投影的屏蔽膜， 在屏蔽膜上形成透明绝缘膜; 通过在屏蔽膜的侧壁中的绝缘膜的回蚀而形成侧壁绝缘膜; 在屏蔽膜上形成有在与光接收单元对应的位置处具有孔径的掩模层; 并且通过使用侧壁绝缘膜和掩模层作为掩模来蚀刻屏蔽膜，以形成露出光接收单元的孔部分。