公开(公告)号：US5916683A

公开(公告)日：1999-06-29

申请号：US964417

申请日：1997-11-04

申请人： Youichi Ueda ,  Yasuhiro Endo ,  Mitsuhiro Shibata ,  Kaori Yamasaki

发明人： Youichi Ueda ,  Yasuhiro Endo ,  Mitsuhiro Shibata ,  Kaori Yamasaki

IPC分类号： C07C69/017 ,  C07D311/60 ,  C08G59/06 ,  C08G59/22 ,  C08G59/38 ,  C08G59/42 ,  H01L23/498 ,  H01P1/04 ,  H01P1/383 ,  H01P3/16 ,  H05K1/03 ,  B32B15/08 ,  B32B27/04 ,  C08G59/62

CPC分类号： H01P1/04 ,  C07C69/017 ,  C07D311/60 ,  C08G59/066 ,  C08G59/226 ,  C08G59/38 ,  C08G59/4223 ,  C08G59/4238 ,  H01L23/49894 ,  H01P1/383 ,  H01P3/16 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0326 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T442/3415

摘要： A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.

摘要翻译： 公开了通过热成型预浸料和铜箔获得的覆铜层压板。 如所公开的，预浸料（未固化）包括浸渍有环氧树脂，芳基酯化合物和固化剂的基材。 覆铜层压板具有低介电常数和低介电损耗角正切。 适用于高速运行的多层印刷电路板，尤其适用于高频区域。

公开(公告)号：US06469109B2

公开(公告)日：2002-10-22

申请号：US08885191

申请日：1997-06-30

申请人： Youichi Ueda ,  Yasuhiro Endo ,  Mitsuhiro Shibata ,  Kaori Yamasaki

发明人： Youichi Ueda ,  Yasuhiro Endo ,  Mitsuhiro Shibata ,  Kaori Yamasaki

IPC分类号： C08G802

CPC分类号： H01P1/04 ,  C07C69/017 ,  C07D311/60 ,  C08G59/066 ,  C08G59/226 ,  C08G59/38 ,  C08G59/4223 ,  C08G59/4238 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/383 ,  H01P3/16 ,  H05K1/0326 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T442/3415 ,  H01L2924/00

摘要： An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure accelerator. When cured, the resulting product has low dielectric constant and a low dielectric loss tangent. A copper-clad laminate formed using the described composition has a low dielectric constant and a low dielectric loss tangent. The copper-clad laminate exhibits excellent adhesiveness characteristics and is suitable for use in multilayer printed wiring boards in high speed operations, particularly in the high frequency region.

摘要翻译： 公开了一种环氧树脂组合物，其包含环氧树脂，由式（4）表示的多元酚与由通式（2）表示的羰基化合物和固化促进剂得到的芳基酯化合物。 当固化时，所得产品具有低介电常数和低介电损耗角正切。 使用所述组合物形成的覆铜层压板具有低介电常数和低介电损耗角正切。 覆铜层压板表现出优异的粘附特性，适用于高速操作的多层印刷电路板，特别是在高频区域。

公开(公告)号：US5726257A

公开(公告)日：1998-03-10

申请号：US520110

申请日：1995-08-28

申请人： Youichi Ueda ,  Yasuhiro Endo ,  Mitsuhiro Shibata ,  Kaori Yamasaki

发明人： Youichi Ueda ,  Yasuhiro Endo ,  Mitsuhiro Shibata ,  Kaori Yamasaki

IPC分类号： C07C69/017 ,  C07D311/60 ,  C08G59/06 ,  C08G59/22 ,  C08G59/38 ,  C08G59/42 ,  H01L23/498 ,  H01P1/04 ,  H01P1/383 ,  H01P3/16 ,  H05K1/03 ,  C08G8/02 ,  C08G8/04 ,  C08G8/22

CPC分类号： H01P1/04 ,  C07C69/017 ,  C07D311/60 ,  C08G59/066 ,  C08G59/226 ,  C08G59/38 ,  C08G59/4223 ,  C08G59/4238 ,  H01L23/49894 ,  H01P1/383 ,  H01P3/16 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0326 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T442/3415

摘要： An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: ##STR1## with a carbonyl compound represented by the general formula: ##STR2## which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.

