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    Organic metal complexes for forming metal thin layer, ink including the same and method for forming metal thin layer using the same
    1.
    发明申请
    Organic metal complexes for forming metal thin layer, ink including the same and method for forming metal thin layer using the same 审中-公开
    用于形成金属薄层的有机金属络合物，包含其的油墨以及使用其形成金属薄层的方法

    公开(公告)号：US20110151117A1

    公开(公告)日：2011-06-23

    申请号：US12805140

    申请日：2010-07-14

    申请人： Young Kwan Seo ,  Dong Hoon Kim ,  Kwi Jong Lee

    发明人： Young Kwan Seo ,  Dong Hoon Kim ,  Kwi Jong Lee

    IPC分类号： C09D11/02 ,  C07F1/10 ,  B05D3/02

    CPC分类号： C23C18/08 ,  C09D11/037 ,  C09D11/52

    摘要： There is provided organic metal complexes for forming a metal thin layer, ink including the same, and a method for forming a metal thin layer using the same: wherein the organic metal complexes for forming a metal thin layer include Ag, and a ligand represented by the specific general formula; the organic metal complexes have an excellent stability and solubility toward a solvent; and the ink for forming a metal thin layer comprising the organic metal complexes is easy to form a metal thin layer of, and could be applied on the substrate consisting of material having low thermal stability because the ink can be decomposed at a low temperature.

    摘要翻译： 提供了用于形成金属薄层的有机金属络合物，包含该金属薄层的油墨以及使用其形成金属薄层的方法，其中用于形成金属薄层的有机金属络合物包括Ag和由 具体通用公式; 有机金属络合物对溶剂具有优异的稳定性和溶解性; 并且用于形成包含有机金属络合物的金属薄层的油墨易于形成金属薄层，并且可以施加在由具有低热稳定性的材料组成的基材上，因为油墨可以在低温下分解。

    Ink composition, metal thin film prepared using the same and method of preparing the same
    2.
    发明申请
    Ink composition, metal thin film prepared using the same and method of preparing the same 审中-公开
    油墨组合物，使用其制备的金属薄膜及其制备方法

    公开(公告)号：US20110236646A1

    公开(公告)日：2011-09-29

    申请号：US12926141

    申请日：2010-10-27

    申请人： Young Kwan Seo ,  Kwi Jong Lee ,  Dong Hoon Kim

    发明人： Young Kwan Seo ,  Kwi Jong Lee ,  Dong Hoon Kim

    IPC分类号： C09D11/02 ,  C07F1/12 ,  B32B3/10 ,  B05D5/12

    CPC分类号： C23C18/08 ,  C09D11/03 ,  C09D11/38 ,  Y10T428/24802

    摘要： There are provided an ink composition, a metal thin film prepared using the same, and a method of preparing the same. The ink composition according to the present invention includes: gold-containing complex compound represented by the following Formula 1 (L and L′ are at least one selected from a group consisting of diolefin and derivatives thereof, and X is at least one selected from a group consisting of chlorine (Cl), bromine (Br), and iodine (I), where m=an integer of 1˜10, n=an integer of 1˜10, o=an integer of 0˜10, and p=an integer of 0˜10); and a solvent dispersing the gold-containing complex compound. AumLnL′oXp  Formula 1 The present invention can provide ink composition that can be sintered at low temperature by being optionally printed, a metal thin film prepared using the same, and a method of preparing the same.

    摘要翻译： 提供了一种油墨组合物，使用该组合物制备的金属薄膜及其制备方法。 根据本发明的油墨组合物包括：由下式1表示的含金络合物（L和L'是选自由二烯烃及其衍生物组成的组中的至少一种，X是选自 由氯（Cl），溴（Br）和碘（I）组成的组，其中m = 1〜10的整数，n = 1〜10的整数，o = 0〜10的整数，p = 0〜10的整数）; 和分散含金络合物的溶剂。 AumLnL'oXp式1本发明可以提供可以通过任选印刷在低温下烧结的油墨组合物，使用其制备的金属薄膜及其制备方法。

    BUILD-UP PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    BUILD-UP PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
    建立印刷电路板及其制造方法

    公开(公告)号：US20130133926A1

    公开(公告)日：2013-05-30

    申请号：US13409067

    申请日：2012-02-29

    申请人： Tae Hoon Kim ,  Young Kwan Seo ,  Jun Young Kim ,  Sung Nam Cho

    发明人： Tae Hoon Kim ,  Young Kwan Seo ,  Jun Young Kim ,  Sung Nam Cho

    IPC分类号： H05K1/00 ,  H05K3/46 ,  C25D5/02 ,  H05K3/00

    CPC分类号： C25D5/026 ,  C23C18/1653 ,  C23C18/2066 ,  C25D3/38 ,  C25D5/56 ,  H05K3/381 ,  H05K3/4602 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2203/1366

    摘要： Disclosed herein is a method of manufacturing a build-up printed circuit board (PCB), the method including: providing a first resin substrate; forming a roughness by coating an epoxy emulsion solution on a surface of the first resin substrate; and providing a core layer by forming a core circuit layer on the first resin substrate on which the roughness is formed. According to the present invention, roughness of a substrate can be formed in an environment-friendly and economical way by introducing a process of coating epoxy emulsion on a resin substrate. Further, a highly reliable fine circuit can be implemented by enhancing an adhesive bond between a build-up board material and a metal circuit layer.

    摘要翻译： 本文公开了一种制造积聚印刷电路板（PCB）的方法，所述方法包括：提供第一树脂基板; 通过在第一树脂基板的表面上涂布环氧乳液来形成粗糙度; 以及通过在其上形成有粗糙度的第一树脂基板上形成芯线电路层来提供芯层。 根据本发明，通过在树脂基板上引入涂布环氧乳液的工序，能够以环保且经济的方式形成基板的粗糙度。 此外，可以通过增强积层板材料和金属电路层之间的粘合剂结合来实现高可靠性的精细电路。