摘要翻译： 由多元酚组成的芳基酯化合物，其中至少一个OH基已被有机酸或其具有1至20个碳原子的衍生物酯化，所述多元酚是由以下通式表示的酚类化合物的缩合产物： 当用作环氧树脂的固化剂时，芳基酯化合物可以产生具有低介电常数和低介电损耗角正切的固化产物的通式为：[IMAGE]的羰基化合物; 环氧树脂组合物，其包含环氧树脂，所述芳基酯化合物和固化促进剂作为必要成分; 和使用该环氧树脂组合物的覆铜层压板。 覆铜层压板具有低介电常数和低介电损耗角正切，并且与常规的相比具有优异的粘附性，因此适用于高速操作的多层印刷电路板，特别是在高频区域。

公开(公告)号：US5399715A

公开(公告)日：1995-03-21

申请号：US066099

申请日：1993-06-02

申请人： Shigeki Naitoh ,  Yasuhiro Endo ,  Youichi Ueda ,  Kunimasa Kamio

发明人： Shigeki Naitoh ,  Yasuhiro Endo ,  Youichi Ueda ,  Kunimasa Kamio

IPC分类号： C07C209/60 ,  C07C211/50 ,  C07D207/44 ,  C07D207/452 ,  C08F8/30 ,  C08F8/48 ,  H05K1/03 ,  C07D207/24

CPC分类号： C07D207/452 ,  C07C209/60 ,  C07C211/50 ,  C08F8/30 ,  C08F8/48 ,  C07C2102/08 ,  H05K1/0346

摘要： The polyamino oligomers of this invention are obtained by reacting diisopropenylbenzenes or bis(.alpha.-hydroxyisopropyl)benzenes and anilines in the presence of an acid catalyst and characterized by the recurring unit having an indane skeleton. These polyamino oligomers can be used as curing agent for laminate resins. Also, they can be reacted with maleic anhydride to prepare polymaleimide compounds of this invention.The polymaleimide compounds of this invention are low in melting point (or softening point) and, in combination with a substance producing three-dimensional crosslinkage such as triallyl isocyanurate, aromatic diamine, etc., can provide thermosetting resin compositions suited for producing copper-clad laminates. The copper-clad laminates obtained from the thermosetting resin compositions of this invention are low in dielectric constant, heat-resistant and also low in water absorptivity, so that they are useful for multi-layer printed boards.

摘要翻译： PCT No.PCT / JP92 / 01030 Sec。 371日期：1993年6月2日 102（e）日期1993年6月2日PCT提交1992年8月12日PCT公布。 公开号WO93 / 12933 日本7月8日，1993年。本发明的聚氨基低聚物是通过在酸催化剂存在下使二异丙烯基苯或双（α-羟基异丙基）苯和苯胺反应获得的，其特征在于具有二氢茚骨架的重复单元。 这些聚氨基低聚物可以用作层压树脂的固化剂。 此外，它们可以与马来酸酐反应以制备本发明的聚马来酰亚胺化合物。 本发明的聚马来酰亚胺化合物的熔点（或软化点）低，并且与产生三维交联的物质如三烯丙基异氰脲酸酯，芳族二胺等组合可以提供适用于生产铜包覆的热固性树脂组合物 层压板。 由本发明的热固性树脂组合物获得的覆铜层压板的介电常数，耐热性和吸水性也低，因此它们可用于多层印刷板。

公开(公告)号：US5750789A

公开(公告)日：1998-05-12

申请号：US536281

申请日：1995-09-29

申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C07C211/54

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

公开(公告)号：US6037438A

公开(公告)日：2000-03-14

申请号：US575011

申请日：1995-12-19

申请人： Yasuhiro Endo ,  Yoichi Ueda ,  Toshiaki Hayashi ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Shinichiro Kitayama ,  Hisashi Watabu

发明人： Yasuhiro Endo ,  Yoichi Ueda ,  Toshiaki Hayashi ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Shinichiro Kitayama ,  Hisashi Watabu

IPC分类号： C08G59/40 ,  C08G73/06 ,  C08G73/12 ,  H05K1/03 ,  C08G73/00

CPC分类号： C08G73/0655 ,  C08G59/4007 ,  C08G59/4014 ,  C08G73/12 ,  C08G73/124 ,  H05K1/0346

摘要： A cyanate resin composition comprising as essential components a cyanate compound represented by formula (1) or its prepolymer and a curing agent: ##STR1## wherein each of R.sub.1 and R.sub.2 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; A represents an alkyl group having 1 to 3 carbon atoms; i represents an integer of 0 to 3 alone or together with a brominated epoxy compound or a maleimide compound or its prepolymer, said cyanate resin composition giving a cured product having a low-dielectric constant, and a copper-clad laminate composed of a prepreg of said cyanate resin composition and a copper foil.

摘要翻译： 一种氰酸酯树脂组合物，其包含作为必要成分的由式（1）表示的氰酸酯化合物或其预聚物和固化剂：其中R 1和R 2各自表示氢原子或具有1至5个碳原子的烷基; A表示碳原子数1〜3的烷基， i表示0〜3的整数，或与溴化环氧化合物或马来酰亚胺化合物或其预聚物一起，所述氰酸酯树脂组合物得到低介电常数的固化物，覆铜层压板由预浸料 所述氰酸酯树脂组合物和铜箔。

公开(公告)号：US5563237A

公开(公告)日：1996-10-08

申请号：US200884

申请日：1994-02-23

申请人： Yasuhiro Endo ,  Yoichi Ueda ,  Toshiaki Hayashi ,  Mitsuhiro Shibata ,  Shinichiro Kitayama ,  Shuichi Kanagawa ,  Hisashi Watabu

发明人： Yasuhiro Endo ,  Yoichi Ueda ,  Toshiaki Hayashi ,  Mitsuhiro Shibata ,  Shinichiro Kitayama ,  Shuichi Kanagawa ,  Hisashi Watabu

IPC分类号： C08G59/40 ,  C08G73/02 ,  C08G73/06 ,  H05K1/03

CPC分类号： C08G73/0655 ,  C08G59/4014 ,  C08G73/02 ,  C08G73/024 ,  H05K1/0346 ,  Y10T428/31678

摘要： A cyanate resin composition suitable for a copper-clad laminate comprises components (A) and (B).(A) a cyanate compound of the formula: ##STR1## wherein R and Q each represents halogen, C.sub.1-10 alkyl, C.sub.5-7 cycloalkyl or C.sub.6-20 hydrocarbon; i and j each represents 0-4 and M is (2): ##STR2## wherein T represents halogen, C.sub.1-10 alkyl, C.sub.5-7 cycloalkyl or C.sub.6-20 hydrocarbon; k represents 0-10 and m represents 0-8, and(B) a hardener.

摘要翻译： 适用于覆铜层压板的氰酸酯树脂组合物包含组分（A）和（B）。 （A）下式的氰酸酯化合物：其中R和Q各自表示卤素，C 1-10烷基，C 5-7环烷​​基或C 6-20烃; i和j各自表示0-4且M为（2）：其中T表示卤素，C 1-10烷基，C 5-7环烷​​基或C 6-20烃; k表示0-10，m表示0-8，（B）硬化剂。

公开(公告)号：US5326881A

公开(公告)日：1994-07-05

申请号：US142578

申请日：1993-10-28

申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

公开(公告)号：US5498687A

公开(公告)日：1996-03-12

申请号：US411880

申请日：1995-03-28

申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C08G59/18

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含有4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

公开(公告)号：US5444165A

公开(公告)日：1995-08-22

申请号：US202068

申请日：1994-02-25

申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